Microstructural Characteristics and Mechanical Behavior of Particle-Reinforced Copper-Based Composites
A special issue of Metals (ISSN 2075-4701).
Deadline for manuscript submissions: 15 February 2025 | Viewed by 98
Special Issue Editor
Interests: control of microstructure and properties of high-strength and high-conductivity copper alloys; preparation and characterization of microstructure and properties of high-performance metal matrix composites; research and development of copper materials for new energy applications
Special Issue Information
Dear Colleagues,
Particle-reinforced copper-based composites combine the electrical and thermal conductivity of copper with the hardness and wear resistance of reinforcement phases, presenting important application value in such fields as transportation, electronic information, aerospace, and energy engineering. The scope for this Special Issue includes the innovative preparation method, especially that with advantages of high efficiency and low cost. Particular attention should be paid to microstructure and interface characteristics, which have a decisive influence on the final properties of the material.
In this Special Issue, we welcome articles that focus on material preparation methods and their influence on the microstructure and comprehensive performance. Effective microstructure control remains of high interest, containing not only a traditional uniform structure, but also composites with nonuniform architectures, such as hierarchical, harmonic, laminate, and co-continuous structures.
Dr. Jianbo Zhang
Guest Editor
Manuscript Submission Information
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Keywords
- copper
- metal matrix composites
- microstructures
- interface
- reinforcement
- microstructural architecture
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