Research on Green and Environmentally Friendly Lead-Free Solder and Advanced Interconnect Technology in Electronic Packaging
A special issue of Metals (ISSN 2075-4701). This special issue belongs to the section "Welding and Joining".
Deadline for manuscript submissions: closed (30 July 2024) | Viewed by 754
Special Issue Editor
Interests: intermetallic compounds; reliabiliy; surface coating; electromigration; solder; thermoelectric generator; stacking packaging; through silicon via; interfacial diffusion
Special Issue Information
Dear Colleagues,
In the process of connecting microelectronics, the industry not only needs to prohibit the doping of harmful elements from the source, but also ensure the reliability of the connection. This requires researchers to propose new strategies in terms of connection technology, materials and structural design. Since the end of the 1990s, many researchers have attempted to improve the reliability of tin-based solder and to regulate the properties of intermetallic compounds to weaken the brittle tendency of solder joints, whether they are from the solder itself, the interface coating or external conditions. In addition, the reuse of solid waste resources of electronic products is also a new theme of green connection, and the design of electronic products should also consider the convenience of recycling. Methods of recovering valuable rare elements from electronic products is also an important issue.
Prof. Dr. Limin Ma
Guest Editor
Manuscript Submission Information
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Keywords
- intermetallic compounds
- microelectronics connection
- reliability
- tin-based solder
- electronic solid waste
- recycling
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