Advanced Studies in Solder Joints

Dear Colleagues,

Solder joints have been the key structural component in advanced packaging. Following Moore's Law leading the development of chip technology gradually approaching the physical limit in recent years, the realization of "More than Moore" through advanced packaging technology has become the main developing direction of electronic manufacturing. Significant advances in solder joints have been achieved as a result of interdisciplinary research in related fields of materials characterization, mechanical property, microelectronics technology, physics and chemistry, constitutive modeling, mathematical analysis and numerical methods. On the other hand, also during this period, industries have shown a multitude of interests in developing and testing new solder materials or interconnecting technologies in various kinds of electronics manufacturing and packaging.

This Special Issue on “Advanced Studies in Solder Joints” intends to collect the latest developments in the field, written by well-known researchers who have contributed significantly on at least one of these specific topics - interfacial reaction mechanisms, microstructures and properties characterization, numerical modeling and simulations of solder joints in advanced electronic manufacturing and packaging.

Topics addressed in this Special Issue may include, but are not limited to:

• Interfacial reaction mechanisms;
• Innovation in solder material or jointing technology;
• Solder microstructure and properties;
• Interconnecting reliability and testing;
• Computational modeling and numerical simulation;
• Advanced electronic manufacturing and packaging.

Dr. Haoran Ma
Dr. Yi Zhong
Dr. Anil Kunwar
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.