Emerging Interconnection Technology and Pb-Free Solder Materials for Advanced Microelectronic Packaging

Dear Colleagues,

The evolution of microelectronic devices towards miniaturization, fast signal transmission, and multi-functionality undoubtedly encourages the development of novel, advanced, and reliable soldering materials. Sn-Pb solders have a long history of applications in electronics due to their superior wetting, melting, and satisfactory mechanical properties. However, due to the environmental concern and legislation, i.e., the Restriction of Hazardous Substances (RoHS), Waste Electrical and Electronic Equipment (WEEE), and End-of-Life Vehicles (ELV) directives across the globe, toxic Pb has been eliminated from electronic products. The issue of Pb-free soldering has triggered the research and development of advanced Pb-free solders in all areas of electronic materials research, including micro–nano joining, flexible electronics, etc., in the last few decades.

Recent advancements in high-density packaging and low-cost portable and wearable packages have encouraged the wide use of flip-chip packages and transparent conductors. The decreasing form factor for smartphones, tablets, and portable notebooks requires package substrates to be as thin as possible. For example, the detailed functioning of various electronic appliances is critical to the design of and cost-effective approaches to material fabrication. Further, the bonding of each component is crucial for the robustness, high reliability, and successful commercialization of electronic appliances.

This Special Issue will cover a wider scope of novel soldering/joining materials and advanced methodologies and their understanding for advanced high-density packaging devices. It is my great pleasure to cordially invite original research articles, including full papers, communications, and reviews, on the recent progress on the following subjects of electronic packaging, including but not limited to the keywords/topics below.

Prof. Dr. Byungmin Ahn
Guest Editor

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