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Micromachines
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Emerging Packaging and Interconnection Technology, Second Edition
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Emerging Packaging and Interconnection Technology, Second Edition

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".

Deadline for manuscript submissions: 15 November 2026 | Viewed by 19515

Special Issue Editor

Dr. Zhuo Chen

E-Mail Website
Guest Editor
The School of Mechanical and Electrical Engineering, Central South University, Changsha 410083, China
Interests: micro/nano-structure; MEMS packaging; surface and interface engineering; additive/subtractive packaging manufacturing
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

As the integrated circuit industry becomes increasingly oriented by the "More than Moore" wave, electronic packaging is under the spotlight more than ever. This particular industrial sector is developing a fusion with cutting-edge micro/nano-scale science and engineering, with a significant impact on modern manufacturing. This Special Issue aims to provide a forum for the researchers and engineers of microelectronics packaging to share their latest ideas and discoveries, with an emphasis on advanced science and technology at the micro/nano-scale, a major topic covered by the journal Micromachines. In this Special Issue, original research articles and reviews are welcome. Research areas may include (but are not limited to) the following: design and implementation of new packaging architecture, advanced chip-to-substrate interconnection, high-density and low-temperature interconnection, micro/nano-structures for surface and interface engineering in packaging, new materials and processes of advanced packaging, modeling and simulation, heterogeneous integration, MEMS packaging and integration, packaging reliability, and manufacturing tooling.

Dr. Zhuo Chen
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 250 words) can be sent to the Editorial Office for assessment.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2100 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • advanced packaging
  • micro/nano-structure
  • MEMS packaging
  • high-density interconnection
  • modeling and simulation
  • heterogeneous integration
  • surface and interface engineering
  • manufacturing tooling
  • additive/subtractive packaging manufacturing

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Related Special Issue

Published Papers (5 papers)

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Research

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26 pages, 19088 KB  
Article
Research on Multi-Frequency Vibration Dynamic Compensation Scheme for Electron Beam Inspection Equipment
by Junhai Jiang, David Wei Zhang and Ziyu Liu
Micromachines 2026, 17(3), 336; https://doi.org/10.3390/mi17030336 - 10 Mar 2026
Viewed by 373
Abstract
In the manufacturing process of advanced integrated circuits, electron beam inspection equipment is crucial for yield assurance, while vibration poses a core challenge affecting its precision and speed. Vibrations in production line equipment are mostly multi-frequency; However, research findings in this field remain [...] Read more.
In the manufacturing process of advanced integrated circuits, electron beam inspection equipment is crucial for yield assurance, while vibration poses a core challenge affecting its precision and speed. Vibrations in production line equipment are mostly multi-frequency; However, research findings in this field remain limited. Moreover, existing compensation schemes often struggle to meet industrial-grade precision and real-time requirements. This paper presents the design and implementation of a high-speed electron beam vibration compensation system based on positioning. The system incorporates state-of-the-art laser positioning and electrostatic scanning deflectors, and features an integrated signal processing and compensation signal output module. The study involved improvements and optimizations to the positioning processing analysis and compensation module, control software and algorithms, and calibration software and algorithms, demonstrating superior performance compared to existing methods. System validation data demonstrates that the proposed scheme effectively compensates for both single-frequency and multi-frequency disturbances at frequencies below 200 Hz, achieving an average attenuation of 50% to 90% and a repetitive compensation accuracy of less than 0.3 nm. These metrics meet the industrial application requirements for electron beam inspection equipment. The overall error in long-term repeatability tests complies with the stability demands of industrial production lines, confirming its practical applicability in production environments. Full article
(This article belongs to the Special Issue Emerging Packaging and Interconnection Technology, Second Edition)
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16 pages, 2077 KB  
Article
Cross Comparison Between Thermal Cycling and High Temperature Stress on I/O Connection Elements
by Mamta Dhyani, Tsuriel Avraham, Joseph B. Bernstein and Emmanuel Bender
Micromachines 2026, 17(1), 88; https://doi.org/10.3390/mi17010088 - 9 Jan 2026
Viewed by 614
Abstract
This work examines resistance drift in FPGA I/O paths subjected to combined electrical and thermal stress, using a Xilinx Spartan-6 device as a representative platform. A multiplexed measurement approach was employed, in which multiple I/O pins were externally shorted and sequentially activated, enabling [...] Read more.
This work examines resistance drift in FPGA I/O paths subjected to combined electrical and thermal stress, using a Xilinx Spartan-6 device as a representative platform. A multiplexed measurement approach was employed, in which multiple I/O pins were externally shorted and sequentially activated, enabling precise tracking of voltage, current, and effective series resistance over time, under controlled bias conditions. Two accelerated stress modes were investigated: high-temperature dwell in the range of 80–120 °C and thermal cycling between 80 and 140 °C. Both stress modes exhibited similar sub-linear (power-law) time dependence on resistance change, indicating cumulative degradation behavior. However, Arrhenius analysis revealed a strong contrast in effective activation energy: approximately 0.62 eV for high-temperature dwell and approximately 1.3 eV for thermal cycling. This divergence indicates that distinct physical mechanisms dominate under each stress regime. The lower activation energy is consistent with electrically and thermally driven on-die degradation within the FPGA I/O macro, including bias-related aging of output drivers and pad-level structures. In contrast, the higher activation energy observed under thermal cycling is characteristic of diffusion- and creep-dominated thermo-mechanical damage in package-level interconnects, such as solder joints. These findings demonstrate that resistance-based monitoring of FPGA I/O paths can discriminate between device-dominated and package-dominated aging mechanisms, providing a practical foundation for reliability assessment and self-monitoring methodologies in complex electronic systems. Full article
(This article belongs to the Special Issue Emerging Packaging and Interconnection Technology, Second Edition)
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13 pages, 4450 KB  
Article
Laser-Based Selective Removal of EMI Shielding Layers in System-in-Package (SiP) Modules
by Xuan-Bach Le, Won Yong Choi, Keejun Han and Sung-Hoon Choa
Micromachines 2025, 16(8), 925; https://doi.org/10.3390/mi16080925 - 11 Aug 2025
Viewed by 1508
Abstract
With the increasing complexity and integration density of System-in-Package (SiP) technologies, the demand for selective electromagnetic interference (EMI) shielding is growing. Conventional sputtering processes, while effective for conformal EMI shielding, lack selectivity and often require additional masking or post-processing steps. In this study, [...] Read more.
With the increasing complexity and integration density of System-in-Package (SiP) technologies, the demand for selective electromagnetic interference (EMI) shielding is growing. Conventional sputtering processes, while effective for conformal EMI shielding, lack selectivity and often require additional masking or post-processing steps. In this study, we propose a novel, laser-based approach for the selective removal of EMI shielding layers without physical masking. Numerical simulations were conducted to investigate the thermal and mechanical behavior of multilayer EMI shielding structures under two irradiation modes: full-area and laser scanning. The results showed that the laser scanning method induced higher interfacial shear stress, reaching up to 38.6 MPa, compared to full-area irradiation (12.5 MPa), effectively promoting delamination while maintaining the integrity of the underlying epoxy mold compound (EMC). Experimental validation using a nanosecond pulsed fiber laser confirmed that complete removal of the EMI shielding layer could be achieved at optimized laser powers (~6 W) without damaging the EMC, whereas excessive power (8 W) caused material degradation. The laser scanning speed was 50 mm/s, and the total laser irradiation time of the package was 0.14 s, which was very fast. This study demonstrates the feasibility of a non-contact, damage-free, and selective EMI shielding removal technique, offering a promising solution for next-generation semiconductor packaging. Full article
(This article belongs to the Special Issue Emerging Packaging and Interconnection Technology, Second Edition)
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Review

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53 pages, 2691 KB  
Review
Heterogeneous Integration Technology Drives the Evolution of Co-Packaged Optics
by Han Gao, Wanyi Yan, Dan Zhang and Daquan Yu
Micromachines 2025, 16(9), 1037; https://doi.org/10.3390/mi16091037 - 10 Sep 2025
Cited by 2 | Viewed by 8652
Abstract
The rapid growth of artificial intelligence (AI), data centers, and high-performance computing (HPC) has increased the demand for large bandwidth, high energy efficiency, and high-density optical interconnects. Co-packaged optics (CPO) technology offers a promising solution by integrating photonic integrated circuits (PICs) directly within [...] Read more.
The rapid growth of artificial intelligence (AI), data centers, and high-performance computing (HPC) has increased the demand for large bandwidth, high energy efficiency, and high-density optical interconnects. Co-packaged optics (CPO) technology offers a promising solution by integrating photonic integrated circuits (PICs) directly within or close to electronic integrated circuit (EIC) packages. This paper explores the evolution of CPO performance from various perspectives, including fan-out wafer level packaging (FOWLP), through-silicon via (TSV)-based packaging, through-glass via (TGV)-based packaging, femtosecond laser direct writing waveguides, ion-exchange glass waveguides, and optical coupling. Micro ring resonators (MRRs) are a high-density integration solution due to their compact size, excellent energy efficiency, and compatibility with CMOS processes. However, traditional thermal tuning methods face limitations such as high static power consumption and severe thermal crosstalk. To address these issues, non-volatile neuromorphic photonics has made breakthroughs using phase-change materials (PCMs). By combining the integrated storage and computing capabilities of photonic memory with the efficient optoelectronic interconnects of CPO, this deep integration is expected to work synergistically to overcome material, integration, and architectural challenges, driving the development of a new generation of computing hardware with high energy efficiency, low latency, and large bandwidth. Full article
(This article belongs to the Special Issue Emerging Packaging and Interconnection Technology, Second Edition)
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20 pages, 7265 KB  
Review
A Review of Wafer-Level Packaging Technology for SAW and BAW Filters
by Xinyue Liu, Wenjiao Pei, Jin Zhao, Rongbin Xu, Yi Zhong and Daquan Yu
Micromachines 2025, 16(3), 320; https://doi.org/10.3390/mi16030320 - 11 Mar 2025
Cited by 7 | Viewed by 5851
Abstract
This paper presents a comprehensive review of advancements in wafer-level packaging (WLP) technology, with a particular focus on its application in surface acoustic wave (SAW) and bulk acoustic wave (BAW) filters. As wireless communication systems continue to evolve, there is an increasing demand [...] Read more.
This paper presents a comprehensive review of advancements in wafer-level packaging (WLP) technology, with a particular focus on its application in surface acoustic wave (SAW) and bulk acoustic wave (BAW) filters. As wireless communication systems continue to evolve, there is an increasing demand for higher performance and miniaturization, which has made acoustic wave devices—especially SAW and BAW filters—crucial components in the Radio Frequency (RF) front-end systems of mobile devices. This review explores key developments in WLP technology, emphasizing novel materials, innovative structures, and advanced modeling techniques that have enabled the miniaturization and enhanced functionality of these filters. Additionally, the paper discusses the role of WLP in addressing challenges related to size reduction and integration, facilitating the creation of multi-functional devices with low manufacturing costs and high precision. Finally, it highlights the opportunities and future directions of WLP technology in the context of next-generation wireless communication standards. Full article
(This article belongs to the Special Issue Emerging Packaging and Interconnection Technology, Second Edition)
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