Photonic Integration Technology and Semiconductor Laser Array Chip Technology

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D1: Semiconductor Devices".

Deadline for manuscript submissions: 15 October 2025 | Viewed by 31

Special Issue Editor


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Guest Editor
College of Electronic and Optical Engineering and College of Flexible Electronics (Future Technology), Nanjing University of Posts and Telecommunications, Nanjing 210023, China
Interests: semiconductor laser array; light detection and ranging; optoelectronic devices

Special Issue Information

Dear Colleagues,

Photonic integration technology integrates multiple photonic components—such as lasers, modulators, amplifiers, detectors, and waveguides—onto a single chip or compact platform. Its core objective is to enhance system performance while achieving miniaturization and energy efficiency. Depending on technical approaches, photonic integration can be categorized into monolithic integration technology, heterogeneous integration technology, and hybrid packaging technology. This field has extensive applications in high-speed optical communication, optical interconnects, LiDAR, and optical sensing, positioning it as a critical direction for future optoelectronic advancements.

Semiconductor laser array chips serve as the "optical engine" of photonic integrated chips. Their high and multi-wavelength capabilities are key drivers for photonic integrated systems (e.g., optical communication, lidar), propelling the evolution of integration technologies toward higher performance. The deep fusion of photonic integration and semiconductor laser array chips transforms optoelectronics from single-device solutions to multifunctional systems.

This Special Issue, "Photonic Integration Technology and Semiconductor Laser Array Chip Technology", invites submissions of theoretical, numerical, and experimental papers reporting cutting-edge progress in this field. The scope includes, but is not limited to, the following topics:

  1. Monolithic integrated devices and processes;
  2. Heterogeneous integrated devices and processes;
  3. Silicon-based and lithium niobate thin-film devices;
  4. Photonic integrated systems (integrated optical frequency combs, integrated optical computing, etc.);
  5. III-V semiconductor laser array chips;
  6. Silicon-based laser light sources;
  7. Application systems of photonic integrated chips (LiDAR, microwave photonics);
  8. Packaging technology for photonic integrated chips;
  9. Numerical simulation algorithms for photonic integration technology.

Dr. Yunshan Zhang
Guest Editor

Manuscript Submission Information

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Keywords

  • photonic integration
  • monolithic integration
  • heterogeneous integration
  • semiconductor laser arrays

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