D1: Semiconductor Devices
A section of Micromachines (ISSN 2072-666X).
Editorial Board
Topical Advisory Panel
Special Issues
Following special issues within this section are currently open for submissions:
- Thin-Film Transistors: Materials, Fabrications and Applications (Deadline: 20 July 2024)
- GaN Heterostructure Devices: From Materials to Application (Deadline: 30 July 2024)
- Wide-Bandgap Materials for Photonic and Phononic Applications (Deadline: 31 July 2024)
- III-V Optoelectronics and Semiconductor Process Technology (Deadline: 31 July 2024)
- Innovative Progression of Light-Emitting Diodes (LED) (Deadline: 31 August 2024)
- GaN-Based Materials and Devices: Research and Applications (Deadline: 30 September 2024)
- III–V Compound Semiconductors and Devices, 2nd Edition (Deadline: 30 September 2024)
- Recent Progress in 2D Semiconductor Materials and Devices (Deadline: 31 December 2024)
- Thin Film Microelectronic Devices and Circuits (Deadline: 31 December 2024)
- III-Nitride Materials in Electronic and Photonic Devices (Deadline: 31 December 2024)
- Research Progress of Advanced SiC Semiconductors (Deadline: 31 December 2024)
- Recent Advances in 3D Printed Electronics (Deadline: 31 December 2024)
- Applications of Data Sciences in Semiconductor Industry: Design, Manufacturing, Packaging and Testing (Deadline: 31 December 2024)
- Wide-Bandgap Semiconductor Devices: Materials, Fabrication, and Applications (Deadline: 31 December 2024)
- Multifunctional Transistors: Outlooks and Challenges (Deadline: 28 February 2025)
- Power Semiconductor Devices and Applications, 3rd Edition (Deadline: 28 February 2025)
- Latest Advancements in Semiconductor Materials, Devices, and Systems, 2nd Edition (Deadline: 28 February 2025)