Flexible Conductive Electronics: Materials, Methods, Fabrication and Applications
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D：Materials and Processing".
Deadline for manuscript submissions: closed (31 May 2022) | Viewed by 441
Special Issue Editors
Interests: soft material; carbon materials; electrochemical sensor; biosensors; food safety; environment monitoring
Interests: hydrogel; bioelectronic; conducting polymer; 3D printing
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The development of flexible conductive electronic as wearable and conformable sensors, displays, and powering devices is making a huge impact on our daily lives. This Special Issue covers both organic and inorganic materials, as well as hybrid composite materials and devices for flexible electronics. Papers in the areas of soft materials synthesis, characterization, and modeling, along with device fabrication and testing, are requested. Papers demonstrating novel applications, including display, large-area sensors, functional devices, RFID tags, smart medical sensors, environmental monitoring, human–machine interactivity, robotics, communication and wireless networks, and paper-based devices will be considered. Novel, large area processing methods, such as 3D printing, ink-jet processing, spray pyrolysis, solution deposition, and roll-to-roll processing, are also of interest. Accordingly, this Special Issue seeks to showcase communications, research papers, and review articles.
Prof. Dr. Lidong Wu
Prof. Dr. Baoyang Lu
Prof. Dr. Xi Yao
Guest Editors
Manuscript Submission Information
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Keywords
- flexible biosensors
- flexible transistors
- flexible pressure sensors
- wearable electronics
- integrated optoelectronic devices
- flexible energy storage device
- flexible systems
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