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Epoxy Resin Synthesis, Performance and Application Research
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Epoxy Resin Synthesis, Performance and Application Research

A special issue of Molecules (ISSN 1420-3049). This special issue belongs to the section "Macromolecular Chemistry".

Deadline for manuscript submissions: 31 August 2024 | Viewed by 7107

Special Issue Editor

Dr. Jin Li

E-Mail Website
Guest Editor
School of Electrical and Information Engineering, Tianjin University, Tianjin 300072, China
Interests: functional graded materials; surface modification; quantum chemical calculation
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Epoxy resin has been applied in aerospace, automotive, energy, adhesives, electronics, coatings, and so on, thanks to its versatile properties. Recently, there has been an ever-increasing demand for advanced epoxy resin systems that have well-defined structures and desirable properties, in order to adapt to the newer requirements of different industries. The properties of epoxy end-use products are closely associated with the structure of the growing network. It is important to obtain a complete mechanism and accurate kinetic model that has predictive capabilities. Suitable modifiers and optimized curing processes play a vital role in developing high-performance epoxy-based composites. Recent advances in molecular simulation and chemical calculation have revolutionized the way we perceive the synthesis and performance of epoxy resins.

This Special Issue on “Epoxy Resin Synthesis, Performance and Application Research” welcomes original research and reviews on: (1) novel technologies and approaches for the synthesis and characterization of epoxy resin systems; (2) advanced hardeners, modifiers, and accelerators for high-performance epoxy-based composites; (3) curing kinetics and mechanism analysis of various epoxy/curing agent systems combined with molecular simulation and chemical calculation methods; (4) optimization of resin curing, infusion, and impregnation processes; and (5) epoxy-based composites and their applications.

Dr. Jin Li
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Molecules is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Synthesis, modification, and characterization
  • Curing kinetics and mechanism
  • Epoxy-based nanocomposites
  • Interface characteristics
  • Advanced hardeners, modifiers, and accelerators
  • Thermal, mechanical, and dielectric properties
  • Applications
  • Quantum chemical calculations
  • Molecular design

Published Papers (3 papers)

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Research

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13 pages, 4834 KiB  
Article
Space Charge Characteristics at the Interface of Laminated Epoxy Resin
by Yifan Zhang, Bing Luo, Mingli Fu, Lei Jia, Chi Chen, Gang Zhou and Chuang Wang
Molecules 2023, 28(14), 5537; https://doi.org/10.3390/molecules28145537 - 20 Jul 2023
Cited by 1 | Viewed by 904
Abstract
In the design and manufacturing of epoxy resin insulation components, complex structures can be achieved through multiple pours, thereby forming the structure of interface of laminated epoxy resin. This type of interface structure is often considered a weak link in performance which can [...] Read more.
In the design and manufacturing of epoxy resin insulation components, complex structures can be achieved through multiple pours, thereby forming the structure of interface of laminated epoxy resin. This type of interface structure is often considered a weak link in performance which can easily accumulate charges and cause electric field distortion. However, research on the interlayer interface of epoxy resin has received little attention. In this study, epoxy samples with and without interlayer interfaces were prepared, and the space charge accumulation characteristics and trap characteristics of the samples were analyzed via pulsed electro-acoustic (PEA) and thermally stimulated depolarization current (TSDC) methods. The experimental results indicate that the Maxwell–Wagner interface polarization model cannot fully explain the charge accumulation at the interface. Due to the influence of the secondary curing, the functional groups in the post-curing epoxy resin can move and react with the partially reacted functional groups in the prefabricated epoxy resin layer, resulting in a weak cross-linking network at the interface. With the increase in temperature, the molecular chain segments in the weak cross-linked region of the interface become more active and introduce deep traps at the interface, thereby exacerbating the accumulation of interface charges. In addition, due to the influence of interface polarization and weak cross-linking, the ability of the interface charges to cause field strength distortions decreases with the increase in applied field strength. This research study can provide a theoretical reference for the interfacial space charge transport characteristics of epoxy-cured cross-linked layers and provide ideas for regulating interfacial cross-linking to suppress interfacial charge accumulation. Full article
(This article belongs to the Special Issue Epoxy Resin Synthesis, Performance and Application Research)
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12 pages, 4784 KiB  
Article
Theoretical and Experimental Insights of Benzimidazole Catalyzed by the Epoxy–Acrylic Acid Reaction
by Muhammad Jawwad Saif, Fazal-ur-Rehman, Shazia Abrar, Arruje Hameed, Nazeran Idrees and Muhammad Asif
Molecules 2022, 27(22), 7900; https://doi.org/10.3390/molecules27227900 - 15 Nov 2022
Cited by 2 | Viewed by 1926
Abstract
This study focuses on the experimental and molecular-level investigation of epoxy acrylate formation. Epoxy acrylate vinyl ester resin was prepared by a reaction of diglycidyl ether of bisphenol-A-based epoxy resin and acrylic acid, using benzimidazole as a catalyst. It was confirmed that benzimidazole [...] Read more.
This study focuses on the experimental and molecular-level investigation of epoxy acrylate formation. Epoxy acrylate vinyl ester resin was prepared by a reaction of diglycidyl ether of bisphenol-A-based epoxy resin and acrylic acid, using benzimidazole as a catalyst. It was confirmed that benzimidazole can effectively catalyze this reaction. FTIR analysis of the product revealed a simple addition esterification reaction between the epoxide group and carboxylic group of acrylic acid excluding the side reactions (e.g., etherification). DFT computational studies were performed to theoretically explore the insights of reaction mechanisms. The calculations revealed that the benzimidazole-catalyzed reaction dominates the uncatalyzed reaction. A comparison of calculated activation energies showed that concerted mechanisms are less significant in such reactions owing to their high activation barriers. Full article
(This article belongs to the Special Issue Epoxy Resin Synthesis, Performance and Application Research)
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Review

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14 pages, 970 KiB  
Review
Curing Regime-Modulating Insulation Performance of Anhydride-Cured Epoxy Resin: A Review
by Jin Li, Hein Htet Aung and Boxue Du
Molecules 2023, 28(2), 547; https://doi.org/10.3390/molecules28020547 - 5 Jan 2023
Cited by 25 | Viewed by 2996
Abstract
Anhydride-cured bisphenol-A epoxy resin is widely used in the support, insulation and sealing key components of electrical and electronic equipment due to their excellent comprehensive performance. However, overheating and breakdown faults of epoxy resin-based insulation occur frequently under conditions of large current carrying [...] Read more.
Anhydride-cured bisphenol-A epoxy resin is widely used in the support, insulation and sealing key components of electrical and electronic equipment due to their excellent comprehensive performance. However, overheating and breakdown faults of epoxy resin-based insulation occur frequently under conditions of large current carrying and multiple voltage waveforms, which seriously threaten the safe and stable operation of the system. The curing regime, including mixture ratio and combination of curing time and temperature, is an important factor to determine the microstructure of epoxy resin, and also directly affects its macro performances. In this paper, the evolution of curing kinetic models of anhydride-cured epoxy resin was introduced to determine the primary curing regime. The influences of curing regime on the insulation performance were reviewed considering various mixture ratios and combinations of curing time and temperature. The curing regime-dependent microstructure was discussed and attributed to the mechanisms of insulation performance. Full article
(This article belongs to the Special Issue Epoxy Resin Synthesis, Performance and Application Research)
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