Wide Bandgap Semiconductor Material, Device and System Integration

A special issue of Nanomaterials (ISSN 2079-4991). This special issue belongs to the section "Nanoelectronics, Nanosensors and Devices".

Deadline for manuscript submissions: 6 July 2025 | Viewed by 1114

Special Issue Editors


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Guest Editor
School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China
Interests: GaN power devices and system integration; complementary metal oxide semiconductor (CMOS) devices and processes; novel ultra-high density memories; electronic ceramics
Special Issues, Collections and Topics in MDPI journals

E-Mail Website
Guest Editor
School of Microelectronics, Southern University of Science and Technology, Shenzhen 518055, China
Interests: GaN devices and power system; GaN radio frequency (RF) devices and power amplifier; GaN sensor
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Wide Band-Gap (WBG) semiconductors are a class of materials characterized by a band-gap larger than traditional semiconductors like Si and GaAs. Notable WBG semiconductors include GaN, Ga2O3, SiC, ZnO, AlN, and diamond. WBG materials offer higher breakdown voltages, faster switching speeds, and superior thermal conductivity compared to Si, and these properties make them particularly attractive for use in electric vehicles (EVs), renewable energy systems, and advanced communications infrastructure. The field of WBG devices represents one of the most exciting frontiers in semiconductor technology, with the potential to revolutionize power electronics, communication systems, and optoelectronics.

As research progresses and manufacturing techniques improve, WBG devices will continue to push the boundaries of performance, efficiency, and reliability. The present Special Issue of Nanomaterials is aimed at providing a comprehensive platform for researchers to present innovative findings and applications related to WBG devices. More specifically, it covers common key technology research that study material properties, device performance, and system design of WBG devices, such as advancements in WBG device nanofabrication technology, novel device architectures and integration strategies, and characterization and testing methods for WBG devices. The above topics are just for your reference. Any related topics not mentioned above will also be acceptable for this Special Issue. We will invite contributions from leading groups in the field to share their insights on the current state-of-the-art in this rapidly evolving area.

Prof. Dr. Hongyu Yu
Prof. Dr. Qing Wang
Guest Editors

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Keywords

  • wide band-gap power electronics and radio frequency (RF) devices
  • advanced process technology
  • materials growth and application
  • device design and modeling
  • device reliability
  • system and module

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Published Papers (1 paper)

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Research

12 pages, 4618 KiB  
Article
Optimization of CuOx/Ga2O3 Heterojunction Diodes for High-Voltage Power Electronics
by Xiaohui Wang, Mujun Li, Minghao He, Honghao Lu, Chun-Zhang Chen, Yang Jiang, Kangyao Wen, Fangzhou Du, Yi Zhang, Chenkai Deng, Zilong Xiong, Haozhe Yu, Qing Wang and Hongyu Yu
Nanomaterials 2025, 15(2), 87; https://doi.org/10.3390/nano15020087 - 8 Jan 2025
Viewed by 795
Abstract
This study optimizes the CuOx/Ga2O3 heterojunction diodes (HJDs) by tailoring the structural parameters of CuOx layers. The hole concentration in the sputtered CuOx was precisely controlled by adjusting the Ar/O2 gas ratio. Experimental investigations and [...] Read more.
This study optimizes the CuOx/Ga2O3 heterojunction diodes (HJDs) by tailoring the structural parameters of CuOx layers. The hole concentration in the sputtered CuOx was precisely controlled by adjusting the Ar/O2 gas ratio. Experimental investigations and TCAD simulations were employed to systematically evaluate the impact of the CuOx layer dimension and hole concentration on the electrical performance of HJDs. The results indicate that increasing the diameter dimension of the CuOx layer or tuning the hole concentration to optimal values significantly enhances the breakdown voltage (VB) of single-layer HJDs by mitigating the electric field crowing effects. Additionally, a double-layer CuOx structure (p+ CuOx/p CuOx) was designed and optimized to achieve an ideal balance between the VB and specific on-resistance (Ron,sp). This double-layer HJD demonstrated a high VB of 2780 V and a low Ron,sp of 6.46 mΩ·cm2, further yielding a power figure of merit of 1.2 GW/cm2. These findings present a promising strategy for advancing the performance of Ga2O3 devices in power electronics applications. Full article
(This article belongs to the Special Issue Wide Bandgap Semiconductor Material, Device and System Integration)
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