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Photonics
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Optical Technologies for Data Center Networks
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Optical Technologies for Data Center Networks

A special issue of Photonics (ISSN 2304-6732). This special issue belongs to the section "Data-Science Based Techniques in Photonics".

Deadline for manuscript submissions: closed (31 August 2021) | Viewed by 21907

Special Issue Editors

Dr. Akhilesh S. P. Khope

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Guest Editor
Microsoft Corporation, Redmond, Washington, DC 98052, USA
Interests: optical switches; photonic integrated circuits; data center networks; silicon photonics; inverse design; optical interconnects; semiconductor physics
Dr. Yu-Han Hung

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Guest Editor
Department of Electrical Engineering, Columbia University in the City of New York, New York, NY 10027, USA
Interests: semiconductor lasers; mobile wireless systems; silicon photonics; optical communications; high-performance cloud infrastructure; photonics-enabled network optimization
Dr. Songtao Liu

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Guest Editor
AyarLabs, 3351 Olcott St, Santa Clara, CA 95054, USA
Interests: III-V/silicon photonic integrated circuits; semiconductor lasers; semiconductor physics; optical interconnects; microwave photonics

Special Issue Information

Dear Colleagues,

Driven by the exponential growth of big data from the Internet of Things (IoT), 5G, high performance computing and data center interconnects, there has been tremendous growth in integrated photonic transceivers and switches due to the numerous foundries that have enabled fabless designs, both on InP and Si platforms. For instance, compact transceiver modules have enabled WDM connectivity in datacenters and integrated photonic switches have enabled reconfigurable data center networks. Improvements in device design have also enabled low power photonic devices and increased the number of devices that can fit onto a die. Advanced packaging technologies have led to high volume and low cost packages.

With the technical progress on deep learning (DL)-driven applications, such as natural language processing, image recognition, and virtual assistants, computational requirements of DL applications have been significantly increased. To meet the growing computational requirement, optical circuit switch (OCS)-based distributed processing on high-performance computing (HPC) systems is recognized as a practical solution.

In this issue, we would like to cover photonic-based technologies targeting for datacenter applications and want to invite researchers to submit their research on the following topics:

  1. Silicon photonics for datacenter interconnects;
  2. Co-packaged optics: architecture design;
  3. Optical interconnects and signal processing for data centers;
  4. Optical switches;
  5. Transceivers designed in silicon photonic foundry;
  6. Monolithically integrated light sources and optical amplifiers: including, but not limited to, vertical cavity surface emitting lasers (VCSELs), direct modulation lasers (DMLs), mode locked lasers (MLLs), semiconductor optical amplifiers (SOAs), tunable single wavelength lasers, laser arrays for WDM application, etc.;
  7. High-speed modulators;
  8. Photonics-enabled network optimization for datacenter and HPC systems.

Dr. Akhilesh S. P. Khope
Dr. Yu-Han Hung
Dr. Songtao Liu
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Photonics is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

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Published Papers (4 papers)

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Research

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10 pages, 1875 KiB  
Article
Noise-Immune Labels of Residual Codes for Improving Solution Efficiency to Packet Overflow in an Optical Label-Switched Buffer
by Kai-Sheng Chen and Chao-Chin Yang
Photonics 2021, 8(8), 308; https://doi.org/10.3390/photonics8080308 - 2 Aug 2021
Cited by 1 | Viewed by 1592
Abstract
In this paper, an optical buffering solution based on label switching is proposed, where packets are buffered by identifying and renewing the light labels of pseudo-orthogonal codes. The buffer overflow occurs when label switching fails to perform on the queued packets due to [...] Read more.
In this paper, an optical buffering solution based on label switching is proposed, where packets are buffered by identifying and renewing the light labels of pseudo-orthogonal codes. The buffer overflow occurs when label switching fails to perform on the queued packets due to the insufficient labels. Assigning an increased code number to the buffer could reduce the overflow effect, but the decoder noise mitigates its efficiency. Therefore, we study a noise-immune labeling method of residual function by advancing the correlation properties of the existing codes. The proposed label-switching scheme improves the solution efficiency to buffer overflow as a lower code-error probability can be reached. Moreover, multiple label codes can be simultaneously generated from a shared light source to achieve a power-efficient buffer structure. Full article
(This article belongs to the Special Issue Optical Technologies for Data Center Networks)
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6 pages, 3575 KiB  
Communication
25 Gb/s Data Transmission Using a Directly Modulated InGaAlAs DBR Laser over 14 nm Wavelength Tuning Range
by Daibing Zhou, Yiming He, Dan Lu, Song Liang, Lingjuan Zhao and Wei Wang
Photonics 2021, 8(3), 84; https://doi.org/10.3390/photonics8030084 - 22 Mar 2021
Cited by 4 | Viewed by 2429
Abstract
With the deployment of the fifth generation of mobile networks (5G), 25 and 100 Gb/s directly modulated lasers and modules will become the mainstream optical transmitters. A directly modulated InGaAlAs/InP distributed Bragg reflector (DBR) laser is fabricated by butt-joint technology. A 25 Gb/s [...] Read more.
With the deployment of the fifth generation of mobile networks (5G), 25 and 100 Gb/s directly modulated lasers and modules will become the mainstream optical transmitters. A directly modulated InGaAlAs/InP distributed Bragg reflector (DBR) laser is fabricated by butt-joint technology. A 25 Gb/s data transmission over a single-mode fiber of up to 10 km is demonstrated, and a wavelength tuning range of 14.28 nm is achieved through injection current tuning of a DBR section and temperature control of a thermoelectric cooler (TEC), which is the best candidate of colorless light sources for wavelength-division-multiplexed passive optical network (WDM-PON) systems. Full article
(This article belongs to the Special Issue Optical Technologies for Data Center Networks)
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9 pages, 3751 KiB  
Communication
Novel Low-Loss Fiber-Chip Edge Coupler for Coupling Standard Single Mode Fibers to Silicon Photonic Wire Waveguides
by Siwei Sun, Ying Chen, Yu Sun, Fengman Liu and Liqiang Cao
Photonics 2021, 8(3), 79; https://doi.org/10.3390/photonics8030079 - 16 Mar 2021
Cited by 13 | Viewed by 6035
Abstract
Fiber-to-chip optical interconnects is a big challenge in silicon photonics application scenarios such as data centers and optical transmission systems. An edge coupler, compared to optical grating, is appealing to in the application of silicon photonics due to the high coupling efficiency between [...] Read more.
Fiber-to-chip optical interconnects is a big challenge in silicon photonics application scenarios such as data centers and optical transmission systems. An edge coupler, compared to optical grating, is appealing to in the application of silicon photonics due to the high coupling efficiency between standard optical fibers (SMF-28) and the sub-micron silicon wire waveguides. In this work, we proposed a novel fiber–chip edge coupler approach with a large mode size for silicon photonic wire waveguides. The edge coupler consists of a multiple structure which was fulfilled by multiple silicon nitride layers embedded in SiO2 upper cladding, curved waveguides and two adiabatic spot size converter (SSC) sections. The multiple structure can allow light directly coupling from large mode size fiber-to-chip coupler, and then the curved waveguides and SSCs transmit the evanescent field to a 220 nm-thick silicon wire waveguide based on the silicon-on-insulator (SOI) platform. The edge coupler, designed for a standard SMF-28 fiber with 8.2 μm mode field diameter (MFD) at a wavelength of 1550 nm, exhibits a mode overlap efficiency exceeding 95% at the chip facet and the overall coupling exceeding 90%. The proposed edge coupler is fully compatible with standard microfabrication processes. Full article
(This article belongs to the Special Issue Optical Technologies for Data Center Networks)
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Review

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15 pages, 1523 KiB  
Review
Modulators in Silicon Photonics—Heterogenous Integration & and Beyond
by Jack Mulcahy, Frank H. Peters and Xing Dai
Photonics 2022, 9(1), 40; https://doi.org/10.3390/photonics9010040 - 12 Jan 2022
Cited by 16 | Viewed by 10876
Abstract
The article below presents a review of current research on silicon photonics. Herein, an overview of current silicon modulator types and modern integration approaches is presented including direct bonding methods and micro-transfer printing. An analysis of current state of the art silicon modulators [...] Read more.
The article below presents a review of current research on silicon photonics. Herein, an overview of current silicon modulator types and modern integration approaches is presented including direct bonding methods and micro-transfer printing. An analysis of current state of the art silicon modulators is also given. Finally, new prospects for III–V-silicon integration are explored and the prospects of an integrated modulator compatible with current CMOS processing is investigated. Full article
(This article belongs to the Special Issue Optical Technologies for Data Center Networks)
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