Polymer-Based Adhesives: Preparation, Characterization and Applications

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Applications".

Deadline for manuscript submissions: 28 February 2025 | Viewed by 38

Special Issue Editors


E-Mail Website
Guest Editor
School of Chemical Engineering and Technology, Hebei University of Technology, Tianjin 300401, China
Interests: functional polymers; polymer-based composites; pressure-sensitive adhesives; thermal conductivity; synthesis and characterization

E-Mail Website
Guest Editor Assistant
School of Chemical Engineering and Technology, Hebei University of Technology, Tianjin 300401, China
Interests: hexagonal boron nitride; cross-linker; preparation; characterization annlysis; physicochemical performances; thermal management

Special Issue Information

Dear Colleagues,

Polymer-based adhesives have been widely used to hold two substrates, similar or different, in contact either temporarily, semi-permanently, or permanently. The adhesive strength of the bond mainly depends on the characteristics of the polymer-matrix used. In the modern-day era, poly-based adhesives are employed almost everywhere around us in a variety of domestic, commercial, and industrial applications.

The most commonly used polymer-based adhesives are liquid chemical sealants, which usually form a bond with the substrate through a chemical reaction involving either solvent evaporation or cross-linking triggered by external stimuli such as temperature or radiation. However, such adhesives mostly show poor physicochemical properties and stability (thermal stability, thermal conductivity, adhesive force, and so on), resulting in inferior performance in practical applications. Therefore, it is essential to further summarize and discuss polymer-based adhesives with high performance.

This Special Issue focuses on polymer and polymer-based composite adhesives that have excellent physicochemical performance, as well as advanced applications for short- and long-term utilization. The list of keywords below provides a general description of the topics covered, which can be helpful in preparing your submission. However, manuscripts related to this field are also welcome, even if they do not include these specific keywords.

Prof. Dr. Xiongwei Qu
Guest Editor
Dr. Chaochao Cao
Guest Editor Assistant

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • polymer-based adhesives
  • polymerization
  • polymer composites
  • physicochemical properties
  • thermal conductivity
  • adhesive force
  • synthesis and characterization

Published Papers

This special issue is now open for submission.
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