State-of-the-Art Thermal Properties and Applications of Polymers
A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Innovation of Polymer Science and Technology".
Deadline for manuscript submissions: 31 March 2025 | Viewed by 16
Special Issue Editor
Interests: polymer; biomaterials; biomacromolecules; regenerative medicine; drug delivery; nanotechnology
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Over the past few decades, thermal analysis has become an essential tool for analytical and characterization purposes in materials science and analytical chemistry. This technique allows for the determination of specific physical and chemical properties of synthetic polymers, nanomaterials, composite materials, and biomaterials with various phases and morphologies. Traditional thermal analysis methods include differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), thermomechanical analysis (TMA), dynamic mechanical analysis (DMA), dielectric thermal analysis (DTEA), isothermal titration calorimetry (ITC), and heat transfer analysis, such as thermal diffusivity and thermal conductivity measurements. Techniques like DSC have evolved into more advanced forms, including modulated-temperature DSC (MTDSC), pressure perturbation calorimetry (PPC), micro/nano DSC, and fast-scan DSC (F-DSC). These diverse thermal methods are utilized to characterize mechanical properties, mass, temperature, heat, and specific heat capacity changes during the thermodynamic and kinetic transitions of various materials, including low molecular-mass substances, amorphous and semicrystalline synthetic polymers, as well as biopolymers. Additionally, thermal analysis plays a crucial role in quantitatively monitoring structural changes in materials during heating, cooling, and isothermal measurements. In this Special Issue, we aim to highlight recent advancements in thermal analysis of materials and explore newly developed methods in the field. We hope these reviews and research studies will offer a comprehensive perspective on the application of thermodynamic theories and methods in materials science over the past decade.
Dr. Xiao Hu
Guest Editor
Manuscript Submission Information
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Keywords
- 3D printing/additive manufacturing
- adsorption
- advanced instrumentation & tandem techniques
- composites/nanocomposites
- electronic packaging materials
- energetics and thermal hazards
- high temperature polymers
- kinetics
- modeling and simulation
- nanocalorimetry/fast scan techniques
- novel curing processes
- pharmaceuticals & biotech
- photo-cured thermosets
- precursors for ceramic and carbon materials
- rheology
- sustainable polymers
- thermal transport measurements for semiconductors and electronic device materials
- thermophysical properties
- thermoplastics
- thermosetting materials
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