Polymer Nanocomposites for Energy Applications

A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Applications".

Deadline for manuscript submissions: closed (20 July 2021) | Viewed by 3589

Special Issue Editor

Department of Chemical Engineering, Feng Chia University, Taichung, Taiwan
Interests: organic photovoltaics; organic light-emitting-diode; organic thin-film-transistor; perovskite solar cells; dye-sensitized solar cell; organic/Inorganic nanocomposite for energy application; flexible and wearable electronics; polymers in sensor application
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Special Issue Information

Dear Colleagues,

This Special Issue of the journal Polymers, entitled “Polymer Nanocomposite for Energy Applications,” aims to bring together papers focused on the applications of polymeric materials for energy applications. We aim to cover the fields of organic photovoltaics, organic light-emitting-diodes, organic thin-film-transistors, perovskite solar cells, dye-sensitized solar cell, organic/inorganic nanocomposite for energy application, flexible and wearable electronics, polymers in sensor application. A range of applications, from traditional to advanced, will be covered.

Dr. Yu-Wei Su
Guest Editor

Manuscript Submission Information

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Keywords

  • Organic photovoltaics
  • Organic light-emitting-diode
  • Organic thin-film-transistor
  • Perovskite solar cells
  • Dye-sensitized solar cell
  • Organic/inorganic nanocomposite for energy application
  • Flexible and wearable electronics
  • Polymers in sensor application

Published Papers (1 paper)

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Research

19 pages, 2078 KiB  
Article
Thermal and Dielectric Properties of Cyanate Ester Cured Main Chain Rigid-Rod Epoxy Resin
by Chi-Ping Li and Chih-Min Chuang
Polymers 2021, 13(17), 2917; https://doi.org/10.3390/polym13172917 - 30 Aug 2021
Cited by 8 | Viewed by 2847
Abstract
Thermal and dielectric properties of rigid-rod bifunctional epoxy resin 4,4-bis(2,3-epoxypropoxy) biphenyl epoxy (BP) and commercial epoxy resin diglycidyl ether of bisphenol A (DGEBA) were studied using differential scanning calorimeter (DSC), thermogravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), thermal mechanical analyzer (TMA) and dielectric [...] Read more.
Thermal and dielectric properties of rigid-rod bifunctional epoxy resin 4,4-bis(2,3-epoxypropoxy) biphenyl epoxy (BP) and commercial epoxy resin diglycidyl ether of bisphenol A (DGEBA) were studied using differential scanning calorimeter (DSC), thermogravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), thermal mechanical analyzer (TMA) and dielectric analyzer (DEA). These two epoxies were cured with cyanate ester hardener 2,2’-bis(4-cyanatophenyl) propane (AroCy B10). The BP/B10 system consisting of a rigid-rod structure exhibited better thermal properties than the DGEBA/B10 system with a flexible structure. Anisotropic BP/B10 (2:1) had the highest 5% weight loss temperature, the highest amount of residue and a smaller thermal expansion coefficient than the commercial DGEBA/B10 system. The BP/B10 system, which cured at the LC phase temperature, had higher Tg than the commercial DGEBA/B10 system, as found from dynamic mechanical analysis. The BP/B10 system also demonstrated better dielectric properties than the commercial DGEBA/B10 system when enough curing agent was provided. Full article
(This article belongs to the Special Issue Polymer Nanocomposites for Energy Applications)
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