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Heterogeneous Integration and Advanced Packaging for Micro and Nanosystems
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Heterogeneous Integration and Advanced Packaging for Micro and Nanosystems

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Nanosensors".

Deadline for manuscript submissions: closed (30 June 2023) | Viewed by 4907

Special Issue Editor

Dr. Ryo Takigawa

E-Mail Website
Guest Editor
Graduate School of Information Science and Electrical Engineering, Kyushu University, Fukuoka 819-0395, Japan
Interests: heterogeneous integration, advanced packaging; optical micro/nano sensors; MEMS; wafer and die bonding

Special Issue Information

Dear Colleagues,

Over the past several decades, heterogeneous integration and advanced packaging technologies have been established in the fields of MEMS/NEMS, photonics and electronics. Even now, these technologies continue to advance toward the miniaturization, cost reduction, functional diversification, and performance enhancement of these micro- and nanodevices. The scope of this Special Issue of Sensors is to highlight the continuous growth and latest advances in the field of heterogeneous integration and advanced packaging technologies for micro- and nanosystems by collating original research papers, short communications, and review articles. Topics include but not are limited to the following:

  • Heterogeneous integration;
  • Advanced packaging;
  • Wafer and die bonding;
  • Wafer-level packaging;
  • Hermetic sealing;
  • Micro- and nanosensors;
  • MEMS/NEMS;
  • Opto-electronic integration.

Dr. Ryo Takigawa
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • heterogeneous integration
  • advanced packaging
  • wafer and die bonding
  • wafer-level packaging
  • hermetic sealing
  • micro- and nanosensors
  • MEMS/NEMS
  • opto-electronic integration

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Published Papers (2 papers)

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Research

10 pages, 6549 KiB  
Communication
Design and Fabrication of a Thin and Micro-Optical Sensor for Rapid Prototyping
by Nobutomo Morita and Wataru Iwasaki
Sensors 2023, 23(17), 7658; https://doi.org/10.3390/s23177658 - 4 Sep 2023
Viewed by 1926
Abstract
Optical sensing offers several advantages owing to its non-invasiveness and high sensitivity. The miniaturization of optical sensors will mitigate spatial and weight constraints, expanding their applications and extending the principal advantages of optical sensing to different fields, such as healthcare, Internet of Things, [...] Read more.
Optical sensing offers several advantages owing to its non-invasiveness and high sensitivity. The miniaturization of optical sensors will mitigate spatial and weight constraints, expanding their applications and extending the principal advantages of optical sensing to different fields, such as healthcare, Internet of Things, artificial intelligence, and other aspects of society. In this study, we present the development of a miniature optical sensor for monitoring thrombi in extracorporeal membrane oxygenation (ECMO). The sensor, based on a complementary metal-oxide semiconductor integrated circuit (CMOS-IC), also serves as a photodiode, amplifier, and light-emitting diode (LED)-mounting substrate. It is sized 3.8 × 4.8 × 0.75 mm3 and provides reflectance spectroscopy at three wavelengths. Based on semiconductor and microelectromechanical system (MEMS) processes, the design of the sensor achieves ultra-compact millimeter size, customizability, prototyping, and scalability for mass production, facilitating the development of miniature optical sensors for a variety of applications. Full article
(This article belongs to the Special Issue Heterogeneous Integration and Advanced Packaging for Micro and Nanosystems)
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10 pages, 6441 KiB  
Communication
Wafer-Scale Room-Temperature Bonding of Smooth Au/Ti-Based Getter Layer for Vacuum Packaging
by Takashi Matsumae, Shingo Kariya, Yuichi Kurashima, Le Hac Huong Thu, Eiji Higurashi, Masanori Hayase and Hideki Takagi
Sensors 2022, 22(21), 8144; https://doi.org/10.3390/s22218144 - 24 Oct 2022
Cited by 1 | Viewed by 1823
Abstract
This study demonstrates room-temperature bonding using a getter layer for the vacuum packaging of microsystems. A thick Ti layer covered with an Au layer is utilized as a getter layer because it can absorb gas molecules in the package. Additionally, smooth Au surfaces [...] Read more.
This study demonstrates room-temperature bonding using a getter layer for the vacuum packaging of microsystems. A thick Ti layer covered with an Au layer is utilized as a getter layer because it can absorb gas molecules in the package. Additionally, smooth Au surfaces can form direct bonds for hermetic sealing at room temperature. Direct bonding using a getter layer can simplify the vacuum packaging process; however, typical getter layers are rough in bonding formation. This study demonstrates two fabrication techniques for smooth getter layers. In the first approach, the Au/Ti layer is bonded to an Au layer on a smooth SiO2 template, and the Au/SiO2 interface is mechanically exfoliated. Although the root-mean-square roughness was reduced from 2.00 to 0.98 nm, the surface was still extremely rough for direct bonding. In the second approach, an Au/Ti/Au multilayer on a smooth SiO2 template is bonded with a packaging substrate, and the Au/SiO2 interface is exfoliated. The transferred Au/Ti/Au getter layer has a smooth surface with the root-mean-square roughness of 0.54 nm and could form wafer-scale direct bonding at room temperature. We believe that the second approach would allow a simple packaging process using direct bonding of the getter layer. Full article
(This article belongs to the Special Issue Heterogeneous Integration and Advanced Packaging for Micro and Nanosystems)
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