sensors-logo

Journal Browser

Journal Browser

High-Performance MEMS Sensors

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Electronic Sensors".

Deadline for manuscript submissions: closed (30 March 2023) | Viewed by 2204

Special Issue Editor


E-Mail Website
Guest Editor
College of Information Science & Electronic Engineering, Zhejiang University, Hangzhou 310027, China
Interests: micro-/nanosensing; intelligent sensing microsystem; self-generated microenergy and on-chip multimode integration; MEMS; energy harvesting

Special Issue Information

Dear Colleagues,

The importance of MEMS technology is continuously increasing as they become more widespread in a broad variety of applications ranging from low-power devices for IoT and battery-powered applications to high-end devices for precise navigation and positioning, Industry 4.0, enhanced virtual reality components and smartphones.

MEMS technology is receiving substantial industrial attention. The concept of integrating sensors, actuators, electrical (and electronic) and mechanical devices into a single chip is considered as a basis for breakthrough technologies.

The aim of the Special Issue is to introduce the state-of-the-art technologies in the field of sensors, mechatronics, MEMS devices and microsystems in order to further summarize and improve on the methodologies concerning microsystems and MEMS devices. Topics of interest include but are not limited to the following:

  • MEMS and energy harvesters
  • MEMS low-power sensing techniques, circuits, and devices
  • Accelerometers
  • MEMS gyroscopes
  • Advanced packaging
  • Sensor characterization techniques
  • Sensor error modeling and online calibration

Prof. Dr. Lufeng Che
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Published Papers (1 paper)

Order results
Result details
Select all
Export citation of selected articles as:

Research

14 pages, 21652 KiB  
Article
H-Shaped Radial Phononic Crystal for High-Quality Factor on Lamb Wave Resonators
by Weitao He, Lixia Li, Zhixue Tong, Haixia Liu, Qian Yang and Tianhang Gao
Sensors 2023, 23(4), 2357; https://doi.org/10.3390/s23042357 - 20 Feb 2023
Cited by 3 | Viewed by 1803
Abstract
In this paper, a novel H-shaped radial phononic crystal (H-RPC) structure is proposed to suppress the anchor loss of a Lamb wave resonator (LWR), which has an ultra-high frequency (UHF) and ultra-wideband gap characteristics. Compared to previous studies on phononic crystal (PC) structures [...] Read more.
In this paper, a novel H-shaped radial phononic crystal (H-RPC) structure is proposed to suppress the anchor loss of a Lamb wave resonator (LWR), which has an ultra-high frequency (UHF) and ultra-wideband gap characteristics. Compared to previous studies on phononic crystal (PC) structures aimed at suppressing anchor loss, the radial phononic crystal (RPC) structure is more suitable for suppressing the anchor loss of the LWR. By using the finite element method, through the research and analysis of the complex energy band and frequency response, it is found that the elastic wave can generate an ultra-wideband gap with a relative bandwidth of up to 80.2% in the UHF range when propagating in the H-RPC structure. Furthermore, the influence of geometric parameters on the ultra-wideband gap is analyzed. Then, the H-RPC structure is introduced into the LWR. Through the analysis of the resonant frequency, it is found that the LWR formed by the H-RPC structure can effectively reduce the vibration energy radiated by the anchor point. The anchor quality factor was increased by 505,560.4% compared with the conventional LWR. In addition, the analysis of the LWR under load shows that the LWR with the H-RPC structure can increase the load quality factor by 249.9% and reduce the insertion loss by 93.1%, while the electromechanical coupling coefficient is less affected. Full article
(This article belongs to the Special Issue High-Performance MEMS Sensors)
Show Figures

Figure 1

Back to TopTop