- Article
Influence of HCl Concentration on Corrosion Behavior between Au or Cu Bonding Wires and the Bond Pad for Semiconductor Packaging
- Young-Ran Yoo,
- Gyubinn Kim,
- Sung-Min Jeon,
- Hyun-Jun Park,
- Won-Wook Seo,
- Jeong-Tak Moon and
- Young-Sik Kim
Wire bonding, one of the methods for electrically connecting a semiconductor chip with a substrate, involves attaching thin metal wires to pads. It is the oldest electrical connection method that exhibits high compatibility with other processes. The...