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9 Results Found

  • Article
  • Open Access
6 Citations
2,279 Views
19 Pages

Influence of HCl Concentration on Corrosion Behavior between Au or Cu Bonding Wires and the Bond Pad for Semiconductor Packaging

  • Young-Ran Yoo,
  • Gyubinn Kim,
  • Sung-Min Jeon,
  • Hyun-Jun Park,
  • Won-Wook Seo,
  • Jeong-Tak Moon and
  • Young-Sik Kim

22 November 2023

Wire bonding, one of the methods for electrically connecting a semiconductor chip with a substrate, involves attaching thin metal wires to pads. It is the oldest electrical connection method that exhibits high compatibility with other processes. The...

  • Article
  • Open Access
5 Citations
2,632 Views
24 Pages

27 April 2024

Semiconductor chips are packaged in a process that involves creating a path to allow for signals to be exchanged with the outside world and ultimately achieving a form to protect against various external environmental conditions such as heat and mois...

  • Article
  • Open Access
18 Citations
11,522 Views
14 Pages

Comparative Study of Chloride and Fluoride Induced Aluminum Pad Corrosion in Wire-Bonded Device Packaging Assembly

  • Goutham Issac Ashok Kumar,
  • Alexander Lambert,
  • Joshua Caperton,
  • Muthappan Asokan,
  • William Yi and
  • Oliver Chyan

The introduction of copper as wire bonding material brings about a new challenge of aluminum bond pad bimetallic corrosion at the copper/aluminum galvanic interface. Aluminum is well known to undergo pitting corrosion under halide-contaminated enviro...

  • Article
  • Open Access
4 Citations
2,015 Views
12 Pages

Regeneration of Aluminum Matrix Composite Reinforced by SiCp and GCsf Using Gas Tungsten Arc Welding Technology

  • Katarzyna Łyczkowska,
  • Janusz Adamiec,
  • Anna Janina Dolata,
  • Maciej Dyzia and
  • Jakub Wieczorek

26 October 2021

The main motivation behind the presented research was the regeneration of the damaged surface of composite materials. The testing of melting and pad welding of the composite surface by Gas Tungsten Arc Welding (GTAW) with alternating current (AC) wer...

  • Article
  • Open Access
63 Citations
18,888 Views
14 Pages

Corrosion Study and Intermetallics Formation in Gold and Copper Wire Bonding in Microelectronics Packaging

  • Chwee Sim Goh,
  • Wee Ling Eddy Chong,
  • Teck Kheng Lee and
  • Christopher Breach

17 July 2013

A comparison study on the reliability of gold (Au) and copper (Cu) wire bonding is conducted to determine their corrosion and oxidation behavior in different environmental conditions. The corrosion and oxidation behaviors of Au and Cu wire bonding ar...

  • Article
  • Open Access
23 Citations
3,147 Views
11 Pages

Effects of Composite Resin on the Enamel after Debonding: An In Vitro Study—Metal Brackets vs. Ceramic Brackets

  • Alexandru Vlasa,
  • Eugen Silviu Bud,
  • Mariana Păcurar,
  • Luminița Lazăr,
  • Laura Streiche,
  • Sorana Maria Bucur,
  • Dorin Ioan Cocoș and
  • Anamaria Bud

10 August 2021

Fixed orthodontic therapies include several procedures that can affect the enamel surface. The aim of this study was to assess the action of composite resin on the surface of the tooth through variation of enamel changes after debonding metal and cer...

  • Article
  • Open Access
654 Views
15 Pages

Post Wire-Bonding Corrosion Prevention Strategies to Mitigate Chloride- and Bromide-Induced Corrosion Failures in Cu- and PCC-Based Wire-Bonded Packages

  • Dinesh Kumar Kumaravel,
  • Shinoj Sridharan Nair,
  • Khanh Tuyet Anh Tran,
  • Pavan Ahluwalia,
  • Kevin Antony Jesu Durai and
  • Oliver Chyan

12 October 2025

To ensure the highest safety standards in modern automobiles, the industry is constantly adopting zero-defect frameworks, such as AEC-Q100, which aims for defective-parts-per-billion (DPPB) or grade-0 level reliability standards in automotive integra...

  • Article
  • Open Access
7 Citations
4,642 Views
9 Pages

Wafer-Level Self-Packaging Design and Fabrication of MEMS Capacitive Pressure Sensors

  • Yuanjie Wan,
  • Zhiwei Li,
  • Zile Huang,
  • Baofa Hu,
  • Wenlong Lv,
  • Chunquan Zhang,
  • Haisheng San and
  • Shaoda Zhang

This paper reports a MEMS capacitive pressure sensor (CPS) based on the operating principle of touch mode. The CPS was designed and fabricated using wafer-level self-packaged MEMS processes. The variable capacitance sensing structure was vacuum-seale...

  • Article
  • Open Access
12 Citations
3,366 Views
15 Pages

Soil Aggregate Construction: Contribution from Functional Soil Amendment Fertilizer Derived from Dolomite

  • Yaowei Zhan,
  • Kaixin Jiang,
  • Jiaquan Jiang,
  • Lidan Zhang,
  • Chengxiang Gao,
  • Xiuxiu Qi,
  • Jiayan Fan,
  • Yuechen Li,
  • Shaolong Sun and
  • Xiaolin Fan

27 September 2022

Elastic and water stable macroaggregate are significant to soil structure. which is the base of the soil, to maintain sustainable agriculture. Whether and how functional amendment fertilizer is capable of construction of the macroaggregate is the mai...