Microelectronics Assembly and Packaging: Materials and Technologies, 2nd Edition
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E：Engineering and Technology".
Deadline for manuscript submissions: 28 February 2025 | Viewed by 166
Special Issue Editors
Interests: micromachining; nanofabrication; 3D integration; CMOS-MEMS stacking; advanced packaging
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
With the rapid development trend of microelectronics technology, the optimization of microsystems and their different electronic components in recent years has moved towards small form factors, high bandwidths, high frequencies, high performance, high reliability, low power consumption, and low cost. Packaging materials and bonding technologies are especially vital parts of this trend since they have essential roles in back-end processes. The further these processes develop, the more advanced packaging materials and bonding technologies are needed. To meet the rising need for advanced systems development and to address the emerging challenges and issues facing the assembly and packaging of microelectronics, various packaging materials and technologies (2D, 2.5D, 3D, wafer-level packaging, and other advanced packaging technologies) are being developed across industry and academia. The good news is that the demand around these is rapidly increasing.
This Special Issue addresses research on microelectronics assembly and packaging, including bonding technologies (glass frit bonding, eutectic bonding, transient liquid-phase diffusion bonding, adhesive bonding, fusion bonding, thermocompression bonding, hybrid bonding), 2D/2.5D/3D integration and packaging, heterogeneous integration, and chiplet interconnections. Additionally, we welcome articles and reviews on electronic packaging materials such as metals, alloys, ceramics, and semiconductor materials, as well as their characterization and qualification.
Dr. Liangxing Hu
Dr. Youngwoo Kim
Guest Editors
Manuscript Submission Information
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Keywords
- semiconductor packaging
- advanced packaging
- chip and wire bonding technology
- mixed-assembly technology
- multichip modules (MCM)
- package-on-package (PoP)
- system-in-package (SiP)
- heterogeneous integration
- chiplet interconnection
- hybrid bonding
- 2.5D (interposer)
- 3D (TSV/TGV)
- packaging materials
- materials qualification
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