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Keywords = Cu-Cu USW

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17 pages, 8025 KB  
Article
The Influence of Welding Parameters on the Performance of Ultrasonic-Welded Copper-to-Copper Joints
by Koen Faes, Rafael Nunes, Sylvia De Meester, Wim De Waele, Hetal Parmar, Vitantonio Esperto and Felice Rubino
J. Manuf. Mater. Process. 2025, 9(2), 55; https://doi.org/10.3390/jmmp9020055 - 10 Feb 2025
Cited by 1 | Viewed by 1368
Abstract
Copper joints are indispensable in electronics and the electrical power industry due to their predominant usage in battery pack manufacturing for electric vehicle). Traditional joining methods are often limited by oxidation-related challenges. Recent efforts have focused on addressing these limitations by employing solid-state [...] Read more.
Copper joints are indispensable in electronics and the electrical power industry due to their predominant usage in battery pack manufacturing for electric vehicle). Traditional joining methods are often limited by oxidation-related challenges. Recent efforts have focused on addressing these limitations by employing solid-state techniques like ultrasonic welding (USW) for joining similar metals. USW presents attractive advantages such as a lower processing temperature and shorter weld time. This study investigates the ultrasonic welding of Cu-Cu joints with a thickness of 0.5 mm, focusing on both mechanical and metallurgical properties. The influence of key process parameters, such as the welding time, pressure and vibration amplitude, was examined in relation to the welding energy and lap shear strength. Additionally, the relationship between the input energy and lap shear strength was explored. A Pareto chart analysis revealed the standardized effects of these parameters on the welding energy and average lap shear strength. The welding time had a significant influence on the welding energy, while the vibration amplitude had the greatest impact on the joint strength. Longer weld times of 2.50 to 4 s yielded a higher lap shear strength, averaging up to 2.30 kN. Notably, a higher lap shear strength was achieved at lower welding energy levels. Full article
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21 pages, 3173 KB  
Article
Fungal Consortia Mediated Bio-Treatment of Organic Matter and Metals Uptake from Sewage Water: Maize Agro-Physiological Assessment
by Dalel Daâssi, Afef Nasraoui Hajaji, Lama J. H. Alssulime, Shaza N. Alkhatib and Ragaa A. Hamouda
Catalysts 2024, 14(4), 257; https://doi.org/10.3390/catal14040257 - 12 Apr 2024
Viewed by 2332
Abstract
The present investigation aims to improve the efficiency of fungal mono- and mixed cultures in removing organic pollutants and metals from sewage water (SW) for further maize plant response assessments. The reduction in the organic load from the SW was harnessed using a [...] Read more.
The present investigation aims to improve the efficiency of fungal mono- and mixed cultures in removing organic pollutants and metals from sewage water (SW) for further maize plant response assessments. The reduction in the organic load from the SW was harnessed using a co-culture consortium consisting of Aspergillus niger (KB5), Sordariomycetes sp. (D10), and Coniochaetaceae sp. (LB3). The testing results had evinced removal of up to 88% of the organic matter and more than 96%, 91%, 80%, and 47.6%, of removal percentages for Copper (Cu), Nickel (Ni), Cadmium (Cd), and Lead (Pb), respectively, with the developed fungal consortium [KB5 + D10 + LB3]. After treatment and lab experiments, a reuse of treated and untreated SW for plant irrigation was evaluated towards improving maize plant growth. Irrigation was conducted in pot experiments with three types of water: clean water (Control), untreated (USW), and treated SW by fungal consortia (TSW) and by station treatment plant STP (TSWP) using the randomized complete block (RCB) experimental design. Results of the pots trial revealed that the morphological parameters of SW-irrigated plants are slightly improved compared to water-irrigated plants. Data regarding assimilating area attributes indicated that the most significant enlargement of the assimilation area was observed with TSW-D (1/4) irrigation by 1051 cm2, followed by TSWP-D (0) by 953.96 cm2, then USW-D (1/4) by 716.54 cm2, as compared to plants irrigated with clean water (506.91 cm2). On average, the assimilation areas were larger by 51.76%, 46.86%, and 29.25% in TSW, USW, and TSWP-irrigated plants, respectively. Thus, SW irrigation supports the required qualities and quantities of microelements and water for plant growth. Oxidative stress assessment showed that irrigations with treated SW caused a significant decrease in both enzymatic and non-enzymatic antioxidants, depicting that the treatment lowered the stress of sewage water. Full article
(This article belongs to the Section Biocatalysis)
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15 pages, 10725 KB  
Article
Effect of Alcohol on the Mechanical and Electrical Properties of Ultrasonic Spot Welded Cu/Cu Joints
by Jiajia Yang, Zenglei Ni, Ayrat A. Nazarov and Fuxing Ye
Metals 2023, 13(1), 21; https://doi.org/10.3390/met13010021 - 22 Dec 2022
Cited by 9 | Viewed by 1906
Abstract
In order to improve the Cu/Cu joint quality, the bottom Cu sheet surface to be welded was dampened by a drop of absolute ethyl alcohol before the welding. Then, the ultrasonic spot welding (USW) was utilized to join a 0.5 mm thick Cu [...] Read more.
In order to improve the Cu/Cu joint quality, the bottom Cu sheet surface to be welded was dampened by a drop of absolute ethyl alcohol before the welding. Then, the ultrasonic spot welding (USW) was utilized to join a 0.5 mm thick Cu sheet to a 1.0 mm thick Cu sheet. The results demonstrated that, due to the action of the alcohol, obvious changes of the welding interface temperature, effective thickness, bond density, interface microstructure, joint resistance, micro-hardness, lap shear strength and fracture mode occurred in comparison with the joint without alcohol. Discontinuous dynamic recrystallization took place at the welding interface and facilitated the migration of grain boundaries across the contact interface, leading to the formation of the metallurgical bonding between the two Cu sheets. Full article
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17 pages, 5211 KB  
Article
Development and Evaluation of the Ultrasonic Welding Process for Copper-Aluminium Dissimilar Welding
by Rafael Gomes Nunes Silva, Sylvia De Meester, Koen Faes and Wim De Waele
J. Manuf. Mater. Process. 2022, 6(1), 6; https://doi.org/10.3390/jmmp6010006 - 1 Jan 2022
Cited by 21 | Viewed by 5746
Abstract
The demand for joining dissimilar metals has exponentially increased due to the global concerns about climate change, especially for electric vehicles in the automotive industry. Ultrasonic welding (USW) surges as a very promising technique to join dissimilar metals, providing strength and electric conductivity, [...] Read more.
The demand for joining dissimilar metals has exponentially increased due to the global concerns about climate change, especially for electric vehicles in the automotive industry. Ultrasonic welding (USW) surges as a very promising technique to join dissimilar metals, providing strength and electric conductivity, in addition to avoid metallurgical defects, such as the formation of intermetallic compounds, brittle phases and porosities. However, USW is a very sensitive process, which depends on many parameters. This work evaluates the impact of the process parameters on the quality of ultrasonic spot welds between copper and aluminium plates. The weld quality is assessed based on the tensile strength of the joints and metallographic examination of the weld cross-sections. Furthermore, the welding energy is examined for the different welding conditions. This is done to evaluate the influence of each parameter on the heat input resulting from friction at the weld interface and on the weld quality. From the obtained results, it was possible to optimise parameters to achieve satisfactory weld quality in 1.0 mm thick Al–Cu plate joints in terms of mechanical and metallurgical properties. Full article
(This article belongs to the Special Issue Advanced Joining Processes and Techniques)
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9 pages, 5932 KB  
Article
Hazardous Solid Waste Confined in Closed Dump of Morelia: An Urgent Environmental Liability to Attend in Developing Countries
by M. Lourdes González-Arqueros, Gabriela Domínguez-Vázquez, Ruth Alfaro-Cuevas-Villanueva, Isabel Israde-Alcántara and Otoniel Buenrostro-Delgado
Sustainability 2021, 13(5), 2557; https://doi.org/10.3390/su13052557 - 26 Feb 2021
Cited by 7 | Viewed by 3042
Abstract
In developing countries, landfills of urban solid waste (USW) are a major source of contamination. One reason is the common practice of the illegal confinement of hazardous waste (HW). The contamination is mainly due to deficitary design location, operation and lack of liner, [...] Read more.
In developing countries, landfills of urban solid waste (USW) are a major source of contamination. One reason is the common practice of the illegal confinement of hazardous waste (HW). The contamination is mainly due to deficitary design location, operation and lack of liner, which enables the dispersion of pollutants. The aim of our work is to demonstrate the presence of heavy metals (HM) and arsenic (As) in USW of the closed dump of Morelia, which clandestinely confined HW for 20 years. Solid samples of USW were collected from eight opencast wells with different age of confinement. Composition, degradation status, physical-chemical characterization and analysis of HM and As were carried out. The results showed the presence of Pb, Cu, Ni, Zn, Cr, Fe and high concentrations of As. This study provides evidence about the usual and illegal practice of landfill HW together with USW; the hazard due to the presence of HM and As; the deficiency in the operation and closure; and, the lack of competent legislation on the subject. This information is essential to establish background information for improving laws and help decision makers in territorial planning to improve public and environment health. Full article
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18 pages, 9097 KB  
Article
Interface Characterization of Ultrasonic Spot-Welded Mg Alloy Interlayered with Cu Coating
by Amir Badamian, Chihiro Iwamoto, Shigeo Sato and Suguru Tashiro
Metals 2019, 9(5), 532; https://doi.org/10.3390/met9050532 - 8 May 2019
Cited by 7 | Viewed by 3673
Abstract
The effect of Cu coating metallic interlayer on the weldability, joint strength, and interfacial microstructure during high-power ultrasonic spot welding (HP-USW) of AZ31B Mg alloy has been studied. Interlayered samples exhibited good weldability and they resulted in strong sound joints with nearly the [...] Read more.
The effect of Cu coating metallic interlayer on the weldability, joint strength, and interfacial microstructure during high-power ultrasonic spot welding (HP-USW) of AZ31B Mg alloy has been studied. Interlayered samples exhibited good weldability and they resulted in strong sound joints with nearly the same strength as joints without interlayer, with the distinction of lower energy being required. The Cu interlayer affected the thermal and vibrational properties of the interface, as the maximum interface temperature decreased and approached better uniformity across the weld nugget. The base metal grain structure changed to equiaxed larger grains after ultrasonic welding and a chain of parent metal small grains were observed around the interface. A binary intermetallic compound product of Mg-Cu, which was rich in Mg, has been found around the interface that was diffused toward base metal. According to the electron probe micro-analyzer (EPMA) results, alongside temperature measurements and hardness data, the formation of Mg2Cu is suggested in this region. At the interface centerline, a narrow region was identified that was composed of Mg, Cu, and Al. Complementary transmission electron microscopy analysis estimated that Al-containing reaction product is a ternary alloy of the MgCuxAly type. The dispersion of fine grain intermetallic compounds as discrete particles inside Mg substrate in both interfacial regions formed a composite like structure that could participate in joint strengthening. Full article
(This article belongs to the Special Issue Characterization of Welded Joints)
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14 pages, 4244 KB  
Article
Microstructural Characterization and Mechanical Behavior of NiTi Shape Memory Alloys Ultrasonic Joints Using Cu Interlayer
by Wei Zhang, Sansan Ao, Joao Pedro Oliveira, Zhi Zeng, Yifei Huang and Zhen Luo
Materials 2018, 11(10), 1830; https://doi.org/10.3390/ma11101830 - 26 Sep 2018
Cited by 31 | Viewed by 5697
Abstract
NiTi shape memory alloys (SMAs) are a class of functional materials which can be significantly deformed and recover their original shape via a reversible martensitic phase transformation. Developing effective joining techniques can expand the application of SMAs in the medical and engineering fields. [...] Read more.
NiTi shape memory alloys (SMAs) are a class of functional materials which can be significantly deformed and recover their original shape via a reversible martensitic phase transformation. Developing effective joining techniques can expand the application of SMAs in the medical and engineering fields. In this study, ultrasonic spot welding (USW), a solid-state joining technique, was used to join NiTi sheets using a Cu interlayer in between the two joining sheets. The influence of USW process on the microstructural characteristics and mechanical behavior of the NiTi joints was investigated. Compared with conventional fusion welding techniques, no intermetallic compounds formed in the joints, which is extreme importance for this particular class of alloys. The joining mechanisms involve a combination of shear plastic deformation, mechanical interlocking and formation of micro-welds. A better bonding interface was obtained with higher welding energy levels, which contributed to a higher tensile load. An interfacial fracture mode occurred and the fracture surfaces exhibited both brittle and ductile-like characteristics with the existence of tear ridges and dimples. The fracture initiated at the weak region of the joint border and then propagated through it, leading to tearing of Cu foil at the fracture interface. Full article
(This article belongs to the Special Issue Welding, Joining and Coating of Metallic Materials)
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12 pages, 3716 KB  
Article
Effects of Vibration Amplitude on Microstructure Evolution and Mechanical Strength of Ultrasonic Spot Welded Cu/Al Joints
by Jian Liu, Biao Cao and Jingwei Yang
Metals 2017, 7(11), 471; https://doi.org/10.3390/met7110471 - 2 Nov 2017
Cited by 25 | Viewed by 5151
Abstract
The effects of vibration amplitude on the interface reaction and mechanical strength of the Cu/Al joints were systematically investigated in ultrasonic spot welding (USW) experiments. The appropriate vibration amplitude (22.5 μm) was beneficial for obtaining a sound joint. The formation of the continuous [...] Read more.
The effects of vibration amplitude on the interface reaction and mechanical strength of the Cu/Al joints were systematically investigated in ultrasonic spot welding (USW) experiments. The appropriate vibration amplitude (22.5 μm) was beneficial for obtaining a sound joint. The formation of the continuous intermetallic compounds (IMC) layer accelerated with a higher vibration amplitude. The lap shear tensile strength of the Cu/Al joints decreased when the thickness of the intermetallic layer was greater than 1 μm at various amplitudes. With the increase in welding time, a crack occurred in the copper side owing to the occurrence of the eutectic reaction, α-A l + θ L , at the periphery of the nugget. The remarkable decline of ultrasonic power curves occurred at various amplitude levels upon the formation of a crack in the copper side. Full article
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