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Keywords = electroplating material

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29 pages, 980 KB  
Review
Recent Advances in Magnetron Sputtering: From Fundamentals to Industrial Applications
by Przemyslaw Borowski and Jaroslaw Myśliwiec
Coatings 2025, 15(8), 922; https://doi.org/10.3390/coatings15080922 - 7 Aug 2025
Viewed by 1333
Abstract
Magnetron Sputter Vacuum Deposition (MSVD) has undergone significant advancements since its inception. This review explores the evolution of MSVD, encompassing its fundamental principles, various techniques (including reactive sputtering, pulsed magnetron sputtering, and high-power impulse magnetron sputtering), and its wide-ranging industrial applications. While detailing [...] Read more.
Magnetron Sputter Vacuum Deposition (MSVD) has undergone significant advancements since its inception. This review explores the evolution of MSVD, encompassing its fundamental principles, various techniques (including reactive sputtering, pulsed magnetron sputtering, and high-power impulse magnetron sputtering), and its wide-ranging industrial applications. While detailing the advantages of high deposition rates, versatility in material selection, and precise control over film properties, the review also addresses inherent challenges such as low target utilization and plasma instability. A significant portion focuses on the crucial role of MSVD in the automotive industry, highlighting its use in creating durable, high-quality coatings for both aesthetic and functional purposes. The transition from traditional electroplating methods to more environmentally friendly MSVD techniques is also discussed, emphasizing the growing demand for sustainable manufacturing processes. This review concludes by summarizing the key advancements, remaining challenges, and potential future trends in magnetron sputtering technologies. Full article
(This article belongs to the Special Issue Magnetron Sputtering Coatings: From Materials to Applications)
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16 pages, 1504 KB  
Review
Electrodeposition of Nickel onto Polymers: A Short Review of Plating Processes and Structural Properties
by George W. Thompson and Mohammad J. Mahtabi
Appl. Sci. 2025, 15(15), 8500; https://doi.org/10.3390/app15158500 - 31 Jul 2025
Viewed by 1122
Abstract
This paper reviews the fundamental principles and techniques of nickel electrodeposition, with a particular focus on metallizing polymeric substrates. It outlines the electrochemical mechanisms involved in depositing nickel from an acidic Watts bath, detailing the roles of key electrolyte components—i.e., nickel sulfate, nickel [...] Read more.
This paper reviews the fundamental principles and techniques of nickel electrodeposition, with a particular focus on metallizing polymeric substrates. It outlines the electrochemical mechanisms involved in depositing nickel from an acidic Watts bath, detailing the roles of key electrolyte components—i.e., nickel sulfate, nickel chloride, and boric acid—and the influence of process parameters, such as current density, temperature, and pH, on deposit quality (density and surface condition) and mechanical properties. In addressing the unique challenges posed by non-conductive polymers, this review compares emerging methods like silver conductive paint, highlighting differences in deposition time, surface resistivity, and environmental impact. Additionally, this paper examines how process parameters affect the as-deposited microstructure, adhesion, and overall mechanical properties (such as hardness, ductility, and tensile strength), while identifying critical issues such as low deposition density and substrate degradation. These insights provide a structured background for optimizing electroplating processes for applications in electronics, automotive, aerospace, and biomedical sectors, and suggest future research directions to enhance deposition uniformity, sustainability, and process control. Full article
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31 pages, 4803 KB  
Review
Advanced HVOF-Sprayed Carbide Cermet Coatings as Environmentally Friendly Solutions for Tribological Applications: Research Progress and Current Limitations
by Basma Ben Difallah, Yamina Mebdoua, Chaker Serdani, Mohamed Kharrat and Maher Dammak
Technologies 2025, 13(7), 281; https://doi.org/10.3390/technologies13070281 - 3 Jul 2025
Viewed by 851
Abstract
Thermally sprayed carbide cermet coatings, particularly those based on tungsten carbide (WC) and chromium carbide (Cr3C2) and produced with the high velocity oxygen fuel (HVOF) process, are used in tribological applications as environmentally friendly alternatives to electroplated hard chrome [...] Read more.
Thermally sprayed carbide cermet coatings, particularly those based on tungsten carbide (WC) and chromium carbide (Cr3C2) and produced with the high velocity oxygen fuel (HVOF) process, are used in tribological applications as environmentally friendly alternatives to electroplated hard chrome coatings. These functional coatings are especially prevalent in the automotive industry, offering excellent wear resistance. However, their mechanical and tribological performances are highly dependent on factors such as feedstock powders, spray parameters, and service conditions. This review aims to gain deeper insights into the above elements. It also outlines emerging advancements in HVOF technology—including in situ powder mixing, laser treatment, artificial intelligence integration, and the use of novel materials such as rare earth elements or transition metals—which can further enhance coating performance and broaden their applications to sectors such as the aerospace and hydro-machinery industries. Finally, this literature review focuses on process optimization and sustainability, including environmental and health impacts, critical material use, and operational limitations. It uses a life cycle assessment (LCA) as a tool for evaluating ecological performance and addresses current challenges such as exposure risks, process control constraints, and the push toward safer, more sustainable alternatives to traditional WC and Cr3C2 cermet coatings. Full article
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17 pages, 6013 KB  
Article
The Effect of Injection Molding Processing Parameters on Chrome-Plated Acrylonitrile Butadiene Styrene-Based Automotive Parts: An Industrial Scale
by Yunus Emre Polat, Mustafa Oksuz, Aysun Ekinci, Murat Ates and Ismail Aydin
Polymers 2025, 17(13), 1787; https://doi.org/10.3390/polym17131787 - 27 Jun 2025
Viewed by 705
Abstract
In recent years, plastic decorative materials have been used in the automotive industry due to their advantages such as being environmentally friendly, aesthetic, light and economically affordable. Plastic decorative materials can exhibit high strength and metallic reflection with metal coatings. Chrome plating is [...] Read more.
In recent years, plastic decorative materials have been used in the automotive industry due to their advantages such as being environmentally friendly, aesthetic, light and economically affordable. Plastic decorative materials can exhibit high strength and metallic reflection with metal coatings. Chrome plating is generally preferred in the production of decorative plastic parts in the automotive industry. In this study, the effect of injection molding processing parameters on the metal–polymer adhesion of chrome-plated acrylonitrile butadiene styrene (ABS) was investigated. The ABS-based front grille frames are fabricated by means of using an industrial-scale injection molding machine. Then, the fabricated ABS-based front grille frame was plated with chrome by means of the electroplating method. The metal–polymer adhesion was investigated as a function of the injection molding processing parameters by means of a cross-cut test and scanning electron microscope (SEM). As a result, it was determined that the optimal injection process parameters, a cooling time of 18 s, a mold temperature of 70 °C, injection rates of 45-22-22-20-15-10 mm/s, and packing pressures of 110-100-100 bar, were effective in enhancing polymer–metal adhesion for the ABS-based front grille frame. Full article
(This article belongs to the Special Issue Advances in Polymer Molding and Processing)
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20 pages, 6335 KB  
Article
Electroplating Composite Coatings of Nickel with Dispersed WO3 and MoO3 on Al Substrate to Increase Wear Resistance
by Petr Osipov, Roza Shayakhmetova, Danatbek Murzalinov, Azamat Sagyndykov, Ainur Kali, Anar Mukhametzhanova, Galymzhan Maldybayev and Konstantin Mit
Materials 2025, 18(12), 2781; https://doi.org/10.3390/ma18122781 - 13 Jun 2025
Viewed by 585
Abstract
Investigations of the synthesis of multicomponent coatings and their subsequent application to metal substrates to increase the wear resistance of materials is relevant for industry. Nickel compounds obtained from oxidized magnesia-iron nickel ores with a desorption rate of more than 94% were used [...] Read more.
Investigations of the synthesis of multicomponent coatings and their subsequent application to metal substrates to increase the wear resistance of materials is relevant for industry. Nickel compounds obtained from oxidized magnesia-iron nickel ores with a desorption rate of more than 94% were used to create Ni-MoO3-WO3 electroplating. Such composite samples formed from an aqueous alcohol solution reduced the content of sodium and ammonium chlorides. The annealing and dehydration of samples at a temperature of 725 °C in an air atmosphere made it possible to achieve the highest level of crystallinity. In this case, an isomorphic substitution of W atoms by Mo occurs, which is confirmed by electron paramagnetic resonance (EPR) spectroscopy studies. The invariance of the shape of the EPR spectrum with a sequential increase in microwave radiation power revealed the stability of the bonds between the particles. The surface morphology of Ni-MoO3-WO3 films deposited on an Al substrate is smooth and has low roughness. In this case, an increased degree of wear resistance has been achieved. Thus, a recipe for the formation of an electroplating with stable bonds between the components and increased wear resistance was obtained. Full article
(This article belongs to the Section Advanced Composites)
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24 pages, 6162 KB  
Article
Thermal Behavior of Plated Electrical Connectors Under High-Power and High-Frequency Excitation
by Yuqi Zhou, Jinchun Gao, Tianmeng Zhang and Jie Lei
Electronics 2025, 14(12), 2353; https://doi.org/10.3390/electronics14122353 - 8 Jun 2025
Cited by 1 | Viewed by 639
Abstract
The temperature variations of interconnected coaxial connectors in RF circuits are strongly influenced by the contact surface characteristics and the ferromagnetic properties of the electroplated materials. In this study, specially structured N-DIN connectors with either magnetic or non-magnetic plating were designed. A dedicated [...] Read more.
The temperature variations of interconnected coaxial connectors in RF circuits are strongly influenced by the contact surface characteristics and the ferromagnetic properties of the electroplated materials. In this study, specially structured N-DIN connectors with either magnetic or non-magnetic plating were designed. A dedicated high-frequency, high-power RF experimental platform was set up to monitor and measure the temperature and power of the connectors. Finite element analysis (FEA) was employed to simulate the current density and temperature distribution across the samples. Furthermore, an equivalent circuit model of the central conductor was established by integrating electrical contact theory with the magnetic hysteresis effect. Based on the voltage–temperature (V–T) relation and the derived magnetic field–magnetoresistance (H–M) relation, a predictive model for the temperature rise of the central conductor was formulated. Experimental results demonstrated good agreement with simulation predictions, validating the proposed model and highlighting the critical role of plating material properties in high-power RF connectors’ thermal effect. Full article
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11 pages, 2568 KB  
Article
Hydrothermal Conversion of Sn-Bearing Sludge into Fe/S Rods for Efficient Heavy Metal Removal in Wastewater
by Shengyao Ma, Wu Yang, Weilu Yang and Yu Chen
Separations 2025, 12(6), 153; https://doi.org/10.3390/separations12060153 - 6 Jun 2025
Viewed by 413
Abstract
Hydrothermal conversion is an effective strategy to transform heavy metals in electroplating sludge into catalytic materials and use them to treat electroplating wastewater. This study presents a one-step hydrothermal method for converting Sn-bearing sludge, containing 23.41% Sn, 52.12% Fe, and other impurities, into [...] Read more.
Hydrothermal conversion is an effective strategy to transform heavy metals in electroplating sludge into catalytic materials and use them to treat electroplating wastewater. This study presents a one-step hydrothermal method for converting Sn-bearing sludge, containing 23.41% Sn, 52.12% Fe, and other impurities, into Fe/S rods using a NaOH/Na2S solution. The resulting Fe/S rods, with a diameter of 50–100 nm and length of 0.5–2.5 μm, showed excellent performance in wastewater treatment. In the presence of 50 mg/L EDTA, the Fe/S rods removed 22.9% of Ni, 30.2% of Cu, and 41.5% of Zn. When activated with PMS, the removal efficiencies increased significantly to 68.9%, 90.9%, and 91.6% for Ni, Cu, and Zn, respectively. The optimal rod dosage (1 g/L) achieved removal efficiencies of 94.2%, 78.5%, and 99.7% for Cu, Ni, and Zn, while increasing PMS dosage led to nearly 100% removal within 60 min. Additionally, the process allowed for the complete recycling of the alkaline solution, with regenerated rods showing similar performance to the original ones in wastewater treatment. This method offers an efficient and sustainable approach to sludge resource utilization and heavy metal removal from wastewater. Full article
(This article belongs to the Section Environmental Separations)
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13 pages, 6562 KB  
Article
An Innovative Strategy for Achieving Interface Gradient Material Using Co-Deposition Technology
by Yanxin Zhang, Liyan Lai, Yan Luo, Zhuoqing Yang and Guifu Ding
Nanomaterials 2025, 15(10), 718; https://doi.org/10.3390/nano15100718 - 9 May 2025
Cited by 1 | Viewed by 410
Abstract
In this study, high-performance SiC whisker (SiCw)-reinforced Cu matrix functionally graded materials (FGMs) were achieved through the synergy of numerical simulation and co-electrodeposition and then successfully applied as the interface of Cu and Si. A comprehensive numerical simulation framework was developed to investigate [...] Read more.
In this study, high-performance SiC whisker (SiCw)-reinforced Cu matrix functionally graded materials (FGMs) were achieved through the synergy of numerical simulation and co-electrodeposition and then successfully applied as the interface of Cu and Si. A comprehensive numerical simulation framework was developed to investigate the influence of gradient transition modes and the maximum volume fraction of SiCw on the thermal–mechanical properties in the different gradient structures. The optimized FGMs via numerical simulation were fabricated using a co-electrodeposition technique, producing a 100 μm thick coating with a SiCw volume fraction gradient ranging from 0% to 40%. The interface of Cu and SiC was void free in the FGMs and the SiCw was coated by nano-scale Cu grains during the electroplating process. The coefficient of thermal expansion in FGMs was higher than 9.78 × 10−6 K−1, which was the coefficient of thermal expansion in the Cu-40% vol. SiCw, and lower than 16.4 × 10−6 K−1, which was the coefficient of thermal expansion in pure Cu. Notably, the bonding interface area between the Cu/Si joint with the gradient-structured FGMs was more than twice that of non-graded materials. The enhanced thermal–mechanical performance was attributed to the synergistic effects of the nano-scale grain-reinforced SiCw-Cu interface and an optimized stress distribution achieved by the gradient structure. Full article
(This article belongs to the Special Issue Advanced Manufacturing on Nano- and Microscale)
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21 pages, 9891 KB  
Article
Investigation into Applicability of 3D-Printed Composite Polymers with Enhanced Mechanical Properties in the Development of Microwave Components
by Mauro Lumia, Mario Bragaglia, Francesca Nanni, Matteo Valeri, Oilid Bouzekri, Flaviana Calignano, Diego Manfredi, Giuseppe Addamo, Fabio Paonessa and Oscar Antonio Peverini
Electronics 2025, 14(9), 1865; https://doi.org/10.3390/electronics14091865 - 3 May 2025
Cited by 1 | Viewed by 806
Abstract
Additive manufacturing is currently regarded as one of the enabling technologies for Space Economy since it allows for the reduction of lead time and costs of payloads and platforms. Typically, metal-based additive manufacturing technologies are considered for the development of microwave components for [...] Read more.
Additive manufacturing is currently regarded as one of the enabling technologies for Space Economy since it allows for the reduction of lead time and costs of payloads and platforms. Typically, metal-based additive manufacturing technologies are considered for the development of microwave components for Space applications since they exhibit the best trade-off in radio-frequency performance, benefits, and withstanding adverse environmental conditions. In this view, composite polymers may further increase the benefits arising from the 3D printing of microwave components since lighter parts with the required thermal, mechanical, and RF performances can be placed on board satellites. This paper explores the feasibility of 3D-printed composite polymers, including Ultem and PEEK reinforced with carbon fiber, for the development of microwave waveguide devices intended for Space applications. To this end, three different manufacturing routes were investigated by selecting a specific composite polymer, the corresponding manufacturing system and post-processing, and the necessary metal-plating technique. Hence, relevant radio-frequency test vehicles operating at 10 ÷ 14 GHz were designed, manufactured, and tested. The experimental results prove that waveguide components operating in X and Ku bands can be developed through the material extrusion of PEEK reinforced with carbon fiber, which is subsequently metalized by means of a two-stage electroless/electroplating process. Full article
(This article belongs to the Special Issue Microwave Devices: Analysis, Design, and Application)
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17 pages, 9301 KB  
Review
Recent Progress in Copper Nanowire-Based Flexible Transparent Conductors
by Jiaxin Shi, Mingyang Zhang, Su Ding and Ge Cao
Coatings 2025, 15(4), 465; https://doi.org/10.3390/coatings15040465 - 15 Apr 2025
Viewed by 1433
Abstract
With the increasing demand for alternatives to traditional indium tin oxide (ITO), copper nanowires (Cu NWs) have gained significant attention due to their excellent conductivity, cost-effectiveness, and ease of synthesis. However, challenges such as wire–wire contact resistance and oxidation susceptibility hinder their practical [...] Read more.
With the increasing demand for alternatives to traditional indium tin oxide (ITO), copper nanowires (Cu NWs) have gained significant attention due to their excellent conductivity, cost-effectiveness, and ease of synthesis. However, challenges such as wire–wire contact resistance and oxidation susceptibility hinder their practical applications. This review discusses the development and challenges associated with Cu NW-based flexible transparent conductors (FTCs). Cu NWs are considered a promising alternative to traditional materials like ITO, thanks to their high electrical conductivity and low cost. This paper explores various synthesis methods for Cu NWs, including template-assisted synthesis, hydrazine reduction, and hydrothermal processes, while highlighting the advantages and limitations of each approach. The key challenges, such as contact resistance, oxidation, and the need for protective coatings, are also addressed. Several strategies to enhance the conductivity and stability of Cu NW-based FTCs are proposed, including thermal sintering, laser sintering, acid treatment, and photonic sintering. Additionally, protective coatings like noble metal core–shell layers, electroplated layers, and conductive polymers like PEDOT:PSS are discussed as effective solutions. The integration of graphene with Cu NWs is explored as a promising method to improve oxidation resistance and overall performance. The review concludes with an outlook on the future of Cu NWs in flexible electronics, emphasizing the need for scalable, cost-effective solutions to overcome current challenges and improve the practical application of Cu NW-based FTCs in advanced technologies such as displays, solar cells, and flexible electronics. Full article
(This article belongs to the Special Issue Design of Nanostructures for Energy and Environmental Applications)
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30 pages, 11610 KB  
Review
Bump-Fabrication Technologies for Micro-LED Display: A Review
by Xin Wu, Xueqi Zhu, Shuaishuai Wang, Xuehuang Tang, Taifu Lang, Victor Belyaev, Aslan Abduev, Alexander Kazak, Chang Lin, Qun Yan and Jie Sun
Materials 2025, 18(8), 1783; https://doi.org/10.3390/ma18081783 - 14 Apr 2025
Cited by 3 | Viewed by 2111
Abstract
Micro Light Emitting Diode (Micro-LED) technology, characterized by exceptional brightness, low power consumption, fast response, and long lifespan, holds significant potential for next-generation displays, yet its commercialization hinges on resolving challenges in high-density interconnect fabrication, particularly micrometer-scale bump formation. Traditional fabrication approaches such [...] Read more.
Micro Light Emitting Diode (Micro-LED) technology, characterized by exceptional brightness, low power consumption, fast response, and long lifespan, holds significant potential for next-generation displays, yet its commercialization hinges on resolving challenges in high-density interconnect fabrication, particularly micrometer-scale bump formation. Traditional fabrication approaches such as evaporation enable precise bump control but face scalability and cost limitations, while electroplating offers lower costs and higher throughput but suffers from substrate conductivity requirements and uneven current density distributions that compromise bump-height uniformity. Emerging alternatives include electroless plating, which achieves uniform metal deposition on non-conductive substrates through autocatalytic reactions albeit with slower deposition rates; ball mounting and dip soldering, which streamline processes via automated solder jetting or alloy immersion but struggle with bump miniaturization and low yield; and photosensitive conductive polymers that simplify fabrication via photolithography-patterned composites but lack validated long-term stability. Persistent challenges in achieving micrometer-scale uniformity, thermomechanical stability, and environmental compatibility underscore the need for integrated hybrid processes, eco-friendly manufacturing protocols, and novel material innovations to enable ultra-high-resolution and flexible Micro-LED implementations. This review systematically compares conventional and emerging methodologies, identifies critical technological bottlenecks, and proposes strategic guidelines for industrial-scale production of high-density Micro-LED displays. Full article
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21 pages, 8648 KB  
Article
Study on Current-Carrying Friction Characteristics and Corrosion Resistance of Carbon Brush/Collector Ring by Copper–Graphene Electrodeposition Process
by Meiyun Zhao, Jianwen Li, Chenshi Li, Yangyang Li and Xiaolong Zhang
Lubricants 2025, 13(4), 162; https://doi.org/10.3390/lubricants13040162 - 3 Apr 2025
Cited by 1 | Viewed by 605
Abstract
The collector ring/carbon brush assembly of a hydrogenerator set is a critical component for transmitting excitation current into the self-exciting winding. Its operating environment necessitates excellent corrosion resistance and current-carrying frictional properties. The surface condition and material composition of the collector ring are [...] Read more.
The collector ring/carbon brush assembly of a hydrogenerator set is a critical component for transmitting excitation current into the self-exciting winding. Its operating environment necessitates excellent corrosion resistance and current-carrying frictional properties. The surface condition and material composition of the collector ring are key factors influencing the performance of the brush/ring interface. Coatings have proven effective in enhancing both tribological and corrosion-resistant characteristics. In this study, copper/graphene composite coatings were fabricated via electroplating, and the effects of graphene deposition rate on current-carrying friction characteristics were systematically investigated to optimize electroplating parameters. The results showed that the composite coating reduced contact resistance by 32.58% and friction coefficient by 37.59%. Electrochemical and immersion tests were conducted to evaluate the corrosion behavior under varying pressure and current density conditions. The results revealed that the optimal corrosion resistance was achieved under 1 N pressure and 12 A/cm2 current density. The copper/graphene composite coating demonstrated superior corrosion resistance compared to uncoated samples. In summary, the electroplated copper/graphene composite coatings exhibit excellent current-carrying frictional performance and corrosion resistance, offering a promising solution for enhancing the durability and efficiency of hydrogenerator collector rings. Full article
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27 pages, 3254 KB  
Review
Review of Evolution and Rising Significance of Wafer-Level Electroplating Equipment in Semiconductor Manufacturing
by Tao Jiang and Huiyong Hu
Electronics 2025, 14(5), 894; https://doi.org/10.3390/electronics14050894 - 24 Feb 2025
Cited by 3 | Viewed by 3499
Abstract
Electroplating has become a cornerstone technology in semiconductor manufacturing, enabling high-performance interconnects and advanced packaging. Since the introduction of the Damascene Cu process at the 180 nm node, it has evolved to meet the demands for precision, uniformity, and scalability in miniaturized nodes [...] Read more.
Electroplating has become a cornerstone technology in semiconductor manufacturing, enabling high-performance interconnects and advanced packaging. Since the introduction of the Damascene Cu process at the 180 nm node, it has evolved to meet the demands for precision, uniformity, and scalability in miniaturized nodes and complex packaging architectures. The shift to horizontal electroplating systems has enhanced uniformity and process stability, particularly for applications such as TSVs, Cu pillars, micro-bumps, and RDLs. Emerging innovations like pulse electroplating, segmented anode control, and AI-driven monitoring are addressing the challenges of fine-pitch interconnects and emerging interconnect materials, such as cobalt. These advancements are critical for high-density interconnects used in AI, HPC, and high-frequency applications. This review explores the advancements in electroplating technologies, focusing on their role in semiconductor manufacturing. It highlights the evolving equipment designs and their implications for achieving precision, scalability, and reliability at advanced nodes. The ongoing development of electroplating equipment and techniques will support the reliability and performance of future semiconductor devices, reinforcing electroplating as a cornerstone technology in advanced packaging and fabrication. Full article
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24 pages, 3541 KB  
Review
Electrochemical Corrosion Properties and Protective Performance of Coatings Electrodeposited from Deep Eutectic Solvent-Based Electrolytes: A Review
by Vyacheslav S. Protsenko
Materials 2025, 18(3), 558; https://doi.org/10.3390/ma18030558 - 26 Jan 2025
Viewed by 1511
Abstract
The application of deep eutectic solvents (DESs) as an innovative class of environmentally friendly liquid media represents a significant advancement in materials science, especially for the development and enhancement of structural materials. Among the promising applications, DESs are particularly attractive for the electrodeposition [...] Read more.
The application of deep eutectic solvents (DESs) as an innovative class of environmentally friendly liquid media represents a significant advancement in materials science, especially for the development and enhancement of structural materials. Among the promising applications, DESs are particularly attractive for the electrodeposition of corrosion-resistant coatings. It is established that corrosion-resistant and protective coatings, including those based on metals, alloys, and composite materials, can be synthesized using both traditional aqueous electrolytes and non-aqueous systems, such as organic solvents and ionic liquids. The integration of DESs in electroplating introduces a unique capacity for precise control over microstructure, chemical composition, and morphology, thereby improving the electrochemical corrosion resistance and protective performance of coatings. This review focuses on the electrodeposition of corrosion-resistant and protective coatings from DES-based electrolytes, emphasizing their environmental, technological, and economic benefits relative to traditional aqueous and organic solvent systems. Detailed descriptions are provided for the electrodeposition processes of coatings based on zinc, nickel, and chromium from DES-based baths. The corrosion–electrochemical behavior and protective characteristics of the resulting coatings are thoroughly analyzed, highlighting the potential and future directions for developing anti-corrosion and protective coatings using DES-assisted electroplating techniques. Full article
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20 pages, 8125 KB  
Article
Running-In Behavior and Failure Mechanism Between AgCuNi Alloy and Au-Electroplated Layer
by Hongjian Wu, Ya’nan Zhang, Qingjian Jia, Hui Cao, Han Li and Ming Ma
Sensors 2025, 25(1), 107; https://doi.org/10.3390/s25010107 - 27 Dec 2024
Cited by 1 | Viewed by 664
Abstract
To avoid wear and tear of the slip ring due to electrical corrosion, the slip ring needs to undergo the running-in process under atmospheric conditions without current after assembly. To address the urgent demand for long-service capability space conductive slip rings in the [...] Read more.
To avoid wear and tear of the slip ring due to electrical corrosion, the slip ring needs to undergo the running-in process under atmospheric conditions without current after assembly. To address the urgent demand for long-service capability space conductive slip rings in the aerospace field, the running-in behavior and failure mechanism between the AgCuNi alloy and Au-electroplated layer are investigated using a ball-on-disc tribometer in this paper. The results show that the transfer film composed of Au plays an important role in modifying the friction during the sliding process. With the accumulation of wear debris composed of Ag on the disc, the contact material of the friction pair changed from Au and Au to Au, Ag and Au, so the surface roughness of wear tracks increased. Finally, the transfer film broke, which made the layer fail. This paper reveals the key element failure mechanism that causes transfer film failure in the running-in contact area, which is used to reveal the friction behavior and failure mechanism of slip ring friction pair materials, and provides a basis for the selection of running-in parameters during the running-in process of slip rings before power-on operation. Full article
(This article belongs to the Section Fault Diagnosis & Sensors)
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