Failure Modelling and Reliability Analysis of Electro-Optical Devices

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Electrical, Electronics and Communications Engineering".

Deadline for manuscript submissions: closed (31 October 2023) | Viewed by 223

Special Issue Editors


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Guest Editor
Center of Reliability Sciences and Technologies, Chang Gung University, Wenhua 1st Rd., Guishan Dist., Taoyuan City 33302, Taiwan
Interests: reliability modeling; reliability statistics; failure analysis; prognosis and health management; reliability simulation
Special Issues, Collections and Topics in MDPI journals

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Guest Editor
School of Electrical Engineering, Tiangong University, Tianjin 300387, China
Interests: semiconductors; GaN; reliability; failure analysis; optoelectronic devices; power devices

Special Issue Information

Dear Colleagues,

We would like to invite you to submit your work to a Special Issue on “Failure Modelling and Reliability Analysis of Electro-Optical Devices”. There are many electro-optical devices such as light-emitting diodes, laser diodes, solar cells, photo-couplers, photo-transistors, photo-multiplier tubes, etc. All of them have important applications in our daily lives and industrial/medical applications. While their applications are expanding, their operation environments can also become harsher. Since our reliance on these devices are increasing, their reliability become a key factor to consider for their practical applications in commercial world.

Generally, device reliability is tested at accelerated stress conditions, and their lifetime at standard operating conditions will be predicted through extrapolation from the accelerated test conditions. For accurate extrapolation, failure modeling is needed. The failure modeling also enables us to understand the key factors that will affect the reliability of the devices, and improvement of the devices can thus be effective.

The aim of this issue is to provide a platform for researchers in this field to share their findings and exchange their research results so that our knowledge on the failure mechanisms and reliability improvement of electro-optical devices can be built upon one another research results, accelerate the accumulation of the knowledge for the enhancement of the reliability of these devices to serve the man-kind better and effectively.

This Special Issue will publish high-quality, original research papers, in the overlapping fields of: 

  • Reliability analysis of electro-optical devices;
  • Reliability tests on electro-optical devices;
  • Reliability improvement for electro-optical devices;
  • Failure analysis of electro-optical devices;
  • Failure mechanisms of electro-optical devices;
  • Finite element modeling on electro-optical devices;
  • Finite difference modeling on electro-optical devices;
  • Ab-initio modeling relating to electro-optical devices.

Prof. Dr. Cher Ming Tan
Prof. Dr. Lixia Zhao
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • reliability tests
  • reliability analysis
  • failure analysis
  • reliability and failure modeling
  • failure mechanisms

Published Papers

There is no accepted submissions to this special issue at this moment.
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