Frontiers in Optical Interconnects

A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Optics and Lasers".

Deadline for manuscript submissions: closed (20 September 2021) | Viewed by 6221

Special Issue Editor


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Guest Editor
RISE Research Institutes of Sweden; Senior Scientist & Technical Lead on Optical Transmission; Affiliated Faculty at KTH Royal Institute of Technology; Sweden
Interests: fiber-optic communications; photonic–wireless systems; optical signal processing; optical interconnects

Special Issue Information

Dear Colleagues,

Modern technologies that support the Internet have transformed our lives. The Internet grows by 30% per year and consumes 9% of all electricity worldwide while transmitting hundreds of terabits per second. Global use of information grows continuously due to the demands of our society. We cannot continue the exponential growth of our use of information without significant reduction in energy consumption. This is a serious challenge for optical interconnects—how to reduce energy consumption and cost while increasing data rates.

Datacenters will continue to deploy optical interconnects to meet the required bandwidth density. The solution to energy-efficient and enormous bandwidth density optical interconnects is tight integration between electronics and photonics. We need to achieve high levels of integration with low manufacturing costs using integrated silicon photonics and wavelength-division-multiplexing technology. Innovation within photonics and electronics has enabled technologies to reduce energy consumption while supporting exponential use of information. A key enabler is the ring resonators for high throughput optical interconnects. Integration of optical technologies into datacenters will enable advances in machine learning and artificial intelligence. This will provide fast and reliable services to users worldwide.

Prof. Dr. Ozolins Oskars
Guest Editor

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Keywords

  • Optical interconnects
  • Ring resonators
  • Datacenters
  • Energy-efficient
  • Wavelength division multiplexing
  • Silicon photonics

Published Papers (1 paper)

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24 pages, 10155 KiB  
Article
Co-Package Technology Platform for Low-Power and Low-Cost Data Centers
by Konstantinos Papatryfonos, David R. Selviah, Avi Maman, Kobi Hasharoni, Antoine Brimont, Andrea Zanzi, Jochen Kraft, Victor Sidorov, Marc Seifried, Yannick Baumgartner, Folkert Horst, Bert Jan Offrein, Katarzyna Lawniczuk, Ronald G. Broeke, Nikos Terzenidis, George Mourgias-Alexandris, Mingchu Tang, Alwyn J. Seeds, Huiyun Liu, Pablo Sanchis, Miltiadis Moralis-Pegios, Thanasis Manolis, Nikos Pleros, Konstantinos Vyrsokinos, Bogdan Sirbu, Yann Eichhammer, Hermann Oppermann and Tolga Tekinadd Show full author list remove Hide full author list
Appl. Sci. 2021, 11(13), 6098; https://doi.org/10.3390/app11136098 - 30 Jun 2021
Cited by 6 | Viewed by 5539
Abstract
We report recent advances in photonic–electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel modulation schemes [...] Read more.
We report recent advances in photonic–electronic integration developed in the European research project L3MATRIX. The aim of the project was to demonstrate the basic building blocks of a co-packaged optical system. Two-dimensional silicon photonics arrays with 64 modulators were fabricated. Novel modulation schemes based on slow light modulation were developed to assist in achieving an efficient performance of the module. Integration of DFB laser sources within each cell in the matrix was demonstrated as well using wafer bonding between the InP and SOI wafers. Improved semiconductor quantum dot MBE growth, characterization and gain stack designs were developed. Packaging of these 2D photonic arrays in a chiplet configuration was demonstrated using a vertical integration approach in which the optical interconnect matrix was flip-chip assembled on top of a CMOS mimic chip with 2D vertical fiber coupling. The optical chiplet was further assembled on a substrate to facilitate integration with the multi-chip module of the co-packaged system with a switch surrounded by several such optical chiplets. We summarize the features of the L3MATRIX co-package technology platform and its holistic toolbox of technologies to address the next generation of computing challenges. Full article
(This article belongs to the Special Issue Frontiers in Optical Interconnects)
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