Application of Intelligent Materials in Inspection, Repair and Reinforcement of Infrastructure
A special issue of Applied Sciences (ISSN 2076-3417). This special issue belongs to the section "Civil Engineering".
Deadline for manuscript submissions: closed (20 July 2024) | Viewed by 4122
Special Issue Editors
Interests: evaluation; rehabilitation; steel bridges; SMAs; CFRP; smart materials
Special Issues, Collections and Topics in MDPI journals
Interests: steel structures; high-performance materials; SMAs; fire resistance; repair
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Civil engineering infrastructures often face great demands for strengthening or repairing during their service lives, especially due to fatigue and corrosion damages or exposed to fire and earthquake disaster. Nowadays, intelligent materials such as shape-memory alloys, smart materials, and fiber-reinforced composites have great potential in the inspecting, repairing and upgrading of infrastructures, and in turn for the enhancement of their long-term performance. Taking Fe–Mn–Si alloys as an example, the martensitic transformation and its reverse transformation which produces considerable recovery stress (300~500 MPa), can be utilized as prestress for the local repairing of fatigue cracks in orthotropic steel bridge decks and also global upgrading of down-wrapped concrete/steel/composite beams. In this Special Issue, in comparison with traditional inspection and strengthening methods, mechanisms, techniques and applications of intelligent materials on the rehabilitation of infrastructures will be introduced and classified in detail.
Dr. Xu Jiang
Dr. Xuhong Qiang
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Applied Sciences is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- steel bridge
- intelligent material
- fatigue
- corrosion
- inspection
- rehabilitation
Benefits of Publishing in a Special Issue
- Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
- Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
- Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
- External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
- e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.
Further information on MDPI's Special Issue polices can be found here.
