Progress in Coatings Deposition by Advanced Welding and Welding-Related Processes, 2nd Edition

A special issue of Coatings (ISSN 2079-6412). This special issue belongs to the section "Surface Characterization, Deposition and Modification".

Deadline for manuscript submissions: 15 October 2024 | Viewed by 727

Special Issue Editor


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Guest Editor
Institute of Manufacturing Technologies, Warsaw University of Technology, 85 Narbutta Str., 02-524 Warsaw, Poland
Interests: welding and surface engineering; thermal spraying; coatings; surface modification
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

It is our pleasure to announce the launch of a new Special Issue in the journal Coatings on the topic of “Progress in Coating Deposition via Advanced Welding and Welding-Related Processes”, which will cover an important domain of research and development dedicated to surface modification and surface remanufacturing.

Although this field has reached such a mature level that it is prevalent in the production and remanufacturing processes of advanced machine parts, there are still many aspects of it that are yet to be illuminated, and as such, development is still progressing intensively.

Many domains are involved in this progress, ranging from maritime to the oil industry, including agriculture, aeronautics, communications, energy, military, etc.

This Special Issue intends to gather original scientific peer-reviewed articles and review articles featuring important and recent developments or achievements in surface modifications via welding and welding-related processes, with a special emphasis on real or potential applications.

Authors are invited to submit their contributions at any moment from now. Papers can cover either experimental or theoretical aspects or both.

We look forward to receiving your contributions.

Prof. Dr. Tomasz Chmielewski
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Coatings is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • welding
  • coating substrate
  • deposition

Published Papers (1 paper)

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Research

20 pages, 24022 KiB  
Article
Influence of Cylindrical Cells Surface Cleaning by Means of Laser Ablation on Wedge Wire Bonding Process
by Krzysztof Bieliszczuk, Jakub Zręda and Tomasz M. Chmielewski
Coatings 2024, 14(4), 445; https://doi.org/10.3390/coatings14040445 - 9 Apr 2024
Cited by 1 | Viewed by 561
Abstract
Wire bonding is a method of connecting two or more surfaces by the means of a thin wire which is ultrasonically bonded to those surfaces and provides an electrical connection. While this method is well established in the microelectronics industry its popularity is [...] Read more.
Wire bonding is a method of connecting two or more surfaces by the means of a thin wire which is ultrasonically bonded to those surfaces and provides an electrical connection. While this method is well established in the microelectronics industry its popularity is rising in the area of cylindrical lithium-ion battery pack manufacturing. Previous studies have shown that even in experimental conditions this process might be unstable which was indicated by the high standard deviation of the bonds shear test results. This might have been related to contamination of the interface area between the joined materials. The aim of this study was to determine the impact of surface laser cleaning on the properties of the wire-bonded joint. The results have shown that laser cleaning with 40% power of the 30 W ATMS4060 laser marker helps to reduce the standard deviation of the shear test results from 16.1% for the uncleaned sample down to 2.6% and greatly reduces the number of oxides within the interface area of the bond cross section. Cleaning with 80% of the laser power did not have a further impact on shear test results and almost completely eliminated oxides from the bonded materials interface. Full article
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