Advances in Optical Communication and Optical Computing

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Optoelectronics".

Deadline for manuscript submissions: 16 September 2024 | Viewed by 745

Special Issue Editor


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Guest Editor
Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
Interests: semiconductors; photodetectors; optics communication

Special Issue Information

Dear Colleagues,

With the development of information technology, optics technology has emerged as a game-changer in various scientific, technological, and industrial domains, offering significant advantages over traditional electronic components and systems. Optical technologies offer high-speed data transmission, increased bandwidth, and energy efficiency, making them essential for addressing the growing demands of modern communication and computing systems. This Special Issue aims to highlight recent advancements and breakthroughs in optical communication and optical computing, exploring their transformative impact on various domains.

In this Special Issue, original research articles and reviews are welcome. Research areas may include, but are not limited to, the following:

  • Advanced modulation and coding techniques for optical communication;
  • Next-generation optical networking architectures;
  • Optical materials and devices for optical communication systems;
  • Optical interconnects and network-on-chip architectures for neuromorphic computing;
  • Novel approaches in optical signal processing and optical computing algorithms;
  • Optics-based data storage and memory technologies;
  • Emerging applications of optics in artificial intelligence and machine learning;
  • Optical sensing and imaging for biomedical, environmental, and industrial applications;
  • Integration of optics with electronics for hybrid systems.

Prof. Dr. Jiaoqing Pan
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • optical communications
  • optical computing
  • optical sensing
  • artificial intelligence
  • integrated optics
  • silicon optics
  • optical devices
  • optical systems

Published Papers (1 paper)

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Research

18 pages, 9007 KiB  
Article
Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration
by Tzu-Jung Huang, Tobias Kiebala, Paul Suflita, Chad Moore, Graeme Housser, Shane McMahon and Ivan Puchades
Electronics 2024, 13(10), 1818; https://doi.org/10.3390/electronics13101818 - 8 May 2024
Viewed by 484
Abstract
Advanced electronics technology is moving towards smaller footprints and higher computational power. In order to achieve this, advanced packaging techniques are currently being considered, including organic, glass, and semiconductor-based substrates that allow for 2.5D or 3D integration of chips and devices. Metal-core substrates [...] Read more.
Advanced electronics technology is moving towards smaller footprints and higher computational power. In order to achieve this, advanced packaging techniques are currently being considered, including organic, glass, and semiconductor-based substrates that allow for 2.5D or 3D integration of chips and devices. Metal-core substrates are a new alternative with similar properties to those of semiconductor-based substrates but with the added benefits of higher flexibility and metal ductility. This work comprehensively compares the thermal properties of a novel metal-based substrate, molybdenum, and silicon and fused silica glass substrates in the context of system-on-foil (SoF) integration. A simple electronic technique is used to simulate the heat generated by a typical CPU and to measure the heat dissipation properties of the substrates. The results indicate that molybdenum and silicon are able to effectively dissipate a continuous power density of 2.3 W/mm2 as the surface temperature only increases by ~15 °C. In contrast, the surface temperature of fused silica glass substrates increases by >140 °C for the same applied power. These simple techniques and measurements were validated with infrared camera measurements as well as through finite element analysis via COMSOL simulation. The results validate the use of molybdenum as an advanced packaging substrate and can be used to characterize new substrates and approaches for advanced packaging. Full article
(This article belongs to the Special Issue Advances in Optical Communication and Optical Computing)
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