Selected Papers from 2023 IET International Conference on Engineering Technologies and Applications
A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Industrial Electronics".
Deadline for manuscript submissions: closed (29 February 2024) | Viewed by 1160
Special Issue Editors
Interests: DSP IC design; computer vision; image processing; cognitive learning
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
The 2023 IET International Conference on Engineering Technologies and Applications (IET ICETA 2023) will be held on October 21–23 in Yunlin, Taiwan. IET ICETA 2023 aims to provide a platform for experts, scholars, and researchers from all over the world to convene and share novel ideas on engineering fields. Authors of accepted papers are invited to submit the extended versions (at least 60% extension for the submissions) of their original papers and contributions.
The topics of interest include, but are not limited to, the following:
- Artificial Intelligence, Machine Learning, and Deep Learning;
- Internet of Things;
- Audio/Video Systems and Signal Processing;
- Semiconductors and Integrated Circuits;
- Green Energy;
- Mechatronic Integration;
- Communications and Networks;
- Automation and Control;
- Vehicle-to-Everything and Autonomous Vehicles;
- Big Data and Clouds;
- Advanced Computing and Data Sciences;
- Lean Management;
- Smart and Intelligent Manufacturing;
- RF and Microwaves;
- ET Technology;
- Power Devices and Systems;
- Security and Privacy;
- Computer Software and Hardware;
- Consumer Electronics;
- Virtual Reality, Augmented Reality, Mixed Reality, and Cinematic Reality;
- Opto-Electronic Materials, Devices, Circuits, and Systems;
- Advanced Materials and Devices;
- Sensors and Actuators;
- Sustainable Development;
- Technology and Education;
- Advanced Technologies and Applications.
Prof. Dr. Chih-Hsien Hsia
Prof. Dr. Chi-Chia Sun
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- artificial intelligence
- big data and clouds
- signal processing
- virtual reality
- Internet of Things
