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Electronics
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Advanced Wireless Technologies for Next-G Networks: Antennas, Circuits, and Systems
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Advanced Wireless Technologies for Next-G Networks: Antennas, Circuits, and Systems

A special issue of Electronics (ISSN 2079-9292). This special issue belongs to the section "Microwave and Wireless Communications".

Deadline for manuscript submissions: 15 June 2024 | Viewed by 3533

Special Issue Editors

Dr. Ya Fei Wu

E-Mail Website
Guest Editor
School of Electronic Science and Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
Interests: antennas; RF microsystems
Dr. Ji-Wei Lian

E-Mail Website
Guest Editor
School of Microelectronics, Nanjing University of Science and Technology, Nanjing 210094, China
Interests: millimeter-wave antenna; metasurface antenna; feeding network
Dr. Yujie Zhang

E-Mail Website
Guest Editor
Department of Electrical and Computer Engineering, National University of Singapore, Singapore 117576, Singapore
Interests: antenna design on the Internet-of-Things applications; reconfigurable intelligent antenna and surface; MIMO systems; millimeter wave; RF energy harvesting; wireless power transmission and 6G
Dr. Zijian Shao

E-Mail Website
Guest Editor
Department of Electrical and Computer Engineering, Princeton University, Princeton, NJ 08540, USA
Interests: antennas; integrated electronics; RFICs

Special Issue Information

Dear Colleagues,

With continuously evolving wireless communication technologies and the imminent arrival of Next-G networks, innovative solutions to antennas, circuits, and systems are needed. This Special Issue of Electronics seeks to amalgamate state-of-the-art research and developments in the field of advanced wireless technologies, thereby facilitating the imminent generation of wireless communication systems. The compendium aspires to not only showcase the vanguard of current technological advancements, but also to instigate discourse on the potential future directions, ensuring a comprehensive understanding and readiness for the challenges and opportunities presented by Next-G networks.

This Special Issue aims to provide a platform for researchers, engineers, and academics to share their latest findings and insights into antennas, circuits, and systems designed for Next-G  networks. The topics of interest include, but are not limited to:

  • Advanced antenna design and optimization for 5G and beyond.
  • Millimeter-wave and terahertz antennas for high-speed data transmission.
  • Novel circuit designs for efficient and high-performance wireless communication.
  • The integration of RF and microwave circuits with advanced signal processing techniques.
  • MIMO and beamforming technologies for enhanced network capacity.
  • Energy-efficient wireless systems and power management.
  • Antenna and circuit solutions for emerging applications such as IoT, smart cities, and autonomous vehicles.
  • Security and privacy considerations in Next-G network technologies.

Dr. Ya Fei Wu
Dr. Ji-Wei Lian
Dr. Yujie Zhang
Dr. Zijian Shao
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Electronics is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2400 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • antenna design and optimization
  • millimeter-wave and terahertz antennas
  • circuit designs
  • integration of RF system
  • MIMO and beamforming technologies
  • wireless systems
  • next-G network technologies

Published Papers (6 papers)

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Research

8 pages, 3108 KiB  
Communication
A High-Gain Metallic-via-Loaded Antipodal Vivaldi Antenna for Millimeter-Wave Application
by Jun Li, Junjie Huang, Hongli He and Yanjie Wang
Electronics 2024, 13(10), 1898; https://doi.org/10.3390/electronics13101898 - 12 May 2024
Viewed by 395
Abstract
This paper presents a miniaturized-structure high-gain antipodal Vivaldi antenna (AVA) operating in the millimeter-wave (mm-wave) band. A gradient-length microstrip-patch-based director is utilized on the flares of the AVA to enhance gain. Additionally, an array of metallic vias is incorporated along the lateral and [...] Read more.
This paper presents a miniaturized-structure high-gain antipodal Vivaldi antenna (AVA) operating in the millimeter-wave (mm-wave) band. A gradient-length microstrip-patch-based director is utilized on the flares of the AVA to enhance gain. Additionally, an array of metallic vias is incorporated along the lateral and horizontal edges of the antenna for further gain enhancement and bandwidth extension. Based on the proposed structure, the AVA can achieve a peak gain of 11.9 dBi over a relative bandwidth of 71.24% within 16.5–36.6 GHz as measured, while the electrical dimension is only 1.54 × 2.69 × 0.07 λc3. The measured results show good agreement with the simulated ones. Owning the characteristics of being high-gain and ultra-wideband, and having a compact size, the proposed AVA can be a competitive candidate for future millimeter-wave communication. Full article
(This article belongs to the Special Issue Advanced Wireless Technologies for Next-G Networks: Antennas, Circuits, and Systems)
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18 pages, 31412 KiB  
Article
Design of a 3-Bit Circularly Polarized Reconfigurable Reflectarray
by Zhe Chen, Chenlu Huang, Xinmi Yang, Xiaoming Yan, Xianqi Lin and Yedi Zhou
Electronics 2024, 13(10), 1886; https://doi.org/10.3390/electronics13101886 - 11 May 2024
Viewed by 300
Abstract
In this paper, a 3-bit circularly polarized reconfigurable reflectarray is proposed. The array consists of 64 units in an 8 × 8 configuration, with each unit containing a circular metal patch loaded with phase-delay lines and eight PIN diodes. To independently control each [...] Read more.
In this paper, a 3-bit circularly polarized reconfigurable reflectarray is proposed. The array consists of 64 units in an 8 × 8 configuration, with each unit containing a circular metal patch loaded with phase-delay lines and eight PIN diodes. To independently control each unit, a corresponding DC control circuit was designed and tested with the array. In the bandwidth of 3.43–3.71 GHz, the circularly polarized reconfigurable reflectarray achieved a gain of 16 dB, an aperture efficiency of 27%, an axial ratio of ≤3 dB, an operating bandwidth of 8%, and a beam scanning range of ±60°. The circularly polarized reconfigurable reflectarray can also achieve a good dual-beam radiation performance after testing. The 3-bit circularly polarized reconfigurable reflectarray proposed in this paper offers several advantages, including low loss, high aperture efficiency, a wide beam scanning range, and excellent stability in wide-angle oblique incidence. It has potential applications in low-cost phased array, satellite communications, and deep space exploration. Full article
(This article belongs to the Special Issue Advanced Wireless Technologies for Next-G Networks: Antennas, Circuits, and Systems)
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16 pages, 3903 KiB  
Article
A Broadband Three-Way Series Doherty Power Amplifier with Deep Power Back-Off Efficiency Enhancement for 5G Application
by Xianfeng Que, Jun Li and Yanjie Wang
Electronics 2024, 13(10), 1882; https://doi.org/10.3390/electronics13101882 - 11 May 2024
Viewed by 364
Abstract
This article presents a new broadband three-way series Doherty power amplifier (DPA) topology, which enables a broadband output power back-off (OBO) efficiency enhancement of up to 10 dB or higher. The proposed DPA topology achieves Doherty load modulation and three-way power combining through [...] Read more.
This article presents a new broadband three-way series Doherty power amplifier (DPA) topology, which enables a broadband output power back-off (OBO) efficiency enhancement of up to 10 dB or higher. The proposed DPA topology achieves Doherty load modulation and three-way power combining through a transformer, which requires only a low coupling factor, thus facilitating its implementation in double-sided PCBs or monolithic microwave integrated circuit (MMIC) processes. The design equations for the proposed DPA topology are proposed and analyzed in detail. A proof-of-concept PA at the 2.1–2.8 GHz band using commercial GaN transistors was designed and fabricated to validate the proposed concept. Within the operating frequency band, it achieves a saturated output power (Psat) of 44.5–46.5 dBm with a peak drain efficiency (DE) of 60–72%, and 43–52% DE at 10 dB OBO. Moreover, under a 20 MHz long-term evolution (LTE)-modulated signal, the PA demonstrates a 36.8–37.5 dBm average output power (Pavg) and 47–53% average drain efficiency (DEavg). Notably, the adjacent channel leakage ratio (ACLR) is as low as −35–−28.2 dBc without any digital predistortion (DPD). Full article
(This article belongs to the Special Issue Advanced Wireless Technologies for Next-G Networks: Antennas, Circuits, and Systems)
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20 pages, 1057 KiB  
Article
Low-Resolution Optimization for an Unmanned Aerial Vehicle Communication Network under a Passive Reconfigurable Intelligent Surface and Active Reconfigurable Intelligent Surface
by Qiangqiang Yang, Yufeng Chen, Zhiyu Huang, Hongwen Yu and Yong Fang
Electronics 2024, 13(10), 1826; https://doi.org/10.3390/electronics13101826 - 8 May 2024
Viewed by 338
Abstract
This paper investigates the optimization of an unmanned aerial vehicle (UAV) network serving multiple downlink users equipped with single antennas. The network is enhanced by the deployment of either a passive reconfigurable intelligent surface (RIS) or an active RIS. The objective is to [...] Read more.
This paper investigates the optimization of an unmanned aerial vehicle (UAV) network serving multiple downlink users equipped with single antennas. The network is enhanced by the deployment of either a passive reconfigurable intelligent surface (RIS) or an active RIS. The objective is to jointly design the UAV’s trajectory and the low-bit, quantized, RIS-programmable coefficients to maximize the minimum user rate in a multi-user scenario. To address this optimization challenge, an alternating optimization framework is employed, leveraging the successive convex approximation (SCA) method. Specifically, for the UAV trajectory design, the original non-convex optimization problem is reformulated into an equivalent convex problem through the introduction of slack variables and appropriate approximations. On the other hand, for the RIS-programmable coefficient design, an efficient algorithm is developed using a penalty-based approximation approach. To solve the problems with the proposed optimization, high-performance optimization tools such as CVX are utilized, despite their associated high time complexity. To mitigate this complexity, a low-complexity algorithm is specifically tailored for the optimization of passive RIS-programmable reflecting elements. This algorithm relies solely on closed-form expressions to generate improved feasible points, thereby reducing the computational burden while maintaining reasonable performance. Extensive simulations are created to validate the performance of the proposed algorithms. The results demonstrate that the active RIS-based approach outperforms the passive RIS-based approach. Additionally, for the passive RIS-based algorithms, the low-complexity variant achieves a reduced time complexity with a moderate loss in performance. Full article
(This article belongs to the Special Issue Advanced Wireless Technologies for Next-G Networks: Antennas, Circuits, and Systems)
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15 pages, 4907 KiB  
Article
Design of UWB Electrically Small Antenna Based on Distributed Passive Network Loading
by Zhe Chen, Xianqi Lin, Yuchen Luan, Xinjie Hao, Xiaoming Yan and Guo Liu
Electronics 2024, 13(5), 914; https://doi.org/10.3390/electronics13050914 - 28 Feb 2024
Viewed by 703
Abstract
In this paper, an ultra-wideband electrically small antenna based on distributed passive network loading is proposed. Based on the Vivaldi antenna theory, magnetic dipole antenna theory, and distributed loading theory, the electrically small antenna achieves the purpose of being wideband using a three-dimensional [...] Read more.
In this paper, an ultra-wideband electrically small antenna based on distributed passive network loading is proposed. Based on the Vivaldi antenna theory, magnetic dipole antenna theory, and distributed loading theory, the electrically small antenna achieves the purpose of being wideband using a three-dimensional design of a planar Vivaldi antenna structure under limited space constraints. At the same time, the magnetic dipole antenna is introduced to effectively expand the low-frequency bandwidth of the electrically small antenna without increasing the aperture size. Finally, through the distributed passive network loading, the wideband-conjugated matching of the electrically small antenna is achieved without increasing the size of the electrically small antenna. The −6 dB bandwidth of the electrically small antenna is 0.2 GHz–3 GHz, and the overall size is 0.06 λ0 × 0.05 λ0 × 0.12 λ0, where λ0 is the wavelength of the lowest frequency of the antenna. One sample of the proposed UWB electrically small antenna is fabricated and tested. Good agreement between simulation results and measurement results are obtained. The design method of UWB electrically small antenna proposed in this paper can be applied to the base station antenna, low-frequency detection, microwave sensing, and microwave measurement. Full article
(This article belongs to the Special Issue Advanced Wireless Technologies for Next-G Networks: Antennas, Circuits, and Systems)
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12 pages, 4621 KiB  
Article
Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications
by Yuhang Yin, Chenhui Xia, Shuli Liu, Zhimo Zhang, Chen Chen, Gang Wang, Chenqian Wang and Yafei Wu
Electronics 2024, 13(5), 839; https://doi.org/10.3390/electronics13050839 - 22 Feb 2024
Viewed by 770
Abstract
In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ0). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, while [...] Read more.
In this paper, a novel through mold via (TMV)-embedded fan-out wafer-level package (FOWLP) technology was demonstrated to manufacture the well-designed Antenna in Package (AiP) with ultrathin thickness (0.04 λ0). Double-sided redistribution layers (RDLs) were employed to build the patch antenna, while a TMV interposer was used to connect the front and back RDLs. By optimizing the AiP’s parameters, the patch antenna can achieve a wide impedance bandwidth of 17.8% from 24.2 to 28.5 GHz, which can cover the 5G frequency bands. Compared with previous works, the proposed AiP has significant benefits in terms of its ultralow profile, easy processing, and high gain. Hence, the TMV-embedded FOWLP should be a promising technology for fifth generation (5G) millimeter wave (mm-Wave) applications. Full article
(This article belongs to the Special Issue Advanced Wireless Technologies for Next-G Networks: Antennas, Circuits, and Systems)
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