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Energies
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Intelligent Control and Management of Thermal Energy for Electronic Equipment
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Intelligent Control and Management of Thermal Energy for Electronic Equipment

A special issue of Energies (ISSN 1996-1073). This special issue belongs to the section "F: Electrical Engineering".

Deadline for manuscript submissions: 18 May 2024 | Viewed by 953

Special Issue Editors

Prof. Dr. Xiaoming Zhou

E-Mail Website
Guest Editor
School of Mechanical and Electrical Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
Interests: thermal design; thermal management; modeling and simulation; bio-heat/mass transfer
Dr. Xin Zhang

E-Mail Website
Guest Editor
School of Mechanical and Electrical Engineering, University of Electronic Science and Technology of China, Chengdu 611731, China
Interests: thermal design; thermal simulation; thermoelectric modeling; solid mechanics

Special Issue Information

Dear Colleagues,

Electronic devices generate heat, and that heat must be dissipated. As they strive to optimize the performance of increasingly powerful and higher temperature systems squeezed into ever smaller form factors, thermal management looms as one of the biggest challenges facing designers today. Effective thermal management is crucial to the optimal operation of electronic equipment and its health management. A lot of efforts have been made and various new strategies, structures, and materials have been developed over the past few decades. However, there are still some limitations and challenges in this field. Recently, serval intelligent techniques have emerged, showing great potential to address the growing need for better thermal management.

This Special Issue aims to provide a collection of the latest research and findings in the field of the Intelligent Control and Management of Thermal Energy for Electronic Equipment. Both research and review papers are welcome to be submitted to this Special Issue. Potential research topics include, but are not limited to, the following:

  • Intelligent control strategy;
  • Functional materials for intelligent thermoregulation;
  • Self-adaption thermal structure;
  • Intelligent thermal modeling;
  • Intelligent thermal design;
  • High flux heat dissipation.

Prof. Dr. Xiaoming Zhou
Dr. Xin Zhang
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Energies is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thermal management
  • thermal control
  • intelligent control
  • self-adaption
  • adaptive cooling

Published Papers (1 paper)

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Research

11 pages, 2531 KiB  
Article
Multiphysics Simulation of a Novel Self-Adaptive Chip Cooling with a Temperature-Regulated Metal Pillar Array in Microfluidic Channels
by Liyin Xiang, Rui Yang, Dejun Zhang and Xiaoming Zhou
Energies 2024, 17(1), 127; https://doi.org/10.3390/en17010127 - 25 Dec 2023
Viewed by 746
Abstract
Conventional liquid cooling techniques may provide effective chip cooling but at the expense of high pumping power consumption. Considering that there is dynamic heat load in practice, a self-adaptive cooling technique is desired to reduce operational costs while preserving inherent cooling effectiveness. In [...] Read more.
Conventional liquid cooling techniques may provide effective chip cooling but at the expense of high pumping power consumption. Considering that there is dynamic heat load in practice, a self-adaptive cooling technique is desired to reduce operational costs while preserving inherent cooling effectiveness. In this work, a novel self-adaptive cooling strategy is presented to balance the thermal and flow efficiency in accordance with the dynamic thermal load, based on temperature-regulated movement of the metal pillar array in a microfluidic channel. With an illustrative device, the effectiveness of such a strategy is investigated using multiphysics modeling and simulation. As a case study, the device is considered to be initiated with a chip power of 5 W and an inlet coolant velocity of 0.3 m/s. It is shown that the temperature-regulated movement of the metal pillar heat sink will be activated rapidly and equilibrate within 30 s. Parts of the metal pillars immerse into the coolant flow, resulting in significantly improved heat transfer efficiency. The diminished thermal resistance leads to a reduction in chip temperature rise from 225 K (without structural adaptation) to 91.86 K (with structural adaption). Meanwhile, the immersion of metal pillars into the coolant also causes an increased flow resistance in the microfluidic channel (i.e., pressure drop increases from 859.27 Pa to 915.98 Pa). Nevertheless, the flow resistance decreases spontaneously when the working power of the chip decreases. Comprehensive simulation has demonstrated that the temperature-regulated structure works well under various conditions. Therefore, it is believed that the presented self-adaptive cooling strategy offers simple and cost-effective thermal management for modern electronics with dynamic heat fluxes. Full article
(This article belongs to the Special Issue Intelligent Control and Management of Thermal Energy for Electronic Equipment)
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