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Chemical Vapor Deposition (CVD) Techniques in Materials Science for Electronic Devices Applications

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Thin Films and Interfaces".

Deadline for manuscript submissions: 10 May 2024 | Viewed by 1209

Special Issue Editors


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Guest Editor
National Institute of Astrophysics, Optics and Electronics (INAOE), Electronics Department, Puebla 72840, México
Interests: amorphous semiconductors; nano and microcrystalline materials; silicon–germanium alloys; sensors; microbolometers; silicon solar cells; HIT solar cells

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Guest Editor
National Institute of Astrophysics, Optics and Electronics (INAOE), Electronics department, Puebla 72840, México
Interests: amorphous semiconductors; silicon-Germanium alloys; sensors; microbolometers; thermoelectric devices
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Special Issue Information

Dear Colleagues,

At the present time, different chemical vapor deposition (CVD) techniques have become an essential part of the semiconductor industry and materials research for the development of a large variety of materials with applications in electronic devices. Atmospheric pressure CVD (APCVD), low-pressure CVD (LPCVD), plasma-enhanced CVD (PECVD) and hot wire CVD (HWCVD) are the most used techniques for the deposition of amorphous, nanocrystalline, microcrystalline and polycrystalline phases of semiconductors. Those materials are employed on thin film devices, as sensors, thin film solar cells, thin film transistors (TFTs), light-emitting diodes (LEDs), silicon heterojunction solar cells (HIT) and micro-electro-mechanical systems (MEMS), among others.  

This Special Issue invites original articles dedicated to the following topics, in which CVD techniques are used: deposition and characterization of amorphous semiconductors, hydrogenated amorphous silicon (a-Si:H) and alloys, as hydrogenated amorphous silicon–germanium (a-SiGe:H), and their application on electronic devices; hydrogenated amorphous silicon carbide (a-SiC:H) for applications in light emission and LEDs; nano- and microcrystalline silicon (nc-Si, µc-Si:H) and their applications in devices, as thin film solar cells and TFTs; polycrystalline silicon (poly-Si) and its application on MEMS; infrared sensors as microbolometers based on a-Si:H and a-SiGe:H; silicon-rich oxide (SRO) for light emission applications and UV sensors; heterojunction solar cells (HIT) based on crystalline silicon (c-Si:H) and a-Si:H thin films.

Dr. Mario Moreno Moreno
Dr. Alfonso Torres
Guest Editors

Manuscript Submission Information

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • thin films
  • CVD
  • LPCVD
  • PECVD
  • HWCVD
  • amorphous semiconductors
  • microcrystalline semiconductors
  • silicon
  • germanium
  • silicon–germanium
  • silicon–carbide
  • silicon-rich oxide

Published Papers (1 paper)

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Research

18 pages, 19065 KiB  
Article
Optical and Structural Properties of Aluminum Nitride Epi-Films at Room and High Temperature
by Yanlian Yang, Yao Liu, Lianshan Wang, Shuping Zhang, Haixia Lu, Yi Peng, Wenwang Wei, Jia Yang, Zhe Chuan Feng, Lingyu Wan, Benjamin Klein, Ian T. Ferguson and Wenhong Sun
Materials 2023, 16(23), 7442; https://doi.org/10.3390/ma16237442 - 30 Nov 2023
Viewed by 854
Abstract
The high-quality aluminum nitride (AlN) epilayer is the key factor that directly affects the performance of semiconductor deep-ultraviolet (DUV) photoelectronic devices. In this work, to investigate the influence of thickness on the quality of the AlN epilayer, two AlN-thick epi-film samples were grown [...] Read more.
The high-quality aluminum nitride (AlN) epilayer is the key factor that directly affects the performance of semiconductor deep-ultraviolet (DUV) photoelectronic devices. In this work, to investigate the influence of thickness on the quality of the AlN epilayer, two AlN-thick epi-film samples were grown on c-plane sapphire substrates. The optical and structural characteristics of AlN films are meticulously examined by using high-resolution X-ray diffraction (HR-XRD), scanning electron microscopy (SEM), a dual-beam ultraviolet-visible spectrophotometer, and spectroscopic ellipsometry (SE). It has been found that the quality of AlN can be controlled by adjusting the AlN film thickness. The phenomenon, in which the thicker AlNn film exhibits lower dislocations than the thinner one, demonstrates that thick AlN epitaxial samples can work as a strain relief layer and, in the meantime, help significantly bend the dislocations and decrease total dislocation density with the thicker epi-film. The Urbach’s binding energy and optical bandgap (Eg) derived by optical transmission (OT) and SE depend on crystallite size, crystalline alignment, and film thickness, which are in good agreement with XRD and SEM results. It is concluded that under the treatment of thickening film, the essence of crystal quality is improved. The bandgap energies of AlN samples obtained from SE possess larger values and higher accuracy than those extracted from OT. The Bose–Einstein relation is used to demonstrate the bandgap variation with temperature, and it is indicated that the thermal stability of bandgap energy can be improved with an increase in film thickness. It is revealed that when the thickness increases to micrometer order, the thickness has little effect on the change of Eg with temperature. Full article
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