materials-logo

Journal Browser

Journal Browser

Intermetallic Alloys: Preparation, Properties and Applications

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Metals and Alloys".

Deadline for manuscript submissions: closed (10 August 2023) | Viewed by 14737

Special Issue Editor


E-Mail Website
Guest Editor
Faculty of Mechanical Engineering, Jan Evangelista Purkyně University in Ústí nad Labem, Ústí nad Labem, Czech Republic
Interests: intermetallic alloys; powder metallurgy; titanium alloys; aluminum alloys; mechanical alloying; spark plasma sintering
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Intermetallics are a special group of metallic materials whose properties allow use under conditions in which conventional metallic materials fail—these conditions include high temperatures, aggressive corrosive environments, and extreme abrasive and adhesive stresses.

Many intermetallic compounds show very good physical and mechanical properties, specifically very good thermal stability, high melting point, good corrosion resistance, and low density, which makes them suitable candidates for high-temperature applications. However, these materials show limited ductility and higher brittleness, especially at low temperatures, which is an obstacle to their wider use.

The use of materials based on intermediate compounds is very diverse, but it is always necessary to consider the choice of a particular material in terms of its physical or mechanical properties. They are used, for example, as construction materials, shape memory materials (NiTi), heating elements of electric resistance furnaces (MoSi2), magnetic alloys (Ni3Fe), hydrogen storage materials (Mg2Ni, LaNi5) or high temperature materials (TiAl, NiAl), or for strongly oxidizing environments (FeAl).

It is my great pleasure to invite all researchers from the community of researchers studying intermetallics to submit a manuscript in the field for this Special Issue “Intermetallic Alloys: Preparation, Properties and Applications”. Full papers, communications, and reviews are all welcome.

Dr. Anna Knaislová
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • intermetallic alloys
  • powder metallurgy
  • aluminides
  • preparation
  • characterization
  • microstructure
  • mechanical properties
  • corrosion resistance
  • sintering

Benefits of Publishing in a Special Issue

  • Ease of navigation: Grouping papers by topic helps scholars navigate broad scope journals more efficiently.
  • Greater discoverability: Special Issues support the reach and impact of scientific research. Articles in Special Issues are more discoverable and cited more frequently.
  • Expansion of research network: Special Issues facilitate connections among authors, fostering scientific collaborations.
  • External promotion: Articles in Special Issues are often promoted through the journal's social media, increasing their visibility.
  • e-Book format: Special Issues with more than 10 articles can be published as dedicated e-books, ensuring wide and rapid dissemination.

Further information on MDPI's Special Issue polices can be found here.

Published Papers (7 papers)

Order results
Result details
Select all
Export citation of selected articles as:

Research

10 pages, 2062 KiB  
Article
Investigation of Microstructure and Wear Properties of Precipitates-Strengthened Cu-Ni-Si-Fe Alloy
by Chun-Hao Peng, Po-Yu Hou, Woei-Shyang Lin, Pai-Keng Shen, Hao-Hsuan Huang, Jien-Wei Yeh, Hung-Wei Yen, Cheng-Yao Huang and Che-Wei Tsai
Materials 2023, 16(3), 1193; https://doi.org/10.3390/ma16031193 - 30 Jan 2023
Cited by 2 | Viewed by 1835
Abstract
Based on multi-component alloys using precipitation hardening, a Cu-Ni-Si-Fe copper alloy was prepared and studied for hardness, electrical conductivity, and wear resistance. Copper Nickel Silicon (Cu-Ni-Si) intermetallic compounds were observed as precipitates, leading to an increase in mechanical and physical properties. Further, the [...] Read more.
Based on multi-component alloys using precipitation hardening, a Cu-Ni-Si-Fe copper alloy was prepared and studied for hardness, electrical conductivity, and wear resistance. Copper Nickel Silicon (Cu-Ni-Si) intermetallic compounds were observed as precipitates, leading to an increase in mechanical and physical properties. Further, the addition of Fe was discussed in intermetallic compound formation. Moreover, microstructures, age hardening, and dry sliding wear resistances of the present alloy were analyzed and compared with C17200 beryllium copper. The results showed that the present alloy performed extraordinarily, with 314 HV in hardness and 22.2 %IACS in conductivity, which is almost similar to C17200 alloy. Furthermore, the dry sliding wear resistance of the present alloy was 2199.3 (m/MPa·mm3) at an ambient temperature, leading to an improvement of 208% compared with the C17200 alloy. Full article
(This article belongs to the Special Issue Intermetallic Alloys: Preparation, Properties and Applications)
Show Figures

Figure 1

9 pages, 6489 KiB  
Article
Investigation of the Superlattice Phases Formed in Ta72Ru28
by Alexander W. Carruthers, Bradley A. Young and Ed J. Pickering
Materials 2023, 16(2), 720; https://doi.org/10.3390/ma16020720 - 11 Jan 2023
Viewed by 1384
Abstract
The Ta-Ru binary phase diagram has not been fully investigated, but shows potential for a two-phase region of A2 + B2. Given the high melting points of both Ta and Ru, such an alloy would have the potential for high temperature strength. A [...] Read more.
The Ta-Ru binary phase diagram has not been fully investigated, but shows potential for a two-phase region of A2 + B2. Given the high melting points of both Ta and Ru, such an alloy would have the potential for high temperature strength. A Ta72Ru28 alloy was arc melted and investigated in the as-cast and aged (at 1000 °C) states. The as cast alloy was composed of A2 and B2, albeit not in a superalloy-like morphology. A third phase was found in the aged alloy, which has not been reported before, and which is also a coherent superlattice phase of the Ta BCC matrix. The structure of this phase was found to be consistent with the tetragonal Cr2Al prototype structure, with lattice parameters of (a, a, 3a), where a is the Ta BCC lattice parameter. Full article
(This article belongs to the Special Issue Intermetallic Alloys: Preparation, Properties and Applications)
Show Figures

Graphical abstract

9 pages, 2779 KiB  
Communication
Molten Salt Synthesis of Intermetallic Compound TiNi Nanopowder Passivated by TiOx Shell Prepared from NiTiO3 for Catalytic Hydrogenation
by Yasukazu Kobayashi, Shota Yokoyama and Ryo Shoji
Materials 2022, 15(23), 8536; https://doi.org/10.3390/ma15238536 - 30 Nov 2022
Cited by 2 | Viewed by 1523
Abstract
Titanium-nickel alloy is an attractive material due to its unique properties of shape memory effect, superior elasticity, and biocompatibility. Generally, Ti-Ni alloy powders are prepared from pure elemental powders of Ti and Ni as starting materials, but it is an energy-intensive process to [...] Read more.
Titanium-nickel alloy is an attractive material due to its unique properties of shape memory effect, superior elasticity, and biocompatibility. Generally, Ti-Ni alloy powders are prepared from pure elemental powders of Ti and Ni as starting materials, but it is an energy-intensive process to obtain pure titanium. In this study, intermetallic compound TiNi powder passivated by TiOx shell was prepared by directly reducing a commercial NiTiO3 using CaH2 reducing agent in a molten LiCl at 650 °C. Analyses by X-ray diffraction, scanning electron microscopy/transmission electron microscopy with energy-dispersive X-ray spectroscopy and X-ray photoelectron spectroscopy revealed that the powder had a core–shell structure, with the core of TiNi and the shell of TiOx-rich composition with scarce metallic Ni nicely catalyzing hydrogenation reactions with good recyclability and stability. Full article
(This article belongs to the Special Issue Intermetallic Alloys: Preparation, Properties and Applications)
Show Figures

Figure 1

15 pages, 2649 KiB  
Article
The Polyol Process and the Synthesis of ζ Intermetallic Compound Ag5Sn0.9
by Roland Mahayri, Mohammed Ali Bousnina, Silvana Mercone, Ky-Lim Tan, Jean-Michel Morelle, Frédéric Schoenstein and Noureddine Jouini
Materials 2022, 15(22), 8276; https://doi.org/10.3390/ma15228276 - 21 Nov 2022
Cited by 1 | Viewed by 2347
Abstract
The present work concerns the intermetallic compound (IMC) existing in the Ag–Sn system and its potential use in electronics as attachment materials allowing the adhesion of the chip to the substrate forming the power module. First, we present the synthesis protocol in polyol [...] Read more.
The present work concerns the intermetallic compound (IMC) existing in the Ag–Sn system and its potential use in electronics as attachment materials allowing the adhesion of the chip to the substrate forming the power module. First, we present the synthesis protocol in polyol medium of a compound with the chemical formula Ag5Sn0.9 belonging to the solid solution of composition located between 9 and 16 at.% Sn, known as solid solution ζ (or ζ-Ag4Sn). This phase corresponds to the peritectic invariant point at 724 °C. Differential thermal analysis and X-ray dispersive analysis confirm the single-phased (monocrystalline) nature of the Ag5Sn0.9 powder issued after synthesis. Scanning electron microscopy shows that Ag5Sn0.9 particles are spherical, and range in submicronic size of around 0.18 μm. X-ray diffraction analysis reveals that the ζ phase mostly exists under the two allotropic varieties (orthorhombic symmetry and hexagonal symmetry) with however a slight excess of the hexagonal variety (60% for the hexagonal variety and 40% for the orthorhombic variety). The lattice parameters resulting from this study for the two allotropic varieties are in good agreement with the Hume-Rothery rules. Full article
(This article belongs to the Special Issue Intermetallic Alloys: Preparation, Properties and Applications)
Show Figures

Figure 1

17 pages, 6934 KiB  
Article
Influence of the Al Content on the Properties of Mechanically Alloyed CoCrFeNiMnXAl20−X High-Entropy Alloys
by Hana Thürlová and Filip Průša
Materials 2022, 15(22), 7899; https://doi.org/10.3390/ma15227899 - 9 Nov 2022
Cited by 5 | Viewed by 1587
Abstract
The equiatomic CoCrFeNiMn alloy prepared by mechanical alloying and spark plasma sintering underwent partial substitution of Mn by Al (5, 10 and 15 at.%) to determine its influence on mechanical properties and thermal stability. It was discovered that the higher the Al content, [...] Read more.
The equiatomic CoCrFeNiMn alloy prepared by mechanical alloying and spark plasma sintering underwent partial substitution of Mn by Al (5, 10 and 15 at.%) to determine its influence on mechanical properties and thermal stability. It was discovered that the higher the Al content, the higher the volume fraction of the hard phase with primitive cubic (PC) crystallographic lattice, which increases the hardness and strength of the alloys. The most promising mechanical properties have been achieved in the CoCrFeNiMn5Al15 alloy reaching the compressive yield strength (CYS) of 2135 ± 21 MPa and the ultimate compressive strength (UCS) of 2496 ± 21 MPa. All the prepared alloys showed good thermal stability as they maintained or only slightly reduced their initial hardness during the 100 h annealing at 800 °C. Furthermore, the higher the Al content, the higher the resistance against high-temperature oxidation. The oxidic layer changed its composition from Mn-oxides (CoCrFeNiMn15Al15 alloy) to Al-based oxides with exceptional protective properties. Full article
(This article belongs to the Special Issue Intermetallic Alloys: Preparation, Properties and Applications)
Show Figures

Figure 1

15 pages, 13139 KiB  
Article
Microstructural Characteristics of Al-Ti-B Inoculation Wires and Their Addition to the AlSi7Mg0.3 Alloy
by Anna Knaislová, Štefan Michna, Iryna Hren, Tomáš Vlach, Alena Michalcová, Pavel Novák and Dana Stančeková
Materials 2022, 15(21), 7626; https://doi.org/10.3390/ma15217626 - 30 Oct 2022
Cited by 4 | Viewed by 1450
Abstract
Commercially supplied inoculation wires have a guaranteed chemical composition but not the size and distribution of individual phases, which are very important for nucleation. Therefore, two commercial alloys used for the inoculation of Al-Si alloys (AlTi3B1 and AlTi5B1) are investigated in this paper. [...] Read more.
Commercially supplied inoculation wires have a guaranteed chemical composition but not the size and distribution of individual phases, which are very important for nucleation. Therefore, two commercial alloys used for the inoculation of Al-Si alloys (AlTi3B1 and AlTi5B1) are investigated in this paper. The emphasis is placed on their structural analysis and the size and distribution of individual intermetallic phases. Furthermore, the grain refinement effect will be tested by adding these alloys to the AlSi7Mg0.3 alloy and testing the optimal amount of added inoculation wires. The results showed that the size and distribution of the individual phases in AlTi3B1 and AlTi5B1 meet the requirements for the successful inoculation of aluminum alloys, the intermetallic phases based on the TiAl3 phase are fine enough, and there is no agglomeration that would reduce the number of nuclei. This assumption was confirmed by adding these inoculants to the AlSi7Mg0.3 alloy, and it was found that the most ideal amount of inoculants added is 0.01 wt % when the structure was refined by approximately 32%. Full article
(This article belongs to the Special Issue Intermetallic Alloys: Preparation, Properties and Applications)
Show Figures

Figure 1

13 pages, 5322 KiB  
Article
Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints
by Karel Dušek, Petr Veselý, David Bušek, Adam Petráč, Attila Géczy, Balázs Illés and Oliver Krammer
Materials 2021, 14(24), 7909; https://doi.org/10.3390/ma14247909 - 20 Dec 2021
Cited by 8 | Viewed by 3493
Abstract
Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/ROL1 flux classification, glossy or matt solder mask, and [...] Read more.
Flux contained in solder paste significantly affects the process of solder joint creation during reflow soldering, including the creation of an intermetallic layer (IML). This work investigates the dependence of intermetallic layer thickness on ROL0/ROL1 flux classification, glossy or matt solder mask, and OSP/HASL/ENIG soldering pad surface finish. Two original SAC305 solder pastes differing only in the used flux were chosen for the experiment. The influence of multiple reflows was also observed. The intermetallic layer thicknesses were obtained by the image analysis of micro-section images. The flux type proved to have a significant impact on the intermetallic layer thickness. The solder paste with ROL1 caused an increase in IML thickness by up to 40% in comparison to an identical paste with ROL0 flux. Furthermore, doubling the roughness of the solder mask has increased the resulting IML thickness by 37% at HASL surface finish and by an average of 22%. Full article
(This article belongs to the Special Issue Intermetallic Alloys: Preparation, Properties and Applications)
Show Figures

Figure 1

Back to TopTop