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Advances of Indentation Technology in Materials

A special issue of Materials (ISSN 1996-1944). This special issue belongs to the section "Advanced Nanomaterials and Nanotechnology".

Deadline for manuscript submissions: 20 November 2024 | Viewed by 3994

Special Issue Editors


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Guest Editor
School of Mechanical Engineering and Automation, Fuzhou University, Fuzhou 350116, China
Interests: micromechanics; instrumented indentation and scratch; contact mechanics; mechanical properties

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Guest Editor
School of Mechanics, Civil Engineering and Architecture, Northwestern Polytechnical University, Xi’an 710072, China
Interests: multiscale modelling; constitutive damage model; instrumented in situ indentation
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Guest Editor
School of Mechanics and Engineering, Southwest Jiaotong University, Chengdu 610031, China
Interests: theory and application of constitutive models; strength theory; fracture mechanics; and material testing methods of solid materials

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Guest Editor
School of Aerospace Engineering and Applied Mechanics, Tongji University, Shanghai 200092, China
Interests: composite materials; high-performance; multi-layer and multi-scale

Special Issue Information

Dear Colleagues,

Nanoindentation has become an indispensable technique in the field of material science and engineering, providing valuable insights into mechanical behavior and properties of local regions, and exerting a revolutionary impact on the testing of small samples. As this technology continues to develop, we must explore its application in various material systems and address existing challenges.

This Special Issue aims to highlight recent advancements in nanoindentation technology and its applications in material research. Topics of interest include, but are not limited to:

  • Development of new nanoindentation techniques and methodologies;
  • Characterization of mechanical properties via instrumented indentation;
  • Understanding of deformation or fracture mechanisms by nanoindentation;
  • Evaluating material behavior under extreme conditions;
  • Assessing distribution of local properties by nanoindentation;
  • Advancements in probe materials, surface treatment, and geometries;
  • Integration of nanoindentation with other characterization techniques;
  • Applications of nanoindentation in different material systems;
  • Modeling and simulation of nanoindentation experiments;
  • Standardization and calibration of nanoindentation techniques.

We invite researchers to contribute to this Special Issue by submitting original research papers, reviews, or communications that address the aforementioned topics. We believe that this issue will serve as a valuable resource for the materials science community and contribute to the further development of nanoindentation technology.

Prof. Dr. Ming Liu
Prof. Dr. Xu Long
Prof. Dr. Lixun Cai
Prof. Dr. Yan Li
Guest Editors

Manuscript Submission Information

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Materials is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • nanoindentation
  • mechanical properties
  • deformation and fracture mechanisms
  • extreme conditions
  • probe materials
  • characterization techniques
  • material systems
  • modeling and simulation
  • standardization
  • calibration

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Published Papers (2 papers)

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Research

18 pages, 5813 KiB  
Article
Micromechanical Characterization of AlCu Films for MEMS Using Instrumented Indentation Method
by Dongyang Hou, Yuhang Ouyang, Zhen Zhou, Fang Dong and Sheng Liu
Materials 2024, 17(19), 4891; https://doi.org/10.3390/ma17194891 - 5 Oct 2024
Viewed by 582
Abstract
The micromechanical properties (i.e., hardness, elastic modulus, and stress–strain curve) of AlCu films were determined by an instrumented indentation test in this work. For three AlCu films with different thicknesses (i.e., 1 µm, 1.5 µm, and 2 µm), the same critical ratio ( [...] Read more.
The micromechanical properties (i.e., hardness, elastic modulus, and stress–strain curve) of AlCu films were determined by an instrumented indentation test in this work. For three AlCu films with different thicknesses (i.e., 1 µm, 1.5 µm, and 2 µm), the same critical ratio (hmax/t) of 0.15 and relative indentation depth range of 0.15–0.5 existed, within which the elastic modulus (i.e., 59 GPa) and nanoindentation hardness (i.e., 0.75 GPa, 0.64 GPa and 0.63 GPa for 1 µm, 1.5 µm and 2 µm films) without pile-up and substrate influence can be determined. The yield strength (i.e., 0.754 GPa, 0.549 GPa and 0.471 GPa for 1 µm, 1.5 µm and 2 µm films) and hardening exponent (i.e., 0.073, 0.131 and 0.150 for 1 µm, 1.5 µm and 2 µm films) of Al-(4 wt.%)Cu films for MEMS were successfully reported for the first time using a nanoindentation reverse method. In dimensional analysis, the ideal representative strain εr was determined to be 0.038. The errors of residual depth hr between the simulations and the nanoindentation experiments was less than 5% when the stress–strain curve obtained by the nanoindentation reverse method was used for simulation. Full article
(This article belongs to the Special Issue Advances of Indentation Technology in Materials)
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22 pages, 24656 KiB  
Article
Micro/Nanomechanical Characterization of ScAlMgO4 Single Crystal by Instrumented Indentation and Scratch Methods
by Zifeng Ni, Jie Yu, Guomei Chen, Mingjie Ji, Shanhua Qian, Da Bian and Ming Liu
Materials 2024, 17(15), 3811; https://doi.org/10.3390/ma17153811 - 2 Aug 2024
Cited by 1 | Viewed by 940
Abstract
ScAlMgO4 (SCAM), which can be used as an epitaxial substrate material of GaN in power devices, faces the challenge of achieving a high-quality surface by ultra-precision polishing due to its brittle and easily cleaved characteristics, which are closely associated with its mechanical [...] Read more.
ScAlMgO4 (SCAM), which can be used as an epitaxial substrate material of GaN in power devices, faces the challenge of achieving a high-quality surface by ultra-precision polishing due to its brittle and easily cleaved characteristics, which are closely associated with its mechanical properties. The micromechanical properties of SCAM single crystals were evaluated by nanoindentation and microscratch tests using different indenters. The elastic modulus EIT and the indentation hardness HIT of SCAM obtained by nanoindentation were 226 GPa and 12.1 GPa, respectively. Leaf-shaped chips and the associated step-like planes of SCAM can be found in the severely damaged regime during scratching by Berkovich and Vickers indenters with sharp edges due to the intersection of intense radial and lateral cracks. The fracture toughness (Kc = 1.12 MPa·m1/2) of SCAM can be obtained by using a scratch-based methodology for a spherical indenter based on linear elastic fracture mechanics (LEFM) under an appropriate range of applied loads. An optimal expression for calculating the fracture toughness of easily cleaved materials, including SCAM, via the Vickers indenter-induced cracking method using a Berkovich indenter was recommended. Full article
(This article belongs to the Special Issue Advances of Indentation Technology in Materials)
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