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Metals
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Rapid Solidification Processing
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Rapid Solidification Processing

A special issue of Metals (ISSN 2075-4701).

Deadline for manuscript submissions: closed (30 September 2019) | Viewed by 14859

Special Issue Editor

Prof. Andrew Mullis

E-Mail Website
Guest Editor
School of Chemical and Process Engineering, University of Leeds, Leeds, United Kingdom
Interests: metals; solidification; phase-field simulation; microgravity materials processing; non-equilibrium processing

Special Issue Information

Dear Colleagues,

Rapid solidification processing (RSP), whether by rapid quenching, deep undercooling or a combination of the two, has been at the forefront of solidification science for the last 50 years or more. From an applications standpoint, RSP permits access to a range of compositional and morphological states, including metastable phases, highly grain refined structures and non-crystalline materials, not otherwise available to the materials engineer. This in turn leads to improved mechanical, thermal and corrosion resistance properties, which have found utilization in a range of high-value added sectors. Conversely, at the most fundamental level, exploration of the high Péclet number regime has allowed theories of solidification processing to be rigorously tested and has led to developments such as the theory of solute trapping. From a peak in the 1980s, activity in the field declined somewhat during the subsequent 25 years or so, but is now resurgent with exciting developments across both theory and experiment. This includes the first RSP science results from the TEMPUS electromagnetic levitation system on-board the International Space Station. With the rise of Additive Layer Manufacturing driving a near exponential growth in demand for melt atomized metal powders, an inherently RSP material, interest in the field looks set for continued growth. For this Special Issue in Metals, we welcome reviews and articles in all areas of experimental and theoretical rapid solidification, including the simulation of rapid solidification structures and processes.

Prof. Andrew Mullis
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Metals is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • Undercooling
  • Rapid quenching
  • Metastable phases
  • Non-equilibrium processing
  • Levitation techniques
  • Containerless processing
  • Computer simulation

Published Papers (4 papers)

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Research

12 pages, 4836 KiB  
Article
Microstructural Evolution from Dendrites to Core-Shell Equiaxed Grain Morphology for CoCrFeNiVx High-Entropy Alloys in Metallic Casting Mold
by Leigang Cao, Lin Zhu, Hongde Shi, Zerui Wang, Yue Yang, Yi Meng, Leilei Zhang and Yan Cui
Metals 2019, 9(11), 1172; https://doi.org/10.3390/met9111172 - 30 Oct 2019
Cited by 11 | Viewed by 3068
Abstract
The CoCrFeNiVx (x = 0, 0.25, 0.5, 0.7, 0.8, 0.9, and 1.0) high-entropy alloys (HEAs) were fabricated by the copper mold casting process. The microstructure, phase constitution, and mechanical properties were investigated by using X-ray diffraction, scanning electron microscopy, transmission electron [...] Read more.
The CoCrFeNiVx (x = 0, 0.25, 0.5, 0.7, 0.8, 0.9, and 1.0) high-entropy alloys (HEAs) were fabricated by the copper mold casting process. The microstructure, phase constitution, and mechanical properties were investigated by using X-ray diffraction, scanning electron microscopy, transmission electron microscopy analyses and compressive testing. It revealed that, when x ≤ 0.25, the alloys solidified into a single fcc phase. When 0.5 ≤ x ≤ 0.8, the alloys solidified into a dendritic structure of the fcc phase with the formation of the σ phase in the interdendrite region. Interestingly, when x exceeded 0.9, the alloys presented a typical core-shell equiaxed grain morphology. The core region consisting of a mixture of fcc + σ phases was surrounded by the shell of the single σ phase and the interdendrite region solidified into the single fcc phase. The dual-phase “eutectiod” structure in the core region of the equiaxed grain might be formed from the decomposition of the unidentified metastable phase. As the V fraction increased, the compressive yield strength of the CoCrFeNiVx alloys gradually increased from 164 MPa (x = 0) to 458 MPa (x = 0.8), and then sharply increased to 722 MPa (x = 0.9) and 1493 MPa (x = 1.0). Full article
(This article belongs to the Special Issue Rapid Solidification Processing)
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11 pages, 5464 KiB  
Article
Microstructure and Wear Resistance of Ti6Al4V Coating Fabricated by Electro-Spark Deposition
by Weifu Wang and Chao Han
Metals 2019, 9(1), 23; https://doi.org/10.3390/met9010023 - 27 Dec 2018
Cited by 22 | Viewed by 3202
Abstract
In this study, a Ti6Al4V coating with a large thickness of more than 550 µm was successfully deposited onto the surface of Ti6Al4V substrate by electro-spark deposition. The microstructure, phase composition, microhardness and wear resistance of the deposited coating were investigated by scanning [...] Read more.
In this study, a Ti6Al4V coating with a large thickness of more than 550 µm was successfully deposited onto the surface of Ti6Al4V substrate by electro-spark deposition. The microstructure, phase composition, microhardness and wear resistance of the deposited coating were investigated by scanning electron microscope (SEM), X-ray diffraction (XRD), Vickers hardness and wear tester, respectively. The results show that the deposited coating is mainly composed of α’ martensite. The interface between the deposited coating and the underlying substrate is even and consecutive, which implies that a good metallurgical bond was obtained. The average hardness of the deposited coating is ~540 HV, which is about 1.6 times that of the substrate. The wear resistance of deposited coatings is obviously superior to the substrate. Under same conditions, the friction coefficient of the deposited coating decreases by about 0.19. The cumulative mass loss of the coating specimens is only about 1.58 mg in 20 min tests, while the mass loss of the substrate is ~3.6 mg. The analysis indicates that the improvement on wear resistance can be mainly attributed to the high hardness of the deposited coating, i.e., the hardened coating relieves the micro-cutting and adhesive wear in wear processes. Full article
(This article belongs to the Special Issue Rapid Solidification Processing)
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10 pages, 3610 KiB  
Article
The Impact of Pt Concentration on Crystal Growth Mechanism in Pt-Pd Binary Alloy System in the Context of Molecular Dynamics
by Servet Kizilagac, Fatih Ahmet Celik and Koray Koksal
Metals 2018, 8(11), 926; https://doi.org/10.3390/met8110926 - 09 Nov 2018
Cited by 2 | Viewed by 2314
Abstract
This work aims to investigate the effect of Pt concentration on the crystal growth mechanism of a Platinum-Palladium (Pt-Pd) binary alloy system during the annealing process; starting from the amorphous phase to some definite temperatures. The calculations have been performed by using molecular [...] Read more.
This work aims to investigate the effect of Pt concentration on the crystal growth mechanism of a Platinum-Palladium (Pt-Pd) binary alloy system during the annealing process; starting from the amorphous phase to some definite temperatures. The calculations have been performed by using molecular dynamic (MD) simulations. Interatomic interactions are described by the Sutton-Chen type Embedded Atom Potential Energy function. In order to understand the main structural properties at the stable and unstable phases; changes in radial distribution function (RDF) curves versus time have been analyzed for different annealing temperatures. Crystalline type bonded pairs have been determined using MD calculations which is required for the computation of Avrami coefficients and for understanding crystal growth mechanism. The results demonstrate that the increase in concentration of Pt during annealing leads to migration of atoms in the crystal lattice points; elimination of dislocations and formation of perfect crystal structure. Full article
(This article belongs to the Special Issue Rapid Solidification Processing)
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9 pages, 11765 KiB  
Article
Direct Numerical Study of a Molten Metal Drop Solidifying on a Cold Plate with Different Wettability
by Truong V. Vu, Cuong T. Nguyen and Duong T. Khanh
Metals 2018, 8(1), 47; https://doi.org/10.3390/met8010047 - 11 Jan 2018
Cited by 14 | Viewed by 4946
Abstract
This paper presents a direct numerical simulation of solidification of a molten metal drop on a cold plate with various wettability by an axisymmetric front-tracking method. Because of the plate kept at a temperature below the fusion value of the melt, a thin [...] Read more.
This paper presents a direct numerical simulation of solidification of a molten metal drop on a cold plate with various wettability by an axisymmetric front-tracking method. Because of the plate kept at a temperature below the fusion value of the melt, a thin solid layer forms at the plate and evolves upwards. The numerical results show that the solidifying front is almost flat except near the triple point with a high solidification rate at the beginning and final stages of solidification. Two solid-to-liquid density ratios ρsl = 0.9 (volume change) and 1.0 (no change in volume), with two growth angles φ0 = 0° and 12° are considered. The presence of volume change and a non-zero growth angle results in a solidified drop with a conical shape at the top. The focusing issue is the effects of the wettability of the plate in terms of the contact angle φ0. Increasing the contact angle in the range of 45° to 120° increases time for completing solidification, i.e., solidification time. However, it has a minor effect on the conical angle at the top of the solidified drop and the difference between the initial liquid and final solidified heights of the drop. The effects of the density ratio and growth angle are also presented. Full article
(This article belongs to the Special Issue Rapid Solidification Processing)
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