Recent Advances in 3D Printed Electronics
A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "D1: Semiconductor Devices".
Deadline for manuscript submissions: 31 December 2024 | Viewed by 51
Special Issue Editor
Special Issue Information
Dear Colleagues,
Three-dimensional (3D) printing has revolutionized manufacturing across various industries thanks to its unparalleled design freedom and customization capabilities. One of the most promising applications of 3D printing technology is in the field of electronics. Overall, 3D printing enables electronic fabrication with unconventional geometries and form factors, catering to specific application requirements. The versatility of 3D printed electronics transcends traditional manufacturing constraints, fostering innovation in diverse fields, from wearable sensors, displays, and IoT devices to biomedical implants. Despite these advancements, challenges such as material compatibility, resolution limitations, and process reliability still need to be overcome before widespread adoption can occur.
This Special Issue explores the recent advancements, challenges, and prospects of 3D printed electronics. We solicit papers focusing on enhancing material (ink) properties, refining printing techniques, and developing novel design methodologies for 3D printed electronics. Advances in multi-material printing, in situ monitoring, and post processing techniques hold promise for overcoming current limitations and expanding the application scope of 3D printed electronics.
Dr. Sung Hyun Park
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- 3D printing system
- functional material ink
- multi-material 3D printing
- electronics on freeform surfaces
- 3D printed circuit
- 3D printed sensor
- 3D printed optoelectronic device
