3D Integration: Trends, Challenges and Opportunities

Dear Colleagues,

As chip fabrication processes continue to diminish in size and approach the physical limits, relying on reducing transistor gate dimensions to achieve optimal chip performance and complex chip structures presents substantial challenges. Shifting towards new chip design architectures, 3D chip stacking has become a popular technical path. The rapid development of 3D integration technology, incorporating new materials and fabrication processes, is being extensively applied in various areas of chip integration and packaging manufacturing. This aims to enhance chip functionalities and achieve miniaturization in system integration while reducing costs.

In view of the latest advancements in this field, we announce this Special Issue, titled “3D Integration: Trends, Challenges and Opportunities”. Therefore, we invite the submission of papers in the fields of integrated circuit manufacturing, electronic engineering, communication technology, advanced packaging technology, and 3D integration application technology. We welcome the submission of papers related to all aspects of 3D integration technology, including, but not limited to, the following:

• TSV three-dimensional integration manufacturing technology;
• Manufacturability and reliability modeling and simulation technology;
• Efficient thermal management technology;
• Embedded microchannel technology;
• Integrated circuit design;
• New methods in electronic packaging and interconnect technology;
• New materials and processes in microelectronics manufacturing;
• System-level packaging technology;
• Application of nanotechnology and quantum computing in 3D integration;
• Novel sensor manufacturing and packaging technology;
• Micro electromechanical

Through these in-depth analyses and discussions, we aim to provide new insights and directions for the innovation and development of 3D integration technology.

Prof. Dr. Yufeng Jin
Dr. Qidong Wang
Dr. Shenglin Ma
Guest Editors

Manuscript Submission Information

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Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

• 3D integration
• advanced packaging
• TSV
• microchannels
• DFM
• DFR
• integrated circuit design
• reliability
• manufacturability
• sensors