Surface and Bulk Acoustic Wave Devices

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "A:Physics".

Deadline for manuscript submissions: 31 December 2024 | Viewed by 32

Special Issue Editors


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Guest Editor
Ministry of Education Key Laboratory of RF Circuits and Systems, College of Electronics & Information, Hangzhou Dianzi University, Hangzhou 310000, China
Interests: self-powered/passive sensing system; wireless sensing; surface acoustic wave device; tribotronics
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Guest Editor
College of Information Science & Electronic Engineering, Zhejiang University, Hangzhou 310027, China
Interests: resonators; SAW; FBAR; wearable/implantable electronics
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College of Information Science & Electronic Engineering, Zhejiang University, Hangzhou 310027, China
Interests: silicon-based micro/nanofabrication; electrokinetic-based separation and enrichment methods; biomicrofluidics; biosensors and lab-on-a-chip systems for biomedical applications
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Surface Acoustic Wave (SAW) and Bulk Acoustic Wave (BAW) devices are pivotal in various applications across telecommunications, consumer electronics, and sensor systems. These devices capitalize on acoustic waves to provide solutions for signal processing, sensing, and actuation at microscale levels. In this Special Issue, we aim to showcase cutting-edge research that highlights the development, optimization, and application of SAW and BAW devices. Contributions may cover a range of topics including, but not limited to, novel fabrication techniques, material innovations, theoretical modeling, and application-driven studies of these devices in new and existing fields. We invite researchers and practitioners to share their insights and findings that contribute to pushing the boundaries of what is possible with acoustic wave technology.

Dr. Jinkai Chen
Prof. Dr. Shurong Dong
Dr. Hao Jin
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • acoustic wave sensors
  • piezoelectric materials
  • signal processing
  • fabrication techniques
  • material innovations
  • device optimization
  • theoretical modeling

Published Papers

This special issue is now open for submission.
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