Recent Advances in Micro- and Nanofabrication: Beyond Planar Silicon Process

A special issue of Micromachines (ISSN 2072-666X). This special issue belongs to the section "E:Engineering and Technology".

Deadline for manuscript submissions: closed (15 December 2022) | Viewed by 1044

Special Issue Editor


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Guest Editor
Institute FEMTO-ST, Université Bourgogne-Franche-Comté, 25030 Besançon, France
Interests: microfabrication; microfluidics; lab-on-chip; integrated optics
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

The planar micro-nanofabrication process on silicon has been the workhorse of microelectronics for years and has played a seminal role in the development of MEMS technology. However, since its inception, MEMS fabrication has spurred a new spat of processes, involving new substrates (glass, piezoelectric, flexible, etc.) and new materials (smart materials, gold, etc.) and departing from classical 2.5D geometry to enter the realm of 3D fabrication.

In this Special Issue, we want to highlight recent advances in micro-nanofabrication technology that open up new possibilities for device batch fabrication. We will accept papers dedicated purely to new micro-nanofabrication techniques but also papers on new devices enabled by new techniques, provided the paper gives significant details on the fabrication process.

Typical topics that will be considered include but are not limited to:

  • 3D and 4D patterning;
  • Patterning on non-flat substrates;
  • Ion-beam-based process (FIB, implantation, etc.);
  • Laser-based process;
  • 3D exposure and etch process;
  • 3D micro-nanoprinting techniques (multi-photons, STM, etc.);
  • Multifunctional materials batch fabrication;
  • Piezoelectric on insulator (POI) substrate-based process;
  • High aspect ratio process;
  • Thick oxide patterning (Ta2O5, TiO2, LiNbO3, LiTaO3, etc.);
  • Flexible substrate;
  • PDMS-based batch fabrication;
  • Bottom-up fabrication process;
  • Nanofiber/nanoparticle integration;
  • Near-field electrospinning.

Prof. Dr. Franck Chollet
Guest Editor

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Micromachines is an international peer-reviewed open access monthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Keywords

  • microfabrication
  • nanofabrication
  • nanotechnology
  • beyond CMOS
  • microelectromechanical systems

Published Papers

There is no accepted submissions to this special issue at this moment.
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