Advanced Epoxy-Based Materials, 5th Edition
A special issue of Polymers (ISSN 2073-4360). This special issue belongs to the section "Polymer Applications".
Deadline for manuscript submissions: 31 December 2024 | Viewed by 30
Special Issue Editor
Interests: functional epoxy resins for electronics packaging; extrusion; polymer composites
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Epoxy resins are utilized extensively in electronic applications due to their beneficial properties, such as excellent adhesion, low shrinkage, low dielectric constant, and outstanding mechanical and thermal properties. Advanced epoxy-based materials may include metal/epoxy, carbon-based fillers/epoxy, inorganic materials/epoxy, epoxy/polymeric materials, and fiber-reinforced epoxy composites. Advanced epoxy-based materials offer an extensive range of applications, such as adhesives for electronic devices, bio-based epoxy resins, paints/coatings, wind turbine composites, automotive/aerospace composites, and other adhesives for numerous applications. This Special Issue is highly motivated by the scope of utilization of advanced epoxy-based materials and will pay significant attention to novel synthetic methods, compositions, functionalization/modification, structure–property relationships, and biomedical and energy applications.
Considering your prominent contributions to this field, I would like to cordially invite you to submit an article to this Special Issue. This Special Issue will publish full research papers, communications, and review articles. I would like to compile a collection of comprehensive reviews from leading experts and up-to-date research from notable groups in the community.
Manuscripts can be submitted now or up until the deadline, and will be published on an ongoing basis. I would greatly appreciate your contribution to this Special Issue.
Prof. Dr. Keon-Soo Jang
Guest Editor
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Polymers is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2700 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- thermoset polymers
- epoxy composites
- nanocomposites
- synthesis
- functionalization
- characterization
- electronic packaging
- automotive
- aerospace
Related Special Issues
- Advanced Epoxy-Based Materials in Polymers (18 articles)
- Advanced Epoxy-Based Materials II in Polymers (18 articles)
- Advanced Epoxy-Based Materials III in Polymers (13 articles)
- Advanced Epoxy-Based Materials IV in Polymers (9 articles)
