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Sensors
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Microwave-Based Integrated Sensing Systems and Applications
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Microwave-Based Integrated Sensing Systems and Applications

A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Sensor Networks".

Deadline for manuscript submissions: closed (30 October 2023) | Viewed by 4089

Special Issue Editors

Dr. Amir Ebrahimi

E-Mail Website
Guest Editor
School of Engineering, RMIT University, Melbourne, VIC 3001, Australia
Interests: metamaterials; RF/microwave sensors; microwave circuits; frequency-selective surfaces (FSSs); microwave engineering
Special Issues, Collections and Topics in MDPI journals
Prof. Dr. Kamran Ghorbani

E-Mail Website
Guest Editor
School of Engineering, RMIT University, Melbourne, Australia
Interests: radar/microwave devices and systems; ferroelectric materials; metamaterials; RF energy harvesting; multifunctional microwave structure and phased-array antennas
Dr. Paris Vélez

E-Mail Website
Guest Editor
CIMITEC, Departament d'Enginyeria Electrònica, Universitat Autònoma de Barcelona, 08193 Bellaterra, Spain
Interests: microwave; passive circuits; electronics engineering; metamaterials; microwave biosensors
Special Issues, Collections and Topics in MDPI journals

Special Issue Information

Dear Colleagues,

Microwave sensing and instrumentation systems have been of specific interest to both academia and industry due to their unique advantages such as their non-destructive, real-time, and label-free measurement. Furthermore, the high compatibility of such instrumentation for integration using technologies such as complementary metal–oxide semiconductors (CMOSs) and low-temperature co-fired ceramics (LTCC) makes them ideal choices for integrated on-chip biomedical and Internet-of-Things (IOT) applications. The recent advancements in electronic technology have enabled sensing and characterization even at millimeter-wave (MMW) and Terahertz (THz) regimes, offering high-resolution imaging and detection for security screening and biological detection. 

This Special Issue focuses on the latest advances in RF/microwave, millimeter wave (MMW), and Terahertz (THz) sensing systems and devices. The particular topics of interest include but are not limited to:

  • Microwave-based lab-on-a-chip;
  • Microwave microfluidic sensors;
  • Microwave biosensors;
  • Microwave-based mechanical sensing systems;
  • Microwave-based imaging systems;
  • Bioradar;
  • Artificial-intelligence-enabled microwave sensors;
  • RFID sensors;
  • Point-of-care microwave sensors;
  • Microwave sensing systems for food and agriculture;
  • Microwave-based hyperthermia and ablation;
  • Radar-based remote sensing.

Dr. Amir Ebrahimi
Prof. Dr. Kamran Ghorbani
Dr. Paris Vélez
Guest Editors

Manuscript Submission Information

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.

Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.

Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.

Published Papers (2 papers)

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Research

10 pages, 2609 KiB  
Article
Low-Loss Pogo Pin Probe Card with a Coupling Isolation Structure up to 50 GHz
by K. M. Lee, S. Ahn, E. Park and M. Kim
Sensors 2023, 23(12), 5420; https://doi.org/10.3390/s23125420 - 8 Jun 2023
Viewed by 1817
Abstract
A design for a millimeter wave RF probe card that removes resonance is proposed. The designed probe card optimizes the position of the ground surface and the signal pogo pins to resolve the resonance and signal loss issues that occur when connecting a [...] Read more.
A design for a millimeter wave RF probe card that removes resonance is proposed. The designed probe card optimizes the position of the ground surface and the signal pogo pins to resolve the resonance and signal loss issues that occur when connecting a dielectric socket and a PCB. At millimeter wave frequencies, the height of the dielectric socket and pogo pin matches the length of half a wavelength, allowing the socket to act as a resonator. When the leakage signal from the PCB line is coupled to the 2.9 mm high socket with pogo pins, resonance at a frequency of 28 GHz is generated. The probe card uses the ground plane as a shielding structure to minimize this resonance and radiation loss. The importance of the signal pin location is verified via measurements in order to address the discontinuity caused by field polarity switching. A probe card fabricated using the proposed technique exhibits an insertion loss performance of −8 dB up to 50 GHz and eliminates resonance. A signal with an insertion loss of −3.1 dB can be transmitted to a system-on-chip in a practical chip test. Full article
(This article belongs to the Special Issue Microwave-Based Integrated Sensing Systems and Applications)
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11 pages, 5388 KiB  
Article
Design Compact Absorptive Common-Mode Noise Suppression Filter with Series Unified Circuit
by Cheng-Yi Zhuang and Ding-Bing Lin
Sensors 2023, 23(2), 957; https://doi.org/10.3390/s23020957 - 14 Jan 2023
Cited by 3 | Viewed by 1750
Abstract
In the PCB process, overcoming common-mode noise radiation is critical. In past years, most studies have focused on a common-mode noise filter (CMNF) that can solve electromagnetic interference in high-speed digital systems by blocking and absorbing common-mode noise radiation. Unfortunately, connecting with any [...] Read more.
In the PCB process, overcoming common-mode noise radiation is critical. In past years, most studies have focused on a common-mode noise filter (CMNF) that can solve electromagnetic interference in high-speed digital systems by blocking and absorbing common-mode noise radiation. Unfortunately, connecting with any reflective common-mode noise filter (R-CMNF) and reducing the area of an absorptive common-mode noise filter (A-CMNF) are the most troublesome tasks in the PCB process. A novel equivalent circuit is proposed in this research to minimize the complexity of the design and improve accuracy. Detailed analyses of this proposed approach are entirely depicted in this article. The experiment result shows that 9% of fractional bandwidth centered at 2.25 Hz can achieve at least 90% absorption efficiency. With our proposed method, the area of A-CMNF is smaller than in state-of-the-art research. Full article
(This article belongs to the Special Issue Microwave-Based Integrated Sensing Systems and Applications)
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