Advanced Sensors Using Smart Materials
A special issue of Sensors (ISSN 1424-8220). This special issue belongs to the section "Sensor Materials".
Deadline for manuscript submissions: 10 July 2024 | Viewed by 7793
Special Issue Editors
Interests: flexible sensors; acoustics; wireless; embedded sensors; additive manufacturing
Interests: piezoelectrics; SMA; self-healing materials; ultrasonics; sensor integration
Special Issues, Collections and Topics in MDPI journals
Special Issue Information
Dear Colleagues,
Sensor technologies have rapidly advanced opening new doors to true digital transformation, connecting machines, products, and people through industrial internet of things and digital twin platforms. With an increased focus on new sensing technologies, the development of advanced sensors that possess unique or multifunctional properties using various attributes of intelligent materials is accelerating the pace of the hyper-connected industrial revolution.
The goal of this Special Issue is to highlight the state-of-the-art research on the development of advanced sensors that utilize smart materials, which are formed in various sizes and shapes for diverse engineering and scientific fields. We sincerely invite you to submit original unpublished work on the listed or related topics.
Topics of interest include, but are not limited to, the following:
- Smart materials for sensing
- Sensing principles and technologies
- Sensors with additive manufacturing
- Flexible and wearable sensors
- Biomedical sensors
- Embeddable sensors
- Metamaterial sensors
- Multifunctional sensors
- Wireless and remote sensors
- Theory and modelling of advanced sensors
- Design, manufacturing, data analysis of advanced sensors
- AI and machine learning related to advanced sensors
Dr. Daewon Kim
Dr. Nathan Salowitz
Dr. Zhenhua Tian
Guest Editors
Manuscript Submission Information
Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Once you are registered, click here to go to the submission form. Manuscripts can be submitted until the deadline. All submissions that pass pre-check are peer-reviewed. Accepted papers will be published continuously in the journal (as soon as accepted) and will be listed together on the special issue website. Research articles, review articles as well as short communications are invited. For planned papers, a title and short abstract (about 100 words) can be sent to the Editorial Office for announcement on this website.
Submitted manuscripts should not have been published previously, nor be under consideration for publication elsewhere (except conference proceedings papers). All manuscripts are thoroughly refereed through a single-blind peer-review process. A guide for authors and other relevant information for submission of manuscripts is available on the Instructions for Authors page. Sensors is an international peer-reviewed open access semimonthly journal published by MDPI.
Please visit the Instructions for Authors page before submitting a manuscript. The Article Processing Charge (APC) for publication in this open access journal is 2600 CHF (Swiss Francs). Submitted papers should be well formatted and use good English. Authors may use MDPI's English editing service prior to publication or during author revisions.
Keywords
- smart materials
- sensing principles and technologies
- sensors with additive manufacturing
- flexible and wearable sensors
- biomedical sensors
- embeddable sensors
- metamaterial sensors
- multifunctional sensors
- wireless and remote sensors
- theory and modelling of advanced sensors
- design, manufacturing, data analysis of advanced sensors
- AI and machine learning related to advanced sensors
Planned Papers
The below list represents only planned manuscripts. Some of these manuscripts have not been received by the Editorial Office yet. Papers submitted to MDPI journals are subject to peer-review.
Title: A Low-Cost Fully 3D-Printed Capacitive Force Sensor for Plantar Pressure Measurements
Authors: Andrew T. Gothard1, Jacob W. Hott1, and Steven R. Anton1*
Affiliation: 1Dynamic and Smart Systems Laboratory, Department of Mechanical Engineering
Tennessee Technological University, Cookeville, TN 38505
Abstract: The evaluation of footbed pressure distribution maps using pressure-sensing insoles has become a valuable gait analysis technique that aids physicians in diagnosing musculoskeletal and gait disorders. However, current pressure-sensing insoles face the limitations of low customizability and high cost. This work explores the feasibility of continuously printed capacitive pressure sensors for pressure-sensing insoles using three sensor designs. The designs use flexible thermoplastic polyurethane (TPU) as the dielectric and either conductive flexible thermoplastic polyurethane or conductive polylactic acid (PLA) for the conductive plates. Dynamic sensors performance is evaluated via sinusoidal compressive tests at frequencies of 1, 3, 5, and 7 Hz, with pressure levels varying from 15 to 25, 35, 55, and 75 N/cm2 at each frequency.
Title: Paintable Silicone-based Corrugated Soft Elastomeric Capacitor for Strain Sensing
Authors: Han Liu1, Simon Laflamme1,2, Matthias Kollosche3
Affiliation: 1 Department of Civil, Construction, and Environmental Engineering, Iowa State University, Ames, IA, USA
2 Department of Electrical and Computer Engineering, Iowa State University, Ames, IA, USA
3 Harvard John A. Paulson School of Engineering and Applied Sciences, Harvard University, Cambridge, MA, USA
Abstract: The authors have previously proposed and developed corrugated soft elastomeric capacitor (cSEC) based on styrene-ethylene-butadiene-styrene (SEBS) to create large-area strain sensors. A key limitation of the technology is in the required use of an epoxy to adhere the sensor onto the monitored surface, mainly attributable to the use of toluene in the sensor's fabrication that limits its direct deployment through a painting process. Here, we study an improved solvent-free fabrication method. The new cSEC is fabricated using a silicone matrix filled with Titania particles to form the dielectric, and with the same silicone but filled with carbon black particles to form the electrodes. The sensing performance of the silicone-based cSEC is characterized and its performance when directly painted onto a monitored surface assessed.