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Journal: Energies, 2022
Volume: 15
Number: 4884

Article: Optimization Design of Packaging Insulation for Half-Bridge SiC MOSFET Power Module Based on Multi-Physics Simulation
Authors: by Wenyi Li, Yalin Wang, Yi Ding and Yi Yin
Link: https://www.mdpi.com/1996-1073/15/13/4884

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