Time-Resolved Structural Measurement of Thermal Resistance across a Buried Semiconductor Heterostructure Interface
Abstract
:1. Introduction
2. Materials and Methods
3. Results and Discussion
3.1. X-ray Diffraction Analysis
3.2. Transient Structural Dynamics
3.3. Interface Distortion and Recovery
3.4. Heat Flux Evaluation
3.5. Fourier’s Law and Thermal Boundary Resistance
4. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
- Venkatasubramanian, R.; Siivola, E.; Colpitts, T.; O’quinn, B. Thin-film thermoelectric devices with high room-temperature figures of merit. Nature 2001, 413, 597–602. [Google Scholar] [CrossRef] [PubMed]
- Chowdhury, I.; Prasher, R.; Lofgreen, K.; Chrysler, G.; Narasimhan, S.; Mahajan, R.; Koester, D.; Alley, R.; Venkatasubramanian, R. On-chip cooling by superlattice-based thin-film thermoelectrics. Nat. Nanotechnol. 2009, 4, 235–238. [Google Scholar] [CrossRef] [PubMed]
- Jiao, W.; Hu, R.; Yuan, H.; Han, S.; Li, M.; Tang, Q.; Lei, W.; Liu, H. HfSe2/GaSe Heterostructure as a Promising Near-Room-Temperature Thermoelectric Material. J. Phys. Chem. C 2022, 126, 20326–20331. [Google Scholar] [CrossRef]
- Zhou, X.; Yan, Y.; Lu, X.; Zhu, H.; Han, X.; Chen, G.; Ren, Z. Routes for high-performance thermoelectric materials. Mater. Today 2018, 21, 974–988. [Google Scholar] [CrossRef]
- Marino, K.A.; Hinnemann, B.; Carter, E.A. Atomic-scale insight and design principles for turbine engine thermal barrier coatings from theory. Proc. Natl. Acad. Sci. USA 2011, 108, 5480–5487. [Google Scholar] [CrossRef]
- Wu, S.; Li, T.; Wu, M.; Xu, J.; Chao, J.; Hu, Y.; Yan, T.; Li, Q.Y.; Wang, R. Dual-functional aligned and interconnected graphite nanoplatelet networks for accelerating solar thermal energy harvesting and storage within phase change materials. ACS Appl. Mater. Interfaces 2021, 13, 19200–19210. [Google Scholar] [CrossRef]
- Feng, C.P.; Chen, L.B.; Tian, G.L.; Wan, S.S.; Bai, L.; Bao, R.Y.; Liu, Z.Y.; Yang, M.B.; Yang, W. Multifunctional thermal management materials with excellent heat dissipation and generation capability for future electronics. ACS Appl. Mater. Interfaces 2019, 11, 18739–18745. [Google Scholar] [CrossRef]
- Green, M.A.; Bremner, S.P. Energy conversion approaches and materials for high-efficiency photovoltaics. Nat. Mater. 2017, 16, 23–34. [Google Scholar] [CrossRef]
- Cahill, D.G.; Braun, P.V.; Chen, G.; Clarke, D.R.; Fan, S.; Goodson, K.E.; Keblinski, P.; King, W.P.; Mahan, G.D.; Majumdar, A.; et al. Nanoscale thermal transport. II. 2003–2012. Appl. Phys. Rev. 2014, 1, 011305. [Google Scholar] [CrossRef]
- Chen, J.; Xu, X.; Zhou, J.; Li, B. Interfacial thermal resistance: Past, present, and future. Rev. Mod. Phys. 2022, 94, 025002. [Google Scholar] [CrossRef]
- Bao, H.; Chen, J.; Gu, X.; Cao, B. A review of simulation methods in micro/nanoscale heat conduction. ES Energy Environ. 2018, 1, 16–55. [Google Scholar] [CrossRef]
- Kaiser, J.; Feng, T.; Maassen, J.; Wang, X.; Ruan, X.; Lundstrom, M. Thermal transport at the nanoscale: A Fourier’s law vs. phonon Boltzmann equation study. J. Appl. Phys. 2017, 121, 044302. [Google Scholar] [CrossRef]
- Frazer, T.D.; Knobloch, J.L.; Hoogeboom-Pot, K.M.; Nardi, D.; Chao, W.; Falcone, R.W.; Murnane, M.M.; Kapteyn, H.C.; Hernandez-Charpak, J.N. Engineering nanoscale thermal transport: Size-and spacing-dependent cooling of nanostructures. Phys. Rev. Appl. 2019, 11, 024042. [Google Scholar] [CrossRef]
- Cahill, D.G.; Ford, W.K.; Goodson, K.E.; Mahan, G.D.; Majumdar, A.; Maris, H.J.; Merlin, R.; Phillpot, S.R. Nanoscale thermal transport. J. Appl. Phys. 2003, 93, 793–818. [Google Scholar] [CrossRef]
- Giri, A.; Walton, S.G.; Tomko, J.; Bhatt, N.; Johnson, M.J.; Boris, D.R.; Lu, G.; Caldwell, J.D.; Prezhdo, O.V.; Hopkins, P.E. Ultrafast and Nanoscale Energy Transduction Mechanisms and Coupled Thermal Transport across Interfaces. ACS Nano 2023, 17, 14253–14282. [Google Scholar] [CrossRef] [PubMed]
- Aryana, K.; Gaskins, J.T.; Nag, J.; Stewart, D.A.; Bai, Z.; Mukhopadhyay, S.; Read, J.C.; Olson, D.H.; Hoglund, E.R.; Howe, J.M.; et al. Interface controlled thermal resistances of ultra-thin chalcogenide-based phase change memory devices. Nat. Commun. 2021, 12, 774. [Google Scholar] [CrossRef] [PubMed]
- Kwon, H.; Khan, A.I.; Perez, C.; Asheghi, M.; Pop, E.; Goodson, K.E. Uncovering thermal and electrical properties of Sb2Te3/GeTe superlattice films. Nano Lett. 2021, 21, 5984–5990. [Google Scholar] [CrossRef]
- Jaffe, G.; Mei, S.; Boyle, C.; Kirch, J.; Savage, D.; Botez, D.; Mawst, L.; Knezevic, I.; Lagally, M.; Eriksson, M. Measurements of the thermal resistivity of InAlAs, InGaAs, and InAlAs/InGaAs superlattices. ACS Appl. Mater. Interfaces 2019, 11, 11970–11975. [Google Scholar] [CrossRef]
- Liu, D.; Xie, R.; Yang, N.; Li, B.; Thong, J.T. Profiling nanowire thermal resistance with a spatial resolution of nanometers. Nano Lett. 2014, 14, 806–812. [Google Scholar] [CrossRef]
- Syme, D.B.; Lund, J.M.; Jensen, B.D.; Davis, R.C.; Vanfleet, R.R.; Iverson, B.D. Porous Silica Nanotube Thin Films as Thermally Insulating Barrier Coatings. ACS Appl. Nano Mater. 2020, 3, 3168–3173. [Google Scholar] [CrossRef]
- Johnson, J.A.; Maznev, A.; Cuffe, J.; Eliason, J.K.; Minnich, A.J.; Kehoe, T.; Torres, C.M.S.; Chen, G.; Nelson, K.A. Direct measurement of room-temperature nondiffusive thermal transport over micron distances in a silicon membrane. Phys. Rev. Lett. 2013, 110, 025901. [Google Scholar] [CrossRef] [PubMed]
- Li, Q.; Liu, F.; Hu, S.; Song, H.; Yang, S.; Jiang, H.; Wang, T.; Koh, Y.K.; Zhao, C.; Kang, F.; et al. Inelastic phonon transport across atomically sharp metal/semiconductor interfaces. Nat. Commun. 2022, 13, 4901. [Google Scholar] [CrossRef] [PubMed]
- Qi, R.; Shi, R.; Li, Y.; Sun, Y.; Wu, M.; Li, N.; Du, J.; Liu, K.; Chen, C.; Chen, J.; et al. Measuring phonon dispersion at an interface. Nature 2021, 599, 399–403. [Google Scholar] [CrossRef] [PubMed]
- Regner, K.T.; Sellan, D.P.; Su, Z.; Amon, C.H.; McGaughey, A.J.; Malen, J.A. Broadband phonon mean free path contributions to thermal conductivity measured using frequency domain thermoreflectance. Nat. Commun. 2013, 4, 1640. [Google Scholar] [CrossRef] [PubMed]
- Minnich, A.J.; Johnson, J.A.; Schmidt, A.J.; Esfarjani, K.; Dresselhaus, M.S.; Nelson, K.A.; Chen, G. Thermal conductivity spectroscopy technique to measure phonon mean free paths. Phys. Rev. Lett. 2011, 107, 095901. [Google Scholar] [CrossRef]
- Yang, F.; Dames, C. Mean free path spectra as a tool to understand thermal conductivity in bulk and nanostructures. Phys. Rev. B 2013, 87, 035437. [Google Scholar] [CrossRef]
- Minnich, A.J. Determining phonon mean free paths from observations of quasiballistic thermal transport. Phys. Rev. Lett. 2012, 109, 205901. [Google Scholar] [CrossRef]
- Giri, A.; Gaskins, J.T.; Donovan, B.F.; Szwejkowski, C.; Warzoha, R.J.; Rodriguez, M.A.; Ihlefeld, J.; Hopkins, P.E. Mechanisms of nonequilibrium electron-phonon coupling and thermal conductance at interfaces. J. Appl. Phys. 2015, 117, 105105. [Google Scholar] [CrossRef]
- Groeneveld, R.H.; Sprik, R.; Lagendijk, A. Effect of a nonthermal electron distribution on the electron-phonon energy relaxation process in noble metals. Phys. Rev. B 1992, 45, 5079. [Google Scholar] [CrossRef]
- Thomsen, C.; Strait, J.; Vardeny, Z.; Maris, H.J.; Tauc, J.; Hauser, J. Coherent phonon generation and detection by picosecond light pulses. Phys. Rev. Lett. 1984, 53, 989. [Google Scholar] [CrossRef]
- Stoner, R.; Maris, H. Kapitza conductance and heat flow between solids at temperatures from 50 to 300 K. Phys. Rev. B 1993, 48, 16373. [Google Scholar] [CrossRef] [PubMed]
- Cheng, Z.; Mu, F.; Ji, X.; You, T.; Xu, W.; Suga, T.; Ou, X.; Cahill, D.G.; Graham, S. Thermal visualization of buried interfaces enabled by ratio signal and steady-state heating of time-domain thermoreflectance. ACS Appl. Mater. Interfaces 2021, 13, 31843–31851. [Google Scholar] [CrossRef] [PubMed]
- Poopakdee, N.; Abdallah, Z.; Pomeroy, J.W.; Kuball, M. In situ thermoreflectance characterization of thermal resistance in multilayer electronics packaging. ACS Appl. Electron. Mater. 2022, 4, 1558–1566. [Google Scholar] [CrossRef]
- Jiang, P.; Qian, X.; Yang, R. Tutorial: Time-domain thermoreflectance (TDTR) for thermal property characterization of bulk and thin film materials. J. Appl. Phys. 2018, 124, 161103. [Google Scholar] [CrossRef]
- Stevens, R.J.; Smith, A.N.; Norris, P.M. Measurement of thermal boundary conductance of a series of metal-dielectric interfaces by the transient thermoreflectance technique. J. Heat Transf. 2005, 127, 315–322. [Google Scholar] [CrossRef]
- Antonelli, G.A.; Perrin, B.; Daly, B.C.; Cahill, D.G. Characterization of mechanical and thermal properties using ultrafast optical metrology. MRS Bull. 2006, 31, 607–613. [Google Scholar] [CrossRef]
- Calizo, I.; Balandin, A.A.; Bao, W.; Miao, F.; Lau, C. Temperature dependence of the Raman spectra of graphene and graphene multilayers. Nano Lett. 2007, 7, 2645–2649. [Google Scholar] [CrossRef]
- Xiaoduan, T.; Shen, X.; Jingchao, Z.; Xinwei, W. Five Orders of Magnitude Reduction in Energy Coupling across Corrugated Graphene/Substrate Interfaces. ACS Appl. Mater. Interfaces 2014, 6, 2809–2818. [Google Scholar]
- Hsu, I.K.; Kumar, R.; Bushmaker, A.; Cronin, S.B.; Pettes, M.T.; Shi, L.; Brintlinger, T.; Fuhrer, M.S.; Cumings, J. Optical measurement of thermal transport in suspended carbon nanotubes. Appl. Phys. Lett. 2008, 92, 063119. [Google Scholar] [CrossRef]
- Luckyanova, M.N.; Johnson, J.A.; Maznev, A.; Garg, J.; Jandl, A.; Bulsara, M.T.; Fitzgerald, E.A.; Nelson, K.A.; Chen, G. Anisotropy of the thermal conductivity in GaAs/AlAs superlattices. Nano Lett. 2013, 13, 3973–3977. [Google Scholar] [CrossRef]
- Chen, Z.; Jang, W.; Bao, W.; Lau, C.; Dames, C. Thermal contact resistance between graphene and silicon dioxide. Appl. Phys. Lett. 2009, 95, 161910. [Google Scholar] [CrossRef]
- Lee, S.M.; Cahill, D.G.; Venkatasubramanian, R. Thermal conductivity of Si–Ge superlattices. Appl. Phys. Lett. 1997, 70, 2957–2959. [Google Scholar] [CrossRef]
- Jin, Y.; Yadav, A.; Sun, K.; Sun, H.; Pipe, K.; Shtein, M. Thermal boundary resistance of copper phthalocyanine-metal interface. Appl. Phys. Lett. 2011, 98, 093305. [Google Scholar] [CrossRef]
- Trigo, M. Ultrafast Dynamics of Folded Acoustic Phonons from Semiconductor Superlattices. Ph.D. Thesis, DePaul University, Chicago, IL, USA, 2008. [Google Scholar]
- Highland, M.; Gundrum, B.; Koh, Y.K.; Averback, R.S.; Cahill, D.G.; Elarde, V.; Coleman, J.; Walko, D.; Landahl, E. Ballistic-phonon heat conduction at the nanoscale as revealed by time-resolved X-ray diffraction and time-domain thermoreflectance. Phys. Rev. B 2007, 76, 075337. [Google Scholar] [CrossRef]
- Lee, S.; Cavalieri, A.; Fritz, D.; Swan, M.; Hegde, R.; Reason, M.; Goldman, R.; Reis, D. Generation and propagation of a picosecond acoustic pulse at a buried interface: Time-resolved X-ray diffraction measurements. Phys. Rev. Lett. 2005, 95, 246104. [Google Scholar] [CrossRef] [PubMed]
- Jo, W.; Kee, J.; Kim, K.; Landahl, E.C.; Longbons, G.; Walko, D.A.; Wen, H.; Lee, D.R.; Lee, S. Structural measurement of electron-phonon coupling and electronic thermal transport across a metal-semiconductor interface. Sci. Rep. 2022, 12, 16606. [Google Scholar] [CrossRef] [PubMed]
- Nyby, C.; Sood, A.; Zalden, P.; Gabourie, A.J.; Muscher, P.; Rhodes, D.; Mannebach, E.; Corbett, J.; Mehta, A.; Pop, E.; et al. Visualizing Energy Transfer at Buried Interfaces in Layered Materials Using Picosecond X-Rays. Adv. Funct. Mater. 2020, 30, 2002282. [Google Scholar] [CrossRef]
- Clark, J.N.; Beitra, L.; Xiong, G.; Fritz, D.M.; Lemke, H.T.; Zhu, D.; Chollet, M.; Williams, G.J.; Messerschmidt, M.M.; Abbey, B.; et al. Imaging transient melting of a nanocrystal using an X-ray laser. Proc. Natl. Acad. Sci. USA 2015, 112, 7444–7448. [Google Scholar] [CrossRef]
- Lee, H.J.; Ahn, Y.; Marks, S.D.; Sri Gyan, D.; Landahl, E.C.; Lee, J.Y.; Kim, T.Y.; Unithrattil, S.; Chun, S.H.; Kim, S.; et al. Subpicosecond Optical Stress Generation in Multiferroic BiFeO3. Nano Lett. 2022, 22, 4294–4300. [Google Scholar] [CrossRef]
- Jo, W.; Landahl, E.C.; DiChiara, A.D.; Walko, D.A.; Lee, S. Measuring femtometer lattice displacements driven by free carrier diffusion in a polycrystalline semiconductor using time-resolved x-ray scattering. Appl. Phys. Lett. 2018, 113, 032107. [Google Scholar] [CrossRef]
- Lee, S.; Williams, G.J.; Campana, M.I.; Walko, D.A.; Landahl, E.C. Picosecond X-ray strain rosette reveals direct laser excitation of coherent transverse acoustic phonons. Sci. Rep. 2016, 6, 19140. [Google Scholar] [CrossRef] [PubMed]
- Williams, G.J.; Lee, S.; Walko, D.A.; Watson, M.A.; Jo, W.; Lee, D.R.; Landahl, E.C. Direct measurements of multi-photon induced nonlinear lattice dynamics in semiconductors via time-resolved X-ray scattering. Sci. Rep. 2016, 6, 39506. [Google Scholar] [CrossRef] [PubMed]
- Gorfien, M.; Wang, H.; Chen, L.; Rahmani, H.; Yu, J.; Zhu, P.; Chen, J.; Wang, X.; Zhao, J.; Cao, J. Nanoscale thermal transport across an GaAs/AlGaAs heterostructure interface. Struct. Dyn. 2020, 7, 025101. [Google Scholar] [CrossRef] [PubMed]
- Vitiello, M.S.; Scamarcio, G.; Spagnolo, V. Temperature dependence of thermal conductivity and boundary resistance in THz quantum cascade lasers. IEEE J. Sel. Top. Quantum Electron. 2008, 14, 431–435. [Google Scholar] [CrossRef]
- Sheu, Y.M.; Lee, S.; Wahlstrand, J.; Walko, D.; Landahl, E.; Arms, D.; Reason, M.; Goldman, R.; Reis, D. Thermal transport in a semiconductor heterostructure measured by time-resolved x-ray diffraction. Phys. Rev. B 2008, 78, 045317. [Google Scholar] [CrossRef]
- Lee, S.; Jo, W.; DiChiara, A.D.; Holmes, T.P.; Santowski, S.; Cho, Y.C.; Landahl, E.C. Probing electronic strain generation by separated electron-hole pairs using time-resolved x-ray scattering. Appl. Sci. 2019, 9, 4788. [Google Scholar] [CrossRef]
- Szymański, M. Calculation of the cross-plane thermal conductivity of a quantum cascade laser active region. J. Phys. Appl. Phys. 2011, 44, 085101. [Google Scholar] [CrossRef]
- Adachi, S. Physical Properties of III-V Semiconductor Compounds; John Wiley & Sons: Hoboken, NJ, USA, 1992. [Google Scholar]
- Goldberg, Y.A. ALUMINIUM GALLIUM ARSENIDE (Al; c Ga1_xAs). In Handbook Series On Semiconductor Parameters, Vol. 2: Ternary And Quaternary Iii-v Compounds; World Scientific Publishing Co. Pte. Ltd.: Singapore, 1996; Volume 43, p. 1. [Google Scholar]
- Adachi, S. Properties of Aluminium Gallium Arsenide; Number 7, INSPEC, The Institute of Electrical Engineers: London, UK, 1993. [Google Scholar]
- Xian, Y.; Zhang, P.; Zhai, S.; Yuan, P.; Yang, D. Experimental characterization methods for thermal contact resistance: A review. Appl. Therm. Eng. 2018, 130, 1530–1548. [Google Scholar] [CrossRef]
- Li, X.; Luo, R.; Zhang, W.; Liao, H. Method for measuring thermal contact resistance of graphite thin film materials. Measurement 2016, 93, 202–207. [Google Scholar] [CrossRef]
Disclaimer/Publisher’s Note: The statements, opinions and data contained in all publications are solely those of the individual author(s) and contributor(s) and not of MDPI and/or the editor(s). MDPI and/or the editor(s) disclaim responsibility for any injury to people or property resulting from any ideas, methods, instructions or products referred to in the content. |
© 2023 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/).
Share and Cite
Lee, J.; Jo, W.; Kwon, J.-H.; Griffin, B.; Cho, B.-G.; Landahl, E.C.; Lee, S. Time-Resolved Structural Measurement of Thermal Resistance across a Buried Semiconductor Heterostructure Interface. Materials 2023, 16, 7450. https://doi.org/10.3390/ma16237450
Lee J, Jo W, Kwon J-H, Griffin B, Cho B-G, Landahl EC, Lee S. Time-Resolved Structural Measurement of Thermal Resistance across a Buried Semiconductor Heterostructure Interface. Materials. 2023; 16(23):7450. https://doi.org/10.3390/ma16237450
Chicago/Turabian StyleLee, Joohyun, Wonhyuk Jo, Ji-Hwan Kwon, Bruce Griffin, Byeong-Gwan Cho, Eric C. Landahl, and Sooheyong Lee. 2023. "Time-Resolved Structural Measurement of Thermal Resistance across a Buried Semiconductor Heterostructure Interface" Materials 16, no. 23: 7450. https://doi.org/10.3390/ma16237450