Eliminating Cu–Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper
Abstract
:1. Introduction
2. Experiment
2.1. Cu Film Electrodeposition
2.2. Sample Pretreatment
2.3. Bonding Process
2.4. Analysis Methods
3. Results and Discussion
3.1. Surface Roughness and Crystallographic Information of Cu Films
3.2. Effect of Grain Boundary Energy on Bonding Interfaces
4. Conclusions
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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Lu, T.-F.; Cheng, Y.-F.; Wang, P.-W.; Yen, Y.-T.; Wu, Y.S. Eliminating Cu–Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper. Materials 2024, 17, 3467. https://doi.org/10.3390/ma17143467
Lu T-F, Cheng Y-F, Wang P-W, Yen Y-T, Wu YS. Eliminating Cu–Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper. Materials. 2024; 17(14):3467. https://doi.org/10.3390/ma17143467
Chicago/Turabian StyleLu, Tsan-Feng, Yuan-Fu Cheng, Pei-Wen Wang, Yu-Ting Yen, and YewChung Sermon Wu. 2024. "Eliminating Cu–Cu Bonding Interfaces Using Electroplated Copper and (111)-Oriented Nanotwinned Copper" Materials 17, no. 14: 3467. https://doi.org/10.3390/ma17143467