Liu, X.; Pei, W.; Zhao, J.; Xu, R.; Zhong, Y.; Yu, D.
A Review of Wafer-Level Packaging Technology for SAW and BAW Filters. Micromachines 2025, 16, 320.
https://doi.org/10.3390/mi16030320
AMA Style
Liu X, Pei W, Zhao J, Xu R, Zhong Y, Yu D.
A Review of Wafer-Level Packaging Technology for SAW and BAW Filters. Micromachines. 2025; 16(3):320.
https://doi.org/10.3390/mi16030320
Chicago/Turabian Style
Liu, Xinyue, Wenjiao Pei, Jin Zhao, Rongbin Xu, Yi Zhong, and Daquan Yu.
2025. "A Review of Wafer-Level Packaging Technology for SAW and BAW Filters" Micromachines 16, no. 3: 320.
https://doi.org/10.3390/mi16030320
APA Style
Liu, X., Pei, W., Zhao, J., Xu, R., Zhong, Y., & Yu, D.
(2025). A Review of Wafer-Level Packaging Technology for SAW and BAW Filters. Micromachines, 16(3), 320.
https://doi.org/10.3390/mi16030320