Lai, J.-P.; Lin, S.; Lin, V.; Kang, A.; Wang, Y.-P.; Pai, P.-F.
Predicting Thermal Resistance of Packaging Design by Machine Learning Models. Micromachines 2025, 16, 350.
https://doi.org/10.3390/mi16030350
AMA Style
Lai J-P, Lin S, Lin V, Kang A, Wang Y-P, Pai P-F.
Predicting Thermal Resistance of Packaging Design by Machine Learning Models. Micromachines. 2025; 16(3):350.
https://doi.org/10.3390/mi16030350
Chicago/Turabian Style
Lai, Jung-Pin, Shane Lin, Vito Lin, Andrew Kang, Yu-Po Wang, and Ping-Feng Pai.
2025. "Predicting Thermal Resistance of Packaging Design by Machine Learning Models" Micromachines 16, no. 3: 350.
https://doi.org/10.3390/mi16030350
APA Style
Lai, J.-P., Lin, S., Lin, V., Kang, A., Wang, Y.-P., & Pai, P.-F.
(2025). Predicting Thermal Resistance of Packaging Design by Machine Learning Models. Micromachines, 16(3), 350.
https://doi.org/10.3390/mi16030350