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Journal: Symmetry, 2023
Volume: 15
Number: 264

Article: Thermal-Stress Coupling Optimization for Coaxial through Silicon Via
Authors: by Dongdong Chen, Yintang Yang, Xianglong Wang, Di Li, Yi Liang and Changqing Xu
Link: https://www.mdpi.com/2073-8994/15/2/264

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