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Journal: Appl. Sci., 2021
Volume: 11
Number: 676

Article: Numerical Design and Laboratory Testing of Encapsulated PCM Panels for PCM-Air Heat Exchangers
Authors: by Thiago Santos, Luiz C. Wrobel, Nick Hopper and Maria Kolokotroni
Link: https://www.mdpi.com/2076-3417/11/2/676

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