Analysis of Wafer Warpage in Diamond Wire Saw Slicing Sapphire Crystal
Abstract
:1. Introduction
2. Theoretical Analyses
2.1. Heat Flux
2.2. Mathematical Model of the Temperature Field
3. Finite Element Modeling
3.1. Material
3.2. Modeling and Solution
3.3. Calculation of Wafer Warpage Based on Finite Element Method
4. Sawing Experiment
5. Results and Discussion
5.1. Analysis of Wafer Temperature Field and Thermal Deformation
5.2. Experimental Verification of Simulation Calculation Model for Wafer Warpage
5.3. Wafer Warpage under Different Processing Conditions
5.3.1. The Influence of Wafer Thickness on Warpage
5.3.2. The Influence of Diamond Wire Diameter on Wafer Warpage
5.3.3. The Influence of Sawing Process Parameters on Wafer Warpage
6. Conclusions
- (1)
- The temperature and deformation at the sawing position is the largest. As the cutting depth increases during sawing, the temperature of the wafer gradually increases and tends to stabilize.
- (2)
- The thickness of sapphire wafers cut by the diamond wire saw decreases, and the smaller the diameter of the diamond wire used, the greater the warpage of the cut wafers.
- (3)
- The sawing process parameters mainly affect the wafer warpage by influencing the heat density and power during sawing. The warpage of sapphire wafers increases with the increase of the saw wire speed and feed rate. How to achieve effective lubrication and cooling of a narrow kerf in sawing processing is the key to obtaining low warpage wafers.
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Conflicts of Interest
References
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Material Parameters | Value | Material Parameters | Value |
---|---|---|---|
Density/g·cm−3 | 3.95 | Thermal conductivity/W/(cm·K) | 132.5 |
Hardness (Moh’s)/GPa | 9 | Fracture toughness/MPa·m1/2 | 2.02 |
Volume modulus/GPa | 250 | Young modulus/GPa | 320~340 |
Poisson’s ratio | 0.28 | Thermal expansion coefficient/(×10−6·K−1) | 5.8 |
No. | Wire Speed Vs (m/min) | Feed Rate Vw (mm/min) |
---|---|---|
1 | 800 | 0.1 |
2 | 800 | 0.3 |
3 | 1200 | 0.1 |
4 | 1200 | 0.3 |
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Liu, Y.; Cheng, D.; Li, G.; Gao, Y. Analysis of Wafer Warpage in Diamond Wire Saw Slicing Sapphire Crystal. Appl. Sci. 2024, 14, 7667. https://doi.org/10.3390/app14177667
Liu Y, Cheng D, Li G, Gao Y. Analysis of Wafer Warpage in Diamond Wire Saw Slicing Sapphire Crystal. Applied Sciences. 2024; 14(17):7667. https://doi.org/10.3390/app14177667
Chicago/Turabian StyleLiu, Yihe, Dameng Cheng, Guanzheng Li, and Yufei Gao. 2024. "Analysis of Wafer Warpage in Diamond Wire Saw Slicing Sapphire Crystal" Applied Sciences 14, no. 17: 7667. https://doi.org/10.3390/app14177667