Development Status of Key Technologies for Optoelectronic Integrated Circuit Manufacturing
Abstract
:1. Introduction
2. Design of Optoelectronic Integrated Circuits
3. Manufacturing of Optoelectronic Integrated Circuits
3.1. Manufacturing Process
3.2. Integration Method
3.2.1. Monolithic Integration
3.2.2. Hybrid Integration
3.3. Optical Interconnect
4. Packaging of Optoelectronic Integrated Circuits
4.1. Monolithic Package
4.2. Optical Co-Package
5. Summary and Outlook
Author Contributions
Funding
Institutional Review Board Statement
Informed Consent Statement
Data Availability Statement
Acknowledgments
Conflicts of Interest
References
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Monolithic Integration | Hybrid Integration | |
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Features | Optoelectronic components can grow on substrate materials directly | Optoelectronic components can transfer to substrate materials |
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Disadvantages |
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Item | Advantages | Disadvantages |
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LiNbO3 |
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Silicon material on insulator |
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SiO2 |
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Si3N4 |
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Polymeric materials |
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III–V semiconductor materials |
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Liang, M.; Fang, J.; Chen, D.; Chen, L.; Peng, L.; Zhang, C.; Chen, Y.; Lu, X. Development Status of Key Technologies for Optoelectronic Integrated Circuit Manufacturing. Appl. Sci. 2024, 14, 8073. https://doi.org/10.3390/app14178073
Liang M, Fang J, Chen D, Chen L, Peng L, Zhang C, Chen Y, Lu X. Development Status of Key Technologies for Optoelectronic Integrated Circuit Manufacturing. Applied Sciences. 2024; 14(17):8073. https://doi.org/10.3390/app14178073
Chicago/Turabian StyleLiang, Mengjie, Ji Fang, Dunkui Chen, Lang Chen, Lingling Peng, Chi Zhang, Yingchun Chen, and Xiang Lu. 2024. "Development Status of Key Technologies for Optoelectronic Integrated Circuit Manufacturing" Applied Sciences 14, no. 17: 8073. https://doi.org/10.3390/app14178073