Multi-Variable Thermal Modeling of Power Devices Considering Mutual Coupling

Round 1

Reviewer 1 Report

 In the submitted paper, the authors deal with multi-variable thermal modelling of power devices. They describe the thermal models for the buck and boost converter systems,  that compare the junction temperatures considering the conduction coupling.  The multi-variable thermal resistances model incorporate the convection thermal coupling into the mutual thermal effects.  They compare the studied phenomenon by both computer simulation and experimental testing.

The research conducted by the authors is beneficial in terms of the development of many new electronic components and devices.  

From the point of view of the quality of the article, however, I recommend adding a more detailed description of the thermal model and simulations that the authors performed.   

I miss a detailed description of FEM simulation settings in the text:

- What were the initial and boundary conditions chosen?

- What numerical method was used to solve the studied model?

- What was the meshing method used?

- How was mesh quality used?

- What was the mesh type used?

- What software was used for computer simulations?

 

The other suggestions for the minor revision: 

 - line 13: The first sentence of the abstract is too long and therefore difficult to understand. I recommend changing (simplifying) its formulation.

- line 97:  The title of Section 2 (2. Thermal in Buck and Boost Converter Systems) is not clear. There is a missing word after the word Thermal. (There could be no example of Thermal Models in Buck and Boost Converter).

 

- lines 93 – 96: Section numbering in the sentences of the last paragraph of the introduction does not correspond to the section numbering in the following text. Roman numerals should be replaced by Arabic numerals (ie Section 2 instead of Section II, Section 3 instead of Section III, etc.).

 

- lines 55, 69, etc.: The figure labels should be indented from the surrounding text.

Author Response

Please see the attachment.

Thanks.

Author Response File: Author Response.pdf

Reviewer 2 Report

This paper presented thermal models for converter systems to compare the junction temperatures considering the different couplings. The main contribution of the paper is on multi-variable thermal resistances model and validation with the experimental result. The topic and the proposed model is interesting but the writing style is more like a thesis rather than the paper. 

The current introduction section is more focused on elaborating the problem. The authors should review the pertinent published literature with logically linked paragraphs to clarify the lack and novelty of the research. And in the last paragraph, explain how each section related to each other and necessary for the completeness of paper.

I would recommend providing a clear statement of the rationale for an approach to the problem studied and clearly state the purpose and hypothesis that authors investigated. The current format with lots of sections make it complicated to follow the procedure and final conclusion.

I recommend that this paper not be accepted without major revision on the structure of the presentation.

Author Response

Please see the attachment.

Thanks.

Author Response File: Author Response.pdf

Round 2

Reviewer 1 Report

The authors accepted my previous comments. But I suggest the minor revision as follows:

1) Page 4, line 129: The sentence „The values of ΔTj decrease with …”  is not clear.

2) Page 7, line 164: The formatting of symbol Tc is incorrect. (There should be T_c)

Author Response

Thank you so much for the valuable comments. As suggested, we have revised our manuscript. We have sought to address the technical issues raised below.   

1) Page 4, line 129: The sentence "The values of ΔTj decrease with …”  is not clear.

Response 1: We have corrected this as follows:

The value of ΔT_j decreases with smaller operating current (by increasing loading resistance). In other words, the bigger thermal coupling effect will be induced by a larger current passing through MOSFET and the diode, and vice versa.

 

2) Page 7, line 164: The formatting of symbol Tc is incorrect. (There should be T_c)

Response 2: Thank you very much for pointing this out. We have amended it in the text.

Reviewer 2 Report

Thanks to authors for considering the comments. The manuscript is acceptable in current format.

Author Response

Thank you so much.