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Journal: Electronics, 2021
Volume: 10
Number: 1893

Article: Design and Implementation of RF Front-End Module Based on 3D Heterogenous-Integrated Wafer-Level Packaging
Authors: by Faxin Yu, Qi Zhou, Zhiyu Wang, Jiongjiong Mo and Hua Chen
Link: https://www.mdpi.com/2079-9292/10/16/1893

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